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CREE[Cree, Inc]
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| Part No. |
CXXXXR230-SXX00-A C460XR260-SXX00-A C470XR260-SXX00-A
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| OCR Text |
... and require only a single wire bond connection. These vertically structured LED chips are approximately 150 microns in height and require a low forward voltage. Cree's XT Rectangular chips are tested for conformity to optical and electrica... |
| Description |
XT Rectangular LEDs
XT⑩ Rectangular LEDs
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| File Size |
218.34K /
4 Page |
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it Online |
Download Datasheet
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Novatek
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| Part No. |
NT6611
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| OCR Text |
...w pull high xx10 yes x x 0 0 b1 bond to gnd x x 1 1 b0 bond to v dd x x 0 1 b1 bond to gnd and b0 bond to v dd gnd gnd v dd b0 b1 gnd v dd b0 b1 gnd v dd b0 b1 v dd b0 b1 b1 = 1 b0 = 1 b1 = 0 b0 = 1 pcb b1 = 0 b0 = 0 nt6611 bonding option p... |
| Description |
1K 4-bit Microcontroller
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| File Size |
267.22K /
22 Page |
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it Online |
Download Datasheet |
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CREE[Cree, Inc]
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| Part No. |
CXXXUT200-SXXXX C460UT200-SXXXX C470UT200-SXXXX
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| OCR Text |
...l at 5 mA
* *
Single Wire bond Structure Class 2 ESD Rating
CxxxUT200-Sxxxx Chip Diagram
Top View G*SiC LED Chip 200 x 200 m Mesa (junction) 150 x 150 m Gold bond Pad 90 m Diameter
Bottom View SiC Substrate Bottom Surface 115... |
| Description |
Cree㈢ UltraThin⑩ LED
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| File Size |
262.06K /
5 Page |
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it Online |
Download Datasheet |
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RF MICRO DEVICES INC
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| Part No. |
RFSW2040D
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| OCR Text |
...inimum. this part has gold (au) bond pads requiring the use of gold (99.99% pure) bondwire. it is recommended that 25.4um diameter gold wire be used. recommended lead bond technique is thermocompression wedge bonding with 0.001" (25 ? m) d... |
| Description |
0 MHz - 25000 MHz RF/MICROWAVE SGL POLE SGL THROW SWITCH, 1.4 dB INSERTION LOSS
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| File Size |
497.92K /
6 Page |
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it Online |
Download Datasheet |
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Price and Availability
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