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SY10E1 LC21003B SI1132 2SK1340 CP2297 GPA1606 SDP520Q DM74LS08
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For heated Found Datasheets File :: 1852    Search Time::1.11ms    
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    PB-CMM1100-BD-0000 CMM1100-BD0704 CMM1100-BD-000V

Mimix Broadband
Part No. PB-CMM1100-BD-0000 CMM1100-BD0704 CMM1100-BD-000V
OCR Text ...d. A die bonder that utilizes a heated collet and provides scrubbing action to ensure total wetting to prevent void formation in a nitrogen atmosphere is recommended. The gold-tin eutectic (80% Au 20% Sn) has a melting point of approximatel...
Description 2.0-18.0 GHz GaAs MMIC Low Noise Amplifier

File Size 208.41K  /  5 Page

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    XA1000-BD-EV1 XA1000-BD-000V XA1000-BD

Mimix Broadband
Part No. XA1000-BD-EV1 XA1000-BD-000V XA1000-BD
OCR Text ...d. A die bonder that utilizes a heated collet and provides scrubbing action to ensure total wetting to prevent void formation in a nitrogen atmosphere is recommended. The gold-tin eutectic (80% Au 20% Sn) has a melting point of approximatel...
Description DC-18.0 GHz GaAs MMIC 5-Bit Digital Attenuator

File Size 360.20K  /  6 Page

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    ON Semi
Part No. BSP62T1_D ON0222
OCR Text ...vice. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress...
Description MEDIUM POWER PNP SILICON
From old datasheet system

File Size 123.28K  /  6 Page

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    XP1014-BD-EV1 XP1014-BD-000V XP1014-BD

Mimix Broadband
Part No. XP1014-BD-EV1 XP1014-BD-000V XP1014-BD
OCR Text ...d. A die bonder that utilizes a heated collet and provides scrubbing action to ensure total wetting to prevent void formation in a nitrogen atmosphere is recommended. The gold-tin eutectic (80% Au 20% Sn) has a melting point of approximatel...
Description 8.5-11.0 GHz GaAs MMIC Power Amplifier

File Size 132.54K  /  5 Page

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    XP1015-BD-EV1 XP1015-BD-000V XP1015-BD

Mimix Broadband
Part No. XP1015-BD-EV1 XP1015-BD-000V XP1015-BD
OCR Text ...d. A die bonder that utilizes a heated collet and provides scrubbing action to ensure total wetting to prevent void formation in a nitrogen atmosphere is recommended. The gold-tin eutectic (80% Au 20% Sn) has a melting point of approximatel...
Description 43.5-46.5 GHz GaAs MMIC Power Amplifier

File Size 224.38K  /  5 Page

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    XS1000-BD0708 XS1000-BD

Mimix Broadband
Part No. XS1000-BD0708 XS1000-BD
OCR Text ...d. A die bonder that utilizes a heated collet and provides scrubbing action to ensure total wetting to prevent void formation in a nitrogen atmosphere is recommended. The gold-tin eutectic (80% Au 20% Sn) has a melting point of approximatel...
Description 7.0-13.0 GHz GaAs MMIC 6-Bit Phase Shifter

File Size 446.05K  /  6 Page

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    XX1002-BD-EV1 XX1002-BD-000V

Mimix Broadband
Part No. XX1002-BD-EV1 XX1002-BD-000V
OCR Text ...d. A die bonder that utilizes a heated collet and provides scrubbing action to ensure total wetting to prevent void formation in a nitrogen atmosphere is recommended. The gold-tin eutectic (80% Au 20% Sn) has a melting point of approximatel...
Description 2.5-6.0/5.0-12.0 GHz GaAs MMIC Active Doubler

File Size 440.84K  /  5 Page

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    XX1007-BD-EV1 XX1007-BD-000V XX1007-BD

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Mimix Broadband
Part No. XX1007-BD-EV1 XX1007-BD-000V XX1007-BD
OCR Text ...d. A die bonder that utilizes a heated collet and provides scrubbing action to ensure total wetting to prevent void formation in a nitrogen atmosphere is recommended. The gold-tin eutectic (80% Au 20% Sn) has a melting point of approximatel...
Description 13.5-17.0/27.0-34.0 GHz GaAs MMIC Active Doubler

File Size 373.46K  /  6 Page

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    NST3946DXV6T1 NST3946DXV6T5

ON Semiconductor
Part No. NST3946DXV6T1 NST3946DXV6T5
OCR Text ...S Characteristic (One Junction heated) Total Device Dissipation Derate above 25C Thermal Resistance Junction-to-Ambient Characteristic (Both Junctions heated) Total Device Dissipation Derate above 25C 1. FR-4 @ Minimum Pad TA = 25C RqJA TA...
Description Dual General Purpose Transistor

File Size 160.42K  /  12 Page

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    DN510

List of Unclassifed Manufacturers
ETC
Part No. DN510
OCR Text ...be attached to the device to be heated by Ablefilm 561K thermally conductive adhesive film. A 0.005" thick 0.480" x 0.275" piece of this film is provided with each DN510 heater. FIG. 4 +Vcc COM. 3" DN510 ACTUAL SIZE Therm Optics DN510 ...
Description SUBMINIATURE PROPORTIONALLY CONTROLLED HEATER

File Size 338.95K  /  2 Page

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