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  thinning Datasheet PDF File

For thinning Found Datasheets File :: 111    Search Time::0.797ms    
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    PANASONIC[Panasonic Semiconductor]
Part No. 2SA2046
OCR Text ...ackage, allowing downsizing and thinning of the equipment and automatic insertion through the tape packing 1.50+0.25 -0.05 +0.20 2.80-0.30 I Features 1 0.95 2 0.95 1.900.20 I Absolute Maximum Ratings Ta = 25C Parameter C...
Description SILICON PNP EPITAXIAL PLANER TYPE

File Size 360.43K  /  1 Page

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    S7034-0907S S7033-1007 S7033-0907 S7034-1007S

Hamamatsu Corporation
Part No. S7034-0907S S7033-1007 S7033-0907 S7034-1007S
OCR Text ... view) S7033/S7034 series thinning 22 23 21 20 15 14 13 2 BEVEL V 1 2 12 11 V=122 H=512, 1024 3 4 5 8 9 10 4 BLANK 2 n SIGNAL OUT 4 BLANK 6 BEVEL 6 BEVEL KM...
Description CCD area image sensor

File Size 221.96K  /  8 Page

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    PANASONIC[Panasonic Semiconductor]
Part No. 2SC5846
OCR Text ...ackage, allowing downsizing and thinning of the equipment and automatic insertion through the tape packing 3 0.15 min. 0.800.05 1.200.05 0.520.03 0 to 0.01 5 (0.40) (0.40) 0.800.05 1.200.05 5 0.15 min. 0.23+0.05 -0.02 1 2 Absolute Ma...
Description From old datasheet system
For General Amplification

File Size 66.04K  /  3 Page

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    2SA2010

PANASONIC[Panasonic Semiconductor]
Part No. 2SA2010
OCR Text ...ackage, allowing downsizing and thinning of the equipment. * Complementary pair with 2SC5592 1 0.40+0.10 -0.05 3 0.16+0.10 -0.06 1.50+0.25 -0.05 2.8+0.2 -0.3 2 (0.95) (0.95) 1.90.1 2.90+0.20 -0.05 10 1.1+0.2 -0.1 (0...
Description    Silicon PNP epitaxial planer type

File Size 48.79K  /  2 Page

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    HFET2MI

TriQuint Semiconductor
Part No. HFET2MI
OCR Text ... * * * * * Mask making Wafer thinning Wafer dicing Substrate vias DC die-sort testing RF on-wafer testing Final visual testing 500 West Renner Road Richardson, Texas 75080 Semiconductors for Communications, Space and Military www.T...
Description 0.5-μm HFET 2MI
0.5-レm HFET 2MI

File Size 309.44K  /  6 Page

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    TQBIHEMT

TriQuint Semiconductor
Part No. TQBIHEMT
OCR Text ...oduction 150-mm wafer fab Wafer thinning Wafer Sawing Substrate Vias DC Diesort Testing Plastic Packaging RF Packaged Part Testing Training * GaAