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MPS[Monolithic Power Systems]
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| Part No. |
MP2109DQ EV2109DQ-00A
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| OCR Text |
...ctors and output capacitors. 1. attach the positive and negative ends of the first load to the VOUT1 and GND pins, respectively. If using both outputs, attach the positive and negative ends of the second load to the VOUT2 and GND pins, resp... |
| Description |
Dual 800mA, 6V, 1.2MHz Synchronous Step-Down Converter Evaluation Board
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| File Size |
209.61K /
4 Page |
 View
it Online |
Download Datasheet
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http://
RFMD[RF Micro Devices]
RF Micro Devices, Inc.
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| Part No. |
NBB-502-T3T NBB-502 NBB-502-E NBB-502-T1
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| OCR Text |
...0 460
Application Notes
Die attach The die attach process mechanically attaches the die to the circuit substrate. In addition, it electrically connects the ground to the trace on which the chip is mounted, and establishes the thermal pa... |
| Description |
CASCADABLE BROADBAND GaAs MMIC AMPLIFIER DC TO 4GHz
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| File Size |
211.23K /
8 Page |
View
it Online |
Download Datasheet |
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http://
RFMD[RF Micro Devices]
RF Micro Devices, Inc.
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| Part No. |
NBB-X-K1 NBB-302 NBB-302-E NBB-302-T1
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| OCR Text |
...0 322
Application Notes
Die attach The die attach process mechanically attaches the die to the circuit substrate. In addition, it electrically connects the ground to the trace on which the chip is mounted, and establishes the thermal pa... |
| Description |
From old datasheet system
CASCADABLE BROADBAND GaAs MMIC AMPLIFIER DC TO 12GHz 级联宽带GaAs MMIC放大器直流到12GHz
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| File Size |
213.73K /
8 Page |
View
it Online |
Download Datasheet |
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http://
RFMD[RF Micro Devices]
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| Part No. |
NBB-X-K1 NBB-300 NBB-300-D NBB-300-E NBB-300-T1
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| OCR Text |
...ev A11 DS070328
NBB-300
Die attach * The die attach process mechanically attaches the die to the circuit substrate. In addition, the utilization of proper die attach processes electrically connect the ground to the trace on which the ch... |
| Description |
CASCADABLE BROADBAND GaAs MMIC AMPLIFIER DC TO 12GHz
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| File Size |
280.15K /
12 Page |
View
it Online |
Download Datasheet |
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http://
RFMD[RF Micro Devices]
|
| Part No. |
NBB-X-K1 NBB-400 NBB-400-D NBB-400-E NBB-400-T1
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| OCR Text |
... 060124
4-37
NBB-400
Die attach * The die attach process mechanically attaches the die to the circuit substrate. In addition, the utilization of proper die attach processes electrically connect the ground to the trace on which the ch... |
| Description |
CASCADABLE BROADBAND GaAs MMIC AMPLIFIER DC TO 8GHz
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| File Size |
183.30K /
10 Page |
View
it Online |
Download Datasheet |
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RFMD[RF Micro Devices]
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| Part No. |
NBB-X-K1 NBB-302 NBB-302_06 NBB-302-E NBB-302-T1
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| OCR Text |
...0 322
Application Notes
Die attach The die attach process mechanically attaches the die to the circuit substrate. In addition, it electrically connects the ground to the trace on which the chip is mounted, and establishes the thermal pa... |
| Description |
CASCADABLE BROADBAND GaAs MMIC AMPLIFIER DC TO 12GHz
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| File Size |
185.33K /
8 Page |
View
it Online |
Download Datasheet |
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http://
RFMD[RF Micro Devices]
|
| Part No. |
NBB-X-K1 NBB-402 NBB-402_06 NBB-402-E NBB-402-T1 NBB-40206
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| OCR Text |
...0 322
Application Notes
Die attach The die attach process mechanically attaches the die to the circuit substrate. In addition, it electrically connects the ground to the trace on which the chip is mounted, and establishes the thermal pa... |
| Description |
CASCADABLE BROADBAND GaAs MMIC AMPLIFIER DC TO 8GHz
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| File Size |
184.37K /
8 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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