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KMP4000 NTE712 GDMQ0705 3520E 402JTE1 284884 2415S 2C5574
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  bonding Datasheet PDF File

For bonding Found Datasheets File :: 7119    Search Time::2.031ms    
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    MASW2000

MACOM[Tyco Electronics]
Part No. MASW2000
OCR Text ... to RF2. Handling, Mounting, bonding Procedure Handling Precautions Permanent damage to the MASW2000 may occur if the following precautions are not adhered to: A. Cleanliness -- The MASW2000 should be handled in a clean environment. DO ...
Description GaAs SPDT Switch DC - 3 GHz

File Size 108.98K  /  2 Page

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    MASW2040

MA-Com
MACOM[Tyco Electronics]
Part No. MASW2040
OCR Text ...chematic Handling, Mounting, bonding Procedure MASW2040 V 2.00 Handling Precautions Permanent damage to the MASW2040 may occur if the following precautions are not adhered to: A. Cleanliness -- The MASW2040 should be handled in a...
Description DC-2 GHz GaAs DPDT switch
GaAs DPDT Switch DC - 2 GHz

File Size 88.29K  /  2 Page

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    Iterra
Part No. ITR39100
OCR Text ...nt to prevent contamination of bonding surfaces . these are esd sensitive devices and should be handled with appropriate precaution including the use of wrist-grounding straps. all die attach and wire/ribbon bond equipment must be wel...
Description power amplifier MMIC

File Size 438.54K  /  7 Page

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    HMC592

Hittite Microwave Corporation
Part No. HMC592
OCR Text ...e at www.hittite.com mounting & bonding techniques for millimeterwave gaas mmics the die should be attached directly to the ground plane eutectically or with conductive epoxy (see hmc general handling, mounting, bonding note). 50 ohm micro...
Description high dynamic range GaAs PHEMT MMIC 2 Watt Power Amplifi

File Size 411.88K  /  8 Page

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    HMC591 HMC59109

Hittite Microwave Corporation
Part No. HMC591 HMC59109
OCR Text ...e at www.hittite.com mounting & bonding techniques for millimeterwave gaas mmics the die should be attached directly to the ground plane eutectically or with conductive epoxy (see hmc general handling, mounting, bonding note). 50 ohm micro...
Description GaAs PHEMT MMIC 2 WATT POWER AMPLIFIER, 6 - 10 GHz

File Size 296.07K  /  8 Page

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    HMC591

Hittite Microwave Corporation
Part No. HMC591
OCR Text ...e at www.hittite.com mounting & bonding techniques for millimeterwave gaas mmics the die should be attached directly to the ground plane eutectically or with conductive epoxy (see hmc general handling, mounting, bonding note). 50 ohm micro...
Description GaAs PHEMT MMIC 2-Watt Power Amplifier

File Size 423.17K  /  8 Page

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    HMC590 HMC59009

Hittite Microwave Corporation
Part No. HMC590 HMC59009
OCR Text ...e at www.hittite.com mounting & bonding techniques for millimeterwave gaas mmics the die should be attached directly to the ground plane eutectically or with conductive epoxy (see hmc general handling, mounting, bonding note). 50 ohm micro...
Description GaAs PHEMT MMIC 1 WATT POWER AMPLIFIER, 6 - 10 GHz

File Size 287.05K  /  8 Page

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    HMC590

Hittite Microwave Corporation
Part No. HMC590
OCR Text ...e at www.hittite.com mounting & bonding techniques for millimeterwave gaas mmics the die should be attached directly to the ground plane eutectically or with conductive epoxy (see hmc general handling, mounting, bonding note). 50 ohm micro...
Description high dynamic range GaAs PHEMT MMIC 1 Watt Power Amplifi

File Size 409.79K  /  8 Page

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    Vishay Sfernice
Part No. TA33-10KD10KD0016
OCR Text ...t power handling capacity. two bonding pads pe r termination allow greater flexibility in hybrid layout design. features ? center tap feature ? resistor material: self-passivating ? tantalum nitride ? silicon substrate for good power dis...
Description TA 33 Wirebondable Dual Value Thin Film Chip Resistor Networks, Center Tap

File Size 73.02K  /  3 Page

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For bonding Found Datasheets File :: 7119    Search Time::2.031ms    
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