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Fairchild Semiconductor Corporation FAIRCHILD[Fairchild Semiconductor]
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Part No. |
FM51S3 FM51
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OCR Text |
...n then be dipped into a bath or screwed into a threaded hole in a tank. As with any IC, the FM51 and accompanying wiring and circuits must be kept insulated and dry to avoid leak1ge and corrosion. This is especially true if the circuit may ... |
Description |
Low Voltage High Drive Temperature Sensor From old datasheet system
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File Size |
45.96K /
6 Page |
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it Online |
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Sumitomo Electric Industries, Ltd. EUDYNA[Eudyna Devices Inc]
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Part No. |
P02221B2P KP035J
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OCR Text |
...(pin 4) as possible. The PCB is screwed on the mounting plate or the heat sink to lower the thermal resistance of the PCB. Lay out a large ground pad area with multiple plated thru holes around pin 4 of the device. The required matching and... |
Description |
500mW InGaP HBT Amplifier 500mW的InGaP HBT宽频放大
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File Size |
186.70K /
6 Page |
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it Online |
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HITACHI[Hitachi Semiconductor]
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Part No. |
PF0031
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OCR Text |
... possible. The module should be screwed up before lead soldering. It should not be given mechanical and thermal stress to lead and flange of the module. When the external parts (Isolator, Duplexer, etc.) of the module are changed, the elect... |
Description |
MOS FET Power Amplifier Module for Mobile Phone
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File Size |
52.29K /
13 Page |
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it Online |
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MITSUBISHI[Mitsubishi Electric Semiconductor]
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Part No. |
RA07H0608M_06 RA07H0608M RA07H0608M-101 RA07H0608M06
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OCR Text |
... sink. The module must first be screwed to the heat sink, then the leads can be soldered to the printed circuit board. M3 screws are recommended with a tightening torque of 0.4 to 0.6 Nm. Soldering and Defluxing: This module is designed for... |
Description |
RoHS Compliance ,68-88MHz 7W 12.5V, 2 Stage Amp. For PORTABLE RADIO
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File Size |
93.26K /
8 Page |
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it Online |
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MITSUBISHI[Mitsubishi Electric Semiconductor]
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Part No. |
RA07H3340M_06 RA07H3340M RA07H3340M-101 RA07H3340M06
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OCR Text |
... sink. The module must first be screwed to the heat sink, then the leads can be soldered to the printed circuit board. M3 screws are recommended with a tightening torque of 0.4 to 0.6 Nm. Soldering and Defluxing: This module is designed for... |
Description |
RoHS Compliance ,330-400MHz 7W 12.5V, 2 Stage Amp. For PORTABLE RADIO
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File Size |
92.03K /
8 Page |
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it Online |
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MITSUBISHI[Mitsubishi Electric Semiconductor]
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Part No. |
RA07M0608M-101 RA07M0608M
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OCR Text |
... sink. The module must first be screwed to the heat sink, then the leads can be soldered to the printed circuit board. M3 screws are recommended with a tightening torque of 0.4 to 0.6 Nm. Soldering and Defluxing: This module is designed for... |
Description |
RoHS Compliance ,66-88MHz 7W 7.2V, 2 Stage Amp. For PORTABLE RADIO
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File Size |
95.38K /
8 Page |
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it Online |
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Price and Availability
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