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Ironwood Electronics
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| Part No. |
PSX96B-133PQ160 PSX160-PQ240 PSX160-50MQ240 PSX96B-50PQ160 PSX96B-PQ160 PSX96B-100PQ160 PSX160-50PB272 PSX128B-133PQ208 PSX160-100PQ240 PSX96B-50MQ160
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| Description |
-100V Single P-Channel HEXFET Power MOSFET in a TO-262 package; Similar to IRF9540NL with Lead-Free packaging
User Programmable Special Function ASIC
-100V Single P-Channel HEXFET Power MOSFET in a D-Pak package; A IRFR9120N with Standard packaging
-100V Single P-Channel HEXFET Power MOSFET in a D-Pak package; Similar to IRFR9120N with Lead Free packaging 用户可编程ASIC的特殊功
-12V Single P-Channel HEXFET Power MOSFET in a SO-8 package; Similar to IRF7420 with Lead Free packaging 用户可编程ASIC的特殊功
-150V Single P-Channel HEXFET Power MOSFET in a I-Pak package; Similar to IRFU6215 with Lead Free packaging 用户可编程ASIC的特殊功
-12V Single P-Channel HEXFET Power MOSFET in a SO-8 package; Similar to IRF7410 with Lead-Free packaging. 用户可编程ASIC的特殊功
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| File Size |
1,769.80K /
48 Page |
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Vishay Intertechnology,Inc.
Vishay Intertechnology, Inc.
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| Part No. |
PL342 PL34120191000GDDC PL34120191000KKEX PL34120191000KXDD PL34120191000KXDF PL34120191000GDBX PL34120191000GDDD PL34120191000CFDG PL34120191000MDEG PL34120191000MDBG PL34120191000MHDG PL34120191000MFDG PL34120191000MJDG PL34120191000CFBG PL34120191000CFEG PL34120191000DFDG PL34120191000DFEG PL34120191000MFEG PL34120191000MJBG PL34120191000MHEG PL34120191000MHBG PL34120191000MDDG PL34120191000MFBG PL34120191000GFBC PL34220191000CFBG PL34120191000DHDX PL34120191000DHEX PL34220191000DHBX PL34220191000DHDX PL34220191000DHEX PL34120191000DHBX PL34120191000DHBD PL34120191000DHBC PL34220191000DKBC PL34220191000DJBC PL34220191000BJBC PL34120191000DJBG PL34220191000CXBG PL34220191000FHBG PL34220191000DXBC PL34220191000BHBC PL34120191000DKBG PL34220191000CFBC PL34120191000DXBG PL34220191000CJBC PL34120191000CJBG PL34120191000FHBG PL34220191000CJBG PL34220191000BKBG PL34220191000DHBG PL34120191000CXBG PL34120191000DHBG PL34220191000BHBG PL34220191000BXBG PL34220191000DJBG PL34220191000DXBG PL34220191000FJBG PL34220191000BJBG PL34220191000CDBC PL34220191000CXBC PL34220191000DHBC PL34220191000DKBG PL34120191000MDBD PL34120191000MDBC PL34120191000MDBF PL34120191000MDBX PL34120191000DHEF PL3412
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| Description |
High Sensitivity Chip Sensors Sideview Type; Type: Sideview Resin; Peak sensitivity wavelength P (nm): 800; Viewing angle 1/2 (deg): ±14; Dark
Infrared Light Emitting Diodes Top View Type; Type: Surface Mount Type (Sideview); Peak light emitting wavelength P (nm): 950; Half viewing angle
Infrared Light Emitting Diodes Top View Type; Type: Sideview Resin; Peak light emitting wavelength P (nm): 950; Half viewing angle 1/2 (deg): ±
High Sensitivity Chip Sensors Sideview Type; Type: Sideview Resin; Peak sensitivity wavelength P (nm): 800; Viewing angle 1/2 (deg): ±32; Dark
Printheads for packaging High-Speed Printers; Resolutions (dpi): 203; Print width (mm): 56; Resistance tolerance (O): 550; Platen diameter (max.)(f): 50; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Distribution or Food Labels; Resolutions (dpi): 203; Print width (mm): 112; Resistance tolerance (O): 550; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Fast Recovery Diodes; Mounting style: Leaded type; Package size: 3.0x2.5(t=2.5); Number of terminal: 2; Reverse voltage VR(V): 200; Average rectified forward current IO(A): 1;
Schottky Barrier Diodes; Package: TO220FN; Constitution materials list: Packing style: Bulk; Package quantity: 500;
Printheads for Distribution or Food Labels; Resolutions (dpi): 300; Print width (mm): 108.4; Resistance tolerance (O): 850; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 250; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Distribution or Food Labels; Resolutions (dpi): 300; Print width (mm): 81.3; Resistance tolerance (O): 850; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 250; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Distribution or Food Labels; Resolutions (dpi): 203; Print width (mm): 56; Resistance tolerance (O): 550; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Distribution or Food Labels; Resolutions (dpi): 300; Print width (mm): 54.2; Resistance tolerance (O): 850; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 250; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Fast Recovery Diodes; Mounting style: Surface mount; Package size: 2.6x1.6(t=0.8); Number of terminal: 2; Reverse voltage VR(V): 200; Average rectified forward current IO(A): 0.7;
Fast Recovery Diodes; Mounting style: Surface mount; Package size: 1.9x1.3(t=0.6); Number of terminal: 2; Reverse voltage VR(V): 100; Average rectified forward current IO(A): 0.5;
Printheads for packaging High-Speed Printers; Resolutions (dpi): 300; Print width (mm): 54.2; Resistance tolerance (O): 850; Platen diameter (max.)(f): 50; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for packaging High-Speed Printers; Resolutions (dpi): 203; Print width (mm): 112; Resistance tolerance (O): 550; Platen diameter (max.)(f): 50; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for packaging High-Speed Printers; Resolutions (dpi): 300; Print width (mm): 108.4; Resistance tolerance (O): 850; Platen diameter (max.)(f): 50; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
