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  bumped Datasheet PDF File

For bumped Found Datasheets File :: 538    Search Time::1.719ms    
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    NJU6679

New Japan Radio
Part No. NJU6679
OCR Text ...ckage outline --- cof / tcp / bumped chip --- cof / tcp / bumped chip c-mos technology ( c-mos technology ( substrate:n) substrate:n) 2001 2001 ver.4.8 ver.4.8 nju6679 nju6679 pad location pad location chip cente...
Description 128Com × 132Seg Output Bit Map LCD Driver

File Size 476.12K  /  45 Page

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    NJU6678V

New Japan Radio
Part No. NJU6678V
OCR Text ...ckage outline --- cof / tcp / bumped chip --- cof / tcp / bumped chip c-mos technology ( c-mos technology ( substrate:n) substrate:n) 2001 2001 ver.4.8 ver.4.8 nju6678v nju6678v pad location pad location chip cen...
Description 104Com × 132Seg Output Bit Map LCD Driver

File Size 343.04K  /  44 Page

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    UC1682THCZ UC1682XFBZ UC1682TFBZ UC1682XHCZ

List of Unclassifed Manufacturers
Part No. UC1682THCZ UC1682XFBZ UC1682TFBZ UC1682XHCZ
OCR Text ... description uc1682xhcz gold bumped die with pi without otp option uc1682thcz gold bumped die with pi with otp option uc1682xfbz cof without otp option uc1682tfbz cof with otp option convention note: grayed-out contents ar...
Description HIGH-VOLTAGE MIXED-SIGNAL IC

File Size 1,148.04K  /  70 Page

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    Hitachi,Ltd.
Part No. HD66751 HD66750
OCR Text ...3 tcp-158 bare chip yes yes yes bumped chip yes yes yes no. of pins 153 153 158 chip sizes 9.69 x 2.73 10.88 x 2.89 11.39 x 2.89 pad intervals 120 m m 120 m m 120 m m hd66750/1 5 lcd family comparison (cont) items hd66724 hd66725 hd66...
Description 128 x 128-dot Graphics LCD Controller/Driver with Four-grayscale Functions

File Size 2,088.54K  /  96 Page

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    ONSEMI
Part No. NLAS4685
OCR Text ... is available in a 2.0 x 1.5 mm bumped die array, with a 3 x 4 arrangement of solder bumps. The pitch of the solder bumps is 0.5 mm for easy handling. Features http://onsemi.com MARKING DIAGRAM A1 Microbump-10 CASE 489AA A1 XXD * ...
Description Ultra-Low Resistance Dual SPDT Analog Switch

File Size 77.60K  /  10 Page

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    A3904

Allegro MicroSystems
Part No. A3904
OCR Text ...bare die on wafer (suffix cw); bumped wafer level chip scale package (wlcsp) (suffix cg); and complete thin profile (0.38 mm nominal overall height) dfn package, with niaupd leadframe plating and an exposed tab for enhanced thermal dis...
Description Low Voltage Voice Coil Motor Driver

File Size 292.04K  /  9 Page

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    NJU6677

New Japan Radio
Part No. NJU6677
OCR Text ...ckage outline --- cof / tcp / bumped chip --- cof / tcp / bumped chip c-mos technology c-mos technology jul.10.2000 jul.10.2000 ver.2.1 ver.2.1 nju6677 nju6677 pad location pad location chip center chip center : x=0u...
Description 88-common x 132-segment BIT MAP LCD DRIVER

File Size 541.47K  /  45 Page

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    意法半导
Part No. L6440
OCR Text ...unction. order code flip chip (bumped die) part number package operating temp. range l6440 flip chip (bumped die) -25c to +85c www.st.com revision history l6440 2/3 1 revision history table 1. document revision history date...
Description 4-Channel ultra low power GMR-TMR preamplifier for HDD applications

File Size 51.04K  /  3 Page

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