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joint Datasheet PDF File

For joint Found Datasheets File :: 6168 Search Time::8.25ms
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				LIGITEK electronics co., ltd.
Part No.	LFD495-62-XX-RP4-PF
OCR Text	...ax Distance:2mm Min(From solder joint to case) 120X 25X Dip Soldering Preheat: 120C Max Time(sec) Preheat time: 120 seconds Max Ramp-up 3C/sec(max) Ramp-Down:-5 C/sec(max) Solder Bath:245 C Max Dipping Time:5 seconds Max Distance...
Description	FOUR DIGIT LED DISPLAY (0.4 lnch)
File Size	111.91K / 9 Page	View it Online	Download Datasheet

				Lumberg
Part No.	KFV60 KGV50-6 KGV70 KGV71 KGV30 KGV80 KFV120 KFV40 KFV50 KFV50_6 KFV30 KFV50/6 KFV70
OCR Text	joint acc. to IEC 60130-9, IP 40 Connecteurs circulaires avec verrouillage a vis suivant IEC 60130-9, IP 40 KFV KGV Einbaukupplung nach IEC 60130-9, IP 40, mit Schraubverschluss und Lotanschlussen KFV: fur Frontmontage KGV: fur Ruckseitenm...
Description	Rundsteckverbinder mit Schraubverschluss nach IEC 60130-9, IP 40
File Size	475.46K / 2 Page	View it Online	Download Datasheet

				Fairchild Semiconductor
Part No.	RMPA0963
OCR Text	...early mechanical failure of the joint. reflow must occur prior to the flux being com- pletely driven off. the duration of peak reflow temperature should not exceed 10 seconds. maximum soldering tem- peratures should be in the range 215-220c...
Description	Cellular CDMA CDMA2000-1X and WCDMA Power Amplifier Module
File Size	145.31K / 7 Page	View it Online	Download Datasheet

				MORNSUN Science& Technology Ltd.
Part No.	SW2001-EX SW2002-EX
OCR Text	...s of numar sensor, mechanical joint etc output voltage 8v open status short circuit current <8ma input switching frequency <10hz hazardous area threshold typ:1.55ma (hysteresis:0.2ma) output signal relay output 1 on join...
Description	SW20XX-EX Isolating Switching Barrier
File Size	64.89K / 2 Page	View it Online	Download Datasheet

				Microsemi Corporation
Part No.	ARF1511
OCR Text	...nk (Use High Efficiency Thermal joint Compound and Planar Heat Sink Surface.) MIN TYP MAX UNIT C/W 10-2008 050-4927 Rev D 0.10 0.16 CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be...
Description	RF POWER MOSFET FULL-BRIDGE
File Size	95.06K / 2 Page	View it Online	Download Datasheet

				Microsemi Corporation
Part No.	ARF1510
OCR Text	...nk (Use High Efficiency Thermal joint Compound and Planar Heat Sink Surface.) MIN TYP MAX UNIT 050-4926 Rev F 10-2008 0.10 0.16 C/W CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should...
Description	RF POWER MOSFET FULL-BRIDGE
File Size	94.61K / 2 Page	View it Online	Download Datasheet

				Microsemi Corporation
Part No.	ARF1505
OCR Text	...nk (Use High Efficiency Thermal joint Compound and Planar Heat Sink Surface.) MIN TYP MAX UNIT C/W 050-4922 Rev F 10-2008 0.10 0.16 CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be...
Description	RF POWER MOSFET N-CHANNEL ENHANCEMENT MODE
File Size	138.88K / 4 Page	View it Online	Download Datasheet

				Microsemi Corporation
Part No.	ARF1501
OCR Text	...nk (Use High Efficiency Thermal joint Compound and Planar Heat Sink Surface.) MIN TYP MAX UNIT 3-2008 050-5982 Rev D 0.10 0.16 C/W CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should ...
Description	RF POWER MOSFET N-CHANNEL ENHANCEMENT MODE
File Size	137.64K / 4 Page	View it Online	Download Datasheet

				Microsemi Corporation
Part No.	ARF1500
OCR Text	...nk (Use High Efficiency Thermal joint Compound and Planar Heat Sink Surface.) MIN TYP MAX UNIT C/W 10-2008 050-5965 Rev E 0.10 0.16 CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be...
Description	RF POWER MOSFET N-CHANNEL ENHANCEMENT MODE
File Size	135.61K / 4 Page	View it Online	Download Datasheet

				EPCOS
Part No.	B72590D0050A060 B72590D0150A060 B72724D0200A062 B72500D0090A060 B72714D0200A060 B72500D0200A060 B72714D0200A06008 B72500D0150A060 B72570D0120A060 B72500D0050A060
OCR Text	... J-STD-020D. 3 3.1 Solder joint profiles / solder quantity Cement quantity The component is fixed onto the circuit board with cement prior to soldering. It must still be able to move slightly. When the board is placed into the refl...
Description	CeraDiodes
File Size	516.35K / 22 Page	View it Online	Download Datasheet

For joint Found Datasheets File :: 6168 Search Time::8.25ms
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