High Sensitivity Chip Sensors Sideview Type; Type: Surface Mount Type; Peak sensitivity wavelength P (nm): 800; Viewing angle 1/2 (deg): ±12; Dark current ICEO (Max.)(µA): 0.5; Response time tr·tf (µA): 10; Yes;
Reflective Type Photosensors (Photoreflectors); Type: Cased Type; Light Emitting Diode: 630; Phototransistor: 600; Collector current IC (Min.)(mA): 0.08; Response time tr·tf (µs): 10;
Photointerrupter General Type; Packing style: Plastic bag; Package quantity: 400; 塑料无引线芯片载
Plastic Leadless Chip Carrier 塑料无引线芯片载
Printheads for Distribution or Food Labels; Resolutions (dpi): 203; Print width (mm): 80; Resistance tolerance (O): 550; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24; 塑料无引线芯片载
Lead Frame Remote Control Receiver Modules (5V Type); Packing style: Stick; Package quantity: 1000; 塑料无引线芯片载
660/780nm Dual Wave Low Power Lasers; Packing style: Tray; Package quantity: 500; 塑料无引线芯片载
Fast Recovery Diodes; Mounting style: Leaded type; Package size: 15x10(t=4.5); Number of terminal: 3; Reverse voltage VR(V): 200; Average rectified forward current IO(A): 20; 塑料无引线芯片载
Fast Recovery Diodes; Mounting style: Leaded type; Package size: 15x10(t=4.5); Number of terminal: 3; Reverse voltage VR(V): 400; Average rectified forward current IO(A): 20; 塑料无引线芯片载
Fast Recovery Diodes; Mounting style: Surface mount; Package size: 5.5x6.5(t=2.3); Number of terminal: 3; Reverse voltage VR(V): 200; Average rectified forward current IO(A): 6;
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| File Size |
127.83K /
2 Page |
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it Online |
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Toshiba, Corp.
Electronic Theatre Controls, Inc.
ITT, Corp.
ATM Electronic, Corp.
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| Part No. |
AM29824DM AM29826DM AM29822DM AM29822LMB AM29822DMB AM29826PCB AM29826XC
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| Description |
9-Bit D-Type Flip-Flop
Reference Design kit for the iP1206 a 300kHz, 30A Synchronous Buck Converter; A IRDCIP1206-B with Standard packaging
Intelligent Power Module. Gate Driver IC integrated with a half bridge FredFET Designed for sub 250W Motor Drive applications in a 9-Lead SIP. RDSon of 1.0 Ohm; A IR3101 with Standard packaging 10位D型触发器
IR1150 Demo Board designed for use in continuous conduction mode boost converter applications for power factor correction and harmonic current reduction.; A IRAC1150-300W with Standard packaging 10位D型触发器
Octal D-Type Flip-Flop 八路D类触发器
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| File Size |
228.72K /
8 Page |
View
it Online |
Download Datasheet |
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Panduit, Corp.
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| Part No. |
PN18-6F-C PN14-10F-C PN14-6F-C PV14-10F-C PN22-4F-C
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| Description |
Fork Tongue Solderless Terminal; Wire Size (AWG):22-18; Stud Size:#6; Insulator Color:Red; Pack quantity:100 COPPER ALLOY, TIN FINISH, FORK TERMINAL
Fork Tongue Solderless Terminal; Wire Size (AWG):16-14; Stud Size:#10; Insulator Color:Blue; Pack quantity:100 COPPER ALLOY, TIN FINISH, FORK TERMINAL
Fork Tongue Solderless Terminal; Wire Size (AWG):16-14; Stud Size:#6; Insulator Color:Blue; Pack quantity:100 COPPER ALLOY, TIN FINISH, FORK TERMINAL
Fork Tongue Solderless Terminal; Wire Size (AWG):26-22; Stud Size:#4; Insulator Color:Yellow; Pack quantity:100 COPPER ALLOY, TIN FINISH, FORK TERMINAL
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| File Size |
1,440.37K /
1 Page |
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it Online |
Download Datasheet |
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Bourns, Inc.
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| Part No. |
PSCIA3CHP PSCIA1CHP PSCIA2CHP
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| Description |
400V 2 Form A Photo Voltaic Relay in a 8-pin DIP Package; A PVT422 with Standard packaging
250V 1 Form A Photo Voltaic Relay in a 6-pin DIP Package; Similar to PVT312L with lead free packaging.
300V 1 Form A Photo Voltaic Relay in a mod. 8-pin DIP Package; Similar to PVA3324N with Lead Free packaging 晶体管|场效应| P通道| 15mA的我（直）|芯片
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| File Size |
102.78K /
3 Page |
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it Online |
Download Datasheet |
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Panduit, Corp.
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| Part No. |
DNF18-250-C DNF14-250-C
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| Description |
Female Disconnect Solderless Terminal; Wire Size (AWG):22-18; Tab Width:0.250"; Insulator Color:Red; Pack quantity:100 RoHS Compliant: Yes PUSH-ON TERMINAL
Female Disconnect Solderless Terminal; Wire Size (AWG):16-14; Tab Width:0.250"; Insulator Color:Blue; Pack quantity:100 RoHS Compliant: Yes PUSH-ON TERMINAL
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| File Size |
43.37K /
1 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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