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Maxim
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Part No. |
MAX3866EVKIT
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OCR Text |
...on exists, the LED will be off. Solder Jumper. For normal operation, ensure that this solder jumper is open. TTL Output, active high. Probe ...Bond Diagram
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Description |
Evaluation Kit for the MAX3866 From old datasheet system
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File Size |
211.74K /
8 Page |
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it Online |
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INTERPOINT[Interpoint Corporation Company]
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Part No. |
SMHP120
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OCR Text |
...oldering may damage the device. Solder pins individually with heat application not exceeding 300C for 10 seconds per pin.
FIGURE 54: CASE...Bond Evaluation* SEM SLAMTM/C-SAM: Input capacitors only (Add'l test, not req. by H or K) Notes M/S ... |
Description |
DC/DC CONVERTERS 120 VOLT INPUT
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File Size |
91.39K /
8 Page |
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it Online |
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INTERPOINT[Interpoint Corporation Company]
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Part No. |
STF28-461
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OCR Text |
...oldering may damage the device. Solder pins individually with heat application not exceeding 300C for 10 seconds per pin.
0.270 max (6.98) ...Bond Evaluation* SEM SLAMTM/C-SAM: Input capacitors only (Add'l test, not req. by H or K) Notes M/S ... |
Description |
EMI INPUT FILTER 28 VOLT INPUT
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File Size |
56.48K /
4 Page |
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it Online |
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TRIQUINT[TriQuint Semiconductor]
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Part No. |
TGS4302
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OCR Text |
...tes: * * * * * Use AuSn (80/20) solder with limited exposure to temperatures at or above 300C. (30 seconds maximum) An alloy station or conveyor furnace with reducing atmosphere should be used. No fluxes should be utilized. Coefficient of t... |
Description |
High Power Ka-Band SPDT Switch
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File Size |
117.32K /
11 Page |
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it Online |
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Motorola
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Part No. |
MPXA4101A MPX4101A MPXH6101A
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OCR Text |
...e correct size to ensure proper solder connection interface between the board and the package. With the correct
0.100 TYP 8X 2.54
footprint, the packages will self align when subjected to a solder reflow process. It is always recommende... |
Description |
Integrated Silicon Pressure Sensor for Manifold Absolute Pressure Applications From old datasheet system
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File Size |
117.97K /
8 Page |
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it Online |
Download Datasheet
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TRIQUINT[TriQuint Semiconductor]
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Part No. |
TGS2306-EP TGS2306-EPU
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OCR Text |
...tes: * * * * * Use AuSn (80/20) solder with limited exposure to temperatures at or above 300C. (30 seconds maximum) An alloy station or conveyor furnace with reducing atmosphere should be used. No fluxes should be utilized. Coefficient of t... |
Description |
High Power DC - 18GHz SPDT FET Switch
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File Size |
301.20K /
8 Page |
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it Online |
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Price and Availability
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