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  solder-bond Datasheet PDF File

For solder-bond Found Datasheets File :: 2031    Search Time::1.235ms    
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    IXFC24N50 IXFC26N50

IXYS[IXYS Corporation]
Part No. IXFC24N50 IXFC26N50
OCR Text ... A A Note: All terminals are solder plated. 1 - Gate 2 - Drain 3 - Source Repetitive; pulse width limited by TJM IF = IS, VGS = 0 V, Note 1 1 2 10 15 Note: 1. Pulse test, t 300 s, duty cycle d 2 % 2. IT test current: IXFC26N50...
Description    HiPerFET MOSFETs ISOPLUS220

File Size 66.38K  /  2 Page

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    Maxim
Part No. MAX3866EVKIT
OCR Text ...on exists, the LED will be off. Solder Jumper. For normal operation, ensure that this solder jumper is open. TTL Output, active high. Probe ...Bond Diagram ____________________________________________________________________________________...
Description Evaluation Kit for the MAX3866
From old datasheet system

File Size 211.74K  /  8 Page

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    SFME120-46 SFME120-461

Interpoint Corporation Company
Part No. SFME120-46 SFME120-461
OCR Text ...oldering may damage the device. Solder pins individually with heat application not exceeding 300C for 10 seconds per pin. FIGURE 54: CASE...Bond Evaluation* SEM SLAMTM/C-SAM: Input capacitors only (Add'l test, not req. by H or K) Notes M/S ...
Description EMI INPUT FILTER 120 VOLT INPUT

File Size 62.60K  /  5 Page

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    INTERPOINT[Interpoint Corporation Company]
Part No. SMHP120
OCR Text ...oldering may damage the device. Solder pins individually with heat application not exceeding 300C for 10 seconds per pin. FIGURE 54: CASE...Bond Evaluation* SEM SLAMTM/C-SAM: Input capacitors only (Add'l test, not req. by H or K) Notes M/S ...
Description DC/DC CONVERTERS 120 VOLT INPUT

File Size 91.39K  /  8 Page

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    INTERPOINT[Interpoint Corporation Company]
Part No. STF28-461
OCR Text ...oldering may damage the device. Solder pins individually with heat application not exceeding 300C for 10 seconds per pin. 0.270 max (6.98) ...Bond Evaluation* SEM SLAMTM/C-SAM: Input capacitors only (Add'l test, not req. by H or K) Notes M/S ...
Description EMI INPUT FILTER 28 VOLT INPUT

File Size 56.48K  /  4 Page

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    TRIQUINT[TriQuint Semiconductor]
Part No. TGS4302
OCR Text ...tes: * * * * * Use AuSn (80/20) solder with limited exposure to temperatures at or above 300C. (30 seconds maximum) An alloy station or conveyor furnace with reducing atmosphere should be used. No fluxes should be utilized. Coefficient of t...
Description High Power Ka-Band SPDT Switch

File Size 117.32K  /  11 Page

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    Motorola
Part No. MPXA4101A MPX4101A MPXH6101A
OCR Text ...e correct size to ensure proper solder connection interface between the board and the package. With the correct 0.100 TYP 8X 2.54 footprint, the packages will self align when subjected to a solder reflow process. It is always recommende...
Description Integrated Silicon Pressure Sensor for Manifold Absolute Pressure Applications
From old datasheet system

File Size 117.97K  /  8 Page

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    TRIQUINT[TriQuint Semiconductor]
Part No. TGS2306-EP TGS2306-EPU
OCR Text ...tes: * * * * * Use AuSn (80/20) solder with limited exposure to temperatures at or above 300C. (30 seconds maximum) An alloy station or conveyor furnace with reducing atmosphere should be used. No fluxes should be utilized. Coefficient of t...
Description High Power DC - 18GHz SPDT FET Switch

File Size 301.20K  /  8 Page

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    APM2014NU APM2014NUC-TRL APM2014NUC-TR APM2014NUC-TU APM2014NUC-TUL

ANPEC[Anpec Electronics Coropration]
Part No. APM2014NU APM2014NUC-TRL APM2014NUC-TR APM2014NUC-TU APM2014NUC-TUL
OCR Text ...nal Material Lead Solderability Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3. Reflow Condition (IR/Convection or VPR Reflow) TP Ramp-up tp Criti...
Description N-Channel Enhancement Mode MOSFET

File Size 182.43K  /  10 Page

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    APM3023NU APM3023NUC-TRL APM3023NUC-TU APM3023NUC-TUL APM3023NUC-TR

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ANPEC[Anpec Electronics Coropration]
Part No. APM3023NU APM3023NUC-TRL APM3023NUC-TU APM3023NUC-TUL APM3023NUC-TR
OCR Text ...nal Material Lead Solderability Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3. Reflow Condition TP (IR/Convection or VPR Reflow) tp Critical Zone T...
Description N-Channel Enhancement Mode MOSFET

File Size 181.05K  /  10 Page

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For solder-bond Found Datasheets File :: 2031    Search Time::1.235ms    
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