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http://
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| Part No. |
HMS81C43XX
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| OCR Text |
...vember 2001 ver 1.2 figure 4-1 52pin shrink dip package diagram unit: mm hynix gms87c4060 1 26 27 52 45.97 0.13 0.76 0.13 1.778 0.25 4.38 max. 13.97 0.25 15.24 0.25 0.47 0.13 1.02 0.25 3.81 0.13 3.24 0.20 0.50 min. 0.25 0.05 0 ~ 15
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| Description |
CMOS SINGLE-CHIP 8-BIT MICROCONTROLLER FOR TELEVISION
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| File Size |
1,221.92K /
100 Page |
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Hynix Semiconductor, Inc.
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| Part No. |
GMS81C7008 GMS81C7008K GMS81C7008Q GMS81C7016K GMS81C7016Q
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| OCR Text |
...package also, no longer produce 52pin mcu. the compay name hyundai electronics industires co., ltd. changed to hynix semiconductor inc. version 2.00 (feb., 2001) delete product of 52lqfp package. fixed some errata that pin number 25 and 2... |
| Description |
HYNIX SEMICONDUCTOR INC. 8-BIT SINGLE-CHIP MICROCONTROLLERS Hynix半导体公司的8位单芯片微控制器
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| File Size |
1,316.89K /
123 Page |
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RENESAS
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| Part No. |
M6MGT647M3
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| OCR Text |
... FM-VCC=2.7 ~ 3.0V Ta=-20 ~ 85C 52pin TSOP(Type-II), Lead pitch 0.4mm
Application
Mobile communication products
PIN CONFIGURATION (TOP VIEW)
A15 A14 A13 A12 A11 A10 A9 A8 A19 NC WE# F-RP# F-WP# NC NC A21 A20 A18 A17 A7 A6 A5 A4 A3 A... |
| Description |
The M6MGB/T647M33KT is a Stacked micro Multi Chip
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| File Size |
51.35K /
3 Page |
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Renesas
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| Part No. |
M6MGT331S4BKT M6MGB331S4BKT
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| OCR Text |
...ature ta= - 40 ~ 85 c package 52pin tsop(type - ii), lead pitch 0.4mm outer - lead finishing: sn - cu application outline 52ptj - a mobile communication products description features 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21... |
| Description |
Memory>MCP(Multi Chip Package)>S-µMCP(Stacked micro MCP)
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| File Size |
115.73K /
3 Page |
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Renesas
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| Part No. |
M6MGT331S8BKT M6MGB331S8BKT
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| OCR Text |
...ature ta= - 40 ~ 85 c package 52pin tsop(type - ii), lead pitch 0.4mm outer - lead finishing: sn - cu application outline 52ptj - a mobile communication products description features pin configuration (top view) 1 2 3 4 5 6 7 8 9 10 11 1... |
| Description |
Memory>MCP(Multi Chip Package)>S-µMCP(Stacked micro MCP)
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| File Size |
52.94K /
3 Page |
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it Online |
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Renesas
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| Part No. |
M6MGT641S8BKT M6MGB641S8BKT
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| OCR Text |
...ature ta= - 40 ~ 85 c package 52pin tsop(type - ii), lead pitch 0.4mm outer - lead finishing : sn - cu application
m6mgb/t641s8bkt renesas lsis 67,108,864 - bit (4,194,304 - word by 16 - bit / 8,388,608 - word by 8 - bit) cmos flash m... |
| Description |
Memory>MCP(Multi Chip Package)>S-µMCP(Stacked micro MCP)
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| File Size |
42.43K /
3 Page |
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it Online |
Download Datasheet |
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Renesas
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| Part No. |
M6MGT647M17AKT
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| OCR Text |
...re ta= - 40 ~ 85 degree package 52pin tsop(type - ii), lead pitch 0.4mm outer - lead finishing: sn - cu application outline 52ptj - a mobile communication products gnd : common gnd for flash/mobile ram a0 - a19 :common a... |
| Description |
Memory>MCP(Multi Chip Package)>S-µMCP(Stacked micro MCP)
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| File Size |
112.50K /
3 Page |
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it Online |
Download Datasheet |
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Price and Availability
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