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solder-bond Datasheet PDF File

For solder-bond Found Datasheets File :: 2031 Search Time::3.844ms
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				Semikron International
Part No.	SKR12 SKR4
OCR Text	...ng ? compatible to all standard solder processes typical applications ? uncontrolled rectifier bridges absolute maximum ratings symbol c...bond al, diameter 500 m package tray chips / package 36 pcs skr 12,4 qu bond 2 rev. 0 ? 22.09....
Description	DIODE
File Size	91.75K / 2 Page	View it Online	Download Datasheet

				Actel Corporation
Part No.	RTAX250-SCG624B RTAX250-SCG624E RTAX250-SCG624EV RTAX250-SCQ624EV RTAX250-SLB624B RTAX250-SLB624E RTAX250-SLB624EV RTAX250-SLCG624B RTAX250-SLCG624E RTAX250-SLCG624EV RTAX2000-SLCG624EV RTAX-S RTAX1000-SS624B RTAX2000-SS624B RTAX250-SS624B RTAX4000-SS624B RTAX1000-SS624E RTAX2000-SS624E RTAX250-SS624E RTAX4000-SS624E RTAX1000-SS624EV RTAX2000-SS624EV RTAX250-SS624EV RTAX4000-SS624EV RTAX2000-SLCQ624E
OCR Text	...ical visual are performed after solder column attachment. 2. RTAX-S and RTAX-SL devices have the same silicon and are distinguished by scree...Bond Pull Internal Visual Serialization Temperature Cycling Constant Acceleration 1010, Condition C,...
Description	RTAX-S/SL RadTolerant FPGAs
File Size	2,198.26K / 170 Page	View it Online	Download Datasheet

				M/A-COM Technology Solutions, Inc.
Part No.	MASW-004240-13170W
OCR Text	...ese devices are well suited for solder or conductive epoxy attachment onto hard or soft substrates. The use of 60Pb/40Sn, 80Au/20Sn or any RoHS lead-free solder is recommended to achieve the lowest series resistance and optimum heat sink. ....
Description	HMIC SP4T Surface Mount Silicon PIN Diode Switch HMIC垄芒 SP4T Surface Mount Silicon PIN Diode Switch
File Size	248.43K / 6 Page	View it Online	Download Datasheet

				Semikron International
Part No.	SKR22
OCR Text	...ng ? compatible to all standard solder processes typical applications* ? uncontrolled rectifier bridges absolute maximum ratings symbol ...bond al, diameter 500 m package tray chips / package 9pcs skr 22,4 qu bond 2 rev. 1 ? 19.02.20...
Description	DIODE
File Size	66.30K / 2 Page	View it Online	Download Datasheet

				Rhopoint Components Ltd. Rhopoint Components, Ltd.
Part No.	SMH-B-100-5.0 SMH-B-20-1.0 SMH-B-20-5.0 SMH-B-22-5.0 SMH-B-25-0.5 SMH-B-10-0.5 SMH-B-33-1.0 SMH-B-10-5.0 SMH-B-33-5.0 SMH-B-5-2.0 SMH-B-100-1.0 SMH-B-100-2.0 SMH-B-25-1.0 SMH-B-25-5.0 SMH-B-10-2.0 SMH-B-100-0.5 SMH-B-20-0.5 SMH-B-25-2.0 SMH-B-33-2.0 SMH-B-10-1.0 SMH-B-20-2.0 SMH-B-5-0.5 SMH-B-22-1.0 SMH-B-22-2.0 SMH-B-33-0.5 SMH-B-R010-1.0 SMH-B-447-2.0 SMH-B-447-5.0 SMH-B-5-1.0 SMH-B-447-1.0 SMH-B-447-0.5 SMH-B-22-0.5 SMH-B-5-5.0 SMH-B-200-0.5 SMH-B-200-1.0 SMH-B-200-2.0 SMH-B-200-5.0
OCR Text	...30 sek oder 250 C / 5 min max. solder temperature up to 280 C / 30 sec or 250 C / 5 min Temperaturabhangigkeit des elektrischen Widersta...bond pad design SMH-B: Vorschlag fur die Gestaltung der Lot- und Bondpads SMH-B: proposal for sol...
Description	Precision Resistors 精密电阻
File Size	125.47K / 3 Page	View it Online	Download Datasheet

				List of Unclassifed Manufacturers ETC
Part No.	CD2015FC CD2015WBA CD2520WBA CD2520FC
OCR Text	...ith metallized back surface for solder down heat sinking of the chip, includes bondable termination pedestals to receive aluminum wire bonds...Bond Version Resistance Model CD2015WBA CD2520WBA is a hybrid mountable version with copper ped...
Description	Low Resistance Precision Chip Resistors
File Size	107.87K / 2 Page	View it Online	Download Datasheet

				Cree, Inc
Part No.	C460EZ1000-SXX000 C470EZ1000-SXX000 C450EZ1000-SXX000 CXXXEZ1000-SXX000 C527EZ1000-SXX000
OCR Text	...tachable with conductive epoxy, solder paste or solder preforms, as well as the flux eutectic method. These vertically structured, low forwa...Bond Pads (2) Subject to change without notice. www.cree.com Maximum Ratings at TA = 5C N...
Description	Cree? EZ1000 LEDs
File Size	244.01K / 6 Page	View it Online	Download Datasheet

				Cree, Inc
Part No.	C460EZ700-SXX000 C450EZ700-SXX000 CXXXEZ700-SXX000 C470EZ700-SXX000
OCR Text	...tachable with conductive epoxy, solder paste or solder preforms, in addition to using the flux eutectic method. These vertically structured,...Bond Structure 1000 V ESD Threshold Rating White LEDs Crosswalk Signals Backlighting Automotive ...
Description	Cree? EZ700 LED
File Size	315.48K / 6 Page	View it Online	Download Datasheet

				TRIQUINT[TriQuint Semiconductor]
Part No.	TGA4819-SL
OCR Text	...e shown for soldermask opening. Solder should not be applied outside of this area. Dimensions: Inches Tolerances: Length & Width: 0.003" Height: 0.006" Adjacent Pad to Pad Spacing: 0.0002" Pad Size: 0.001" Package Backside Material: Materia...
Description	10.7Gb/s Linear Optical Modulator Driver
File Size	382.08K / 11 Page	View it Online	Download Datasheet

				Cree, Inc
Part No.	C450EZ400-S09000-2-16
OCR Text	...adiation ? conductive epoxy, solder paste or preforms, or flux eutectic attach ? low forward voltage C 3.5 v typical at 150 ma ? single wire bond structure ? maximum dc forward current - 200 ma dielectric passivation a...
Description	Cree EZ400-n Gen 2 LED
File Size	181.48K / 5 Page	View it Online	Download Datasheet

For solder-bond Found Datasheets File :: 2031 Search Time::3.844ms
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