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    TLOH9204

Toshiba Semiconductor
Part No. TLOH9204
OCR Text ...low. * The recommended standard mounting surface for this LED is the shaded area shown in Figure 2 below. Figure 1 Figure 2 Device appearance: Since this device is cast in resin, air bubbles, cracks, etc. may occur due to variation...
Description ORANGE LIGHT EMISSION AF auxiliary light source for digital still cameras

File Size 245.08K  /  10 Page

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    TLOH9203

Toshiba Semiconductor
Part No. TLOH9203
OCR Text ...low. * The recommended standard mounting surface for this LED is the shaded area shown in Figure 2 below. figure 1 figure 2 Device appearance: Since this device is cast in resin, air bubbles, cracks, etc. may occur due to variation...
Description InGaAlP ORANGE LIGHT EMISSION AF auxiliary light source for digital still cameras

File Size 216.95K  /  10 Page

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    PBW30F PBW15F PBW15F-15 PBW15F-12 PBW50F-12 PBW50F-5 PBW50F-15

RSG Electronic Components GmbH
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RSG Electronic Components G...
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RSG Electronic Componen...
Part No. PBW30F PBW15F PBW15F-15 PBW15F-12 PBW50F-12 PBW50F-5 PBW50F-15
OCR Text ... is optional 2.5 point a:c102 mounting hole 2-m3 mounting hole 2-m3 -v ac(n) ac(l) fg com +v cover name plate cover (option) name plate m3 terminal cover 5 18 31 34.5 34.5 78 36.5 85 70.5 12.2 1.5 18 31 0.5 60 0.5 11.5 9.5 7.5 16.5 2 ...
Description AC-DC Power Supplies Enclosed type

File Size 260.40K  /  6 Page

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    TLGTE1100B TLEGE1100B TLBE1100B

Toshiba Semiconductor
Part No. TLGTE1100B TLEGE1100B TLBE1100B
OCR Text ...hange, then leads to trouble in mounting. Furthermore, prevent the devices from being destructed against static electricity for baking of it. 5. If the packing material of laminate would be broken, the hermeticity would deteriorate. Therefo...
Description Panel Circuit Indicator 面板电路指标

File Size 220.62K  /  10 Page

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    TLEGD1100B TLBD1100B

Toshiba Semiconductor
Part No. TLEGD1100B TLBD1100B
OCR Text ...hange, then leads to trouble in mounting. Furthermore, prevent the devices from being destructed against static electricity for baking of it. 5. If the packing material of laminate would be broken, the hermeticity would deteriorate. Therefo...
Description Panel Circuit Indicator

File Size 231.25K  /  9 Page

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    PBSS5260PAP

NXP Semiconductors
Part No. PBSS5260PAP
OCR Text ... copper strip line, tin-plated, mounting pad for collector 1 cm 2 . [3] device mounted on 4-layer pcb 35 m copper strip line, tin-plated and standard footprint. [4] device mounted on 4-layer pcb 35 m copper strip line, tin-plated, mounting ...
Description 60 V, 2 A PNP/PNP low VCEsat (BISS) transistor

File Size 246.13K  /  17 Page

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    PBSS4360Z

NXP Semiconductors
Part No. PBSS4360Z
OCR Text ...ingle-sided copper, tin-plated, mounting pad for collector 1 cm 2 . [3] device mounted on an fr4 pcb, single-sided copper, tin-plated, mounting pad for collector 6 cm 2 . [4] device mounted on an fr4 pcb, 70 m single-sided copper, tin-plate...
Description 60 V, 3 A NPN low VCEsat (BISS) transistor

File Size 256.00K  /  14 Page

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    TLEGD1060 TLBD1060

Toshiba Semiconductor
Part No. TLEGD1060 TLBD1060
OCR Text ...hange, then leads to trouble in mounting. Furthermore, prevent the devices from being destructed against static electricity for baking of it. 5. If the packing material of laminate would be broken, the hermeticity would deteriorate. Therefo...
Description Panel Circuit Indicator

File Size 226.18K  /  9 Page

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