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Renesas Electronics Corporation |
| Part No. |
AMB0780L4RJ
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| Description |
Advanced Memory Buffer Low Power for FB-DIMM Modules
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| Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
| Part No. |
AMB0780L4RJ8
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| Description |
Advanced Memory Buffer Low Power for FB-DIMM Modules
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
HS30780081
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| Description |
Backplane connectors,cable backplane ,Paladin 4X8 Cable, 30 AWG, 25 GHz
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10007607-801-36LF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled header ,Through Hole, Row Polarized ,Double row , 36 Positions ,2.54mm (0.100in) Pitch.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
78061-0001 0780610001
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| Description |
1.00mm (.039) Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.38渭m (15渭) Gold(Au) Selective Plating, 240 Circuits, with Beveled Metal Pins
1.00mm (.039) Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.38μm (15μ) Gold(Au) Selective Plating, 240 Circuits, with Beveled Metal Pins
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| File Size |
361.88K /
7 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10007607-802-06LF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled header ,Through Hole, Row Polarized ,Double row , 6 Positions ,2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0780790011 78079-0011
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| Description |
1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Black Housing and Latches, 0.76渭m (30渭) Gold (Au) Plating
1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Black Housing and Latches, 0.76μm (30μ) Gold (Au) Plating
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| File Size |
809.46K /
10 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10007607-802-36LF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled header ,Through Hole, Row Polarized ,Double row , 36 Positions ,2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0780790012 78079-0012
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| Description |
1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Black Housing and Latches, 0.76渭m (30渭) Gold (Au) Plating
1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Black Housing and Latches, 0.76μm (30μ) Gold (Au) Plating
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| File Size |
809.46K /
10 Page |
View
it Online |
Download Datasheet |
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|
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Amphenol Communications Solutions |
| Part No. |
10007607-801-06LF
|
| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled header ,Through Hole, Row Polarized ,Double row , 6 Positions ,2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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SiTime |
| Part No. |
SiT1569AC-J3-33E-0078.000000
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| Description |
Ultra-Small Low Power, 1 Hz to 462.5 kHz, ±50 ppm Oscillator
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0780350001 78035-0001
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| Description |
0.60mm (.024") Pitch miniDIMM DDR2 Socket, Surface Mount, 22.5掳 Reverse Angle,0.76渭m (30渭") Gold (Au) Plating, Off-White Latches, with Pick-and-Place Cap, 244
0.60mm (.024) Pitch miniDIMM DDR2 Socket, Surface Mount, 22.5° Reverse Angle,0.76μm (30μ) Gold (Au) Plating, Off-White Latches, with Pick-and-Place Cap, 244
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| File Size |
477.35K /
7 Page |
View
it Online |
Download Datasheet |
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Molex Electronics Ltd.
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| Part No. |
0780790052 78079-0052
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| Description |
1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Black Housing, Off-White Latches, 0.38渭m (15渭) Gold(Au) Plating
1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Black Housing, Off-White Latches, 0.38μm (15μ) Gold(Au) Plating
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| File Size |
809.49K /
10 Page |
View
it Online |
Download Datasheet |
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