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Infineon
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Part No. |
SIDC161D170H
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OCR Text |
... suitable f or epoxy and soft solder die bonding die bond electrically conductive glue or solder wire bond al, 500m reject ink dot size ? 0.65mm; max 1.2mm recommended storage environment store in original container, in... |
Description |
Diodes - HV Chips - SIDC161D170H, 1700V, 300A
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File Size |
59.98K /
4 Page |
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it Online |
Download Datasheet
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Infineon
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Part No. |
SIDC42D120E6
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OCR Text |
...m suitable for epoxy and soft solder die bonding die bond electrically conductive glue or solder wire bond al, 500m reject ink dot size ? 0.65mm ; max 1.2mm recommended storage environment store in original container, i... |
Description |
Diodes - HV Chips - SIDC42D120E6, 1200V,50A
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File Size |
275.44K /
4 Page |
View
it Online |
Download Datasheet
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Infineon
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Part No. |
SIDC42D120F6
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OCR Text |
...m suitable for epoxy and soft solder die bonding die bond electrically conductive glue or solder wire bond al, 500m reject ink dot size ? 0.65mm ; max 1.2mm recommended storage environment store in original container, i... |
Description |
Diodes - HV Chips - SIDC42D120F6, 1200V, 50A
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File Size |
275.34K /
4 Page |
View
it Online |
Download Datasheet
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Infineon
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Part No. |
SIDC42D120H6
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OCR Text |
...m suitable for epoxy and soft solder die bonding die bond electrically conductive glue or solder wire bond al, 500m reject ink dot size ? 0.65mm ; max 1.2mm recommended storage environment store in original container, i... |
Description |
Diodes - HV Chips - SIDC42D120H6, 1200V, 75A
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File Size |
275.33K /
4 Page |
View
it Online |
Download Datasheet
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Infineon
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Part No. |
SIDC06D60AC6
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OCR Text |
...tem suitable for epoxy and soft solder die bonding electrically conductive glue or solder Al, 500m 0.65mm; max 1.2mm store in original cont...bond configuration)
Symbol VRRM IF I FSM IFRM Tj , Ts t g
Condition
Value 600
1)
Unit V... |
Description |
Used for IGBT3
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File Size |
59.64K /
4 Page |
View
it Online |
Download Datasheet
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Infineon
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Part No. |
SIDC03D120F6
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OCR Text |
...m suitable for epoxy and soft solder die bonding die bond electrically conductive glue or solder wire bond al, 500m reject ink dot size ? 0.65mm ; max 1.2mm recommended storage environment store in original container, i... |
Description |
Diodes - HV Chips - SIDC03D120F6,1200V, 2A
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File Size |
67.74K /
4 Page |
View
it Online |
Download Datasheet
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Infineon
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Part No. |
SIDC05D60C6
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OCR Text |
...tem suitable for epoxy and soft solder die bonding electrically conductive glue or solder Al, 500m 0.65mm; max 1.2mm store in original cont...bond configuration)
Symbol VRRM IF I F SM IFRM Tj , Ts t g
Condition
Value 600
1)
Unit ... |
Description |
Used for IGBT3
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File Size |
61.21K /
4 Page |
View
it Online |
Download Datasheet
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Infineon
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Part No. |
SIDC03D60C6
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OCR Text |
...tem suitable for epoxy and soft solder die bonding electrically conductive glue or solder Al, 500m 0.65mm; max 1.2mm store in original cont...bond configuration)
Symbol VRRM IF I FSM IFRM Tj , Ts t g
Condition
Value 600
1)
Unit V... |
Description |
Used for IGBT3
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File Size |
63.93K /
4 Page |
View
it Online |
Download Datasheet
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Infineon
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Part No. |
SIDC02D60C6
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OCR Text |
...tem suitable for epoxy and soft solder die bonding electrically conductive glue or solder Al, 500m 0.65mm; max 1.2mm store in original cont...bond configuration)
Symbol VRRM IF I F SM IFRM Tj , Ts t g
Condition
Value 600
1)
Unit ... |
Description |
Used for IGBT3
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File Size |
62.97K /
4 Page |
View
it Online |
Download Datasheet
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Infineon
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Part No. |
SIDC14D60C6
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OCR Text |
...tem suitable for epoxy and soft solder die bonding electrically conductive glue or solder Al, 500m 0.65mm; max 1.2mm store in original cont...bond configuration)
Symbol VRRM IF I FSM IFRM Tj , Ts t g
Condition
Value 600
1)
Unit V... |
Description |
Used for IGBT3
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File Size |
59.20K /
4 Page |
View
it Online |
Download Datasheet
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Price and Availability
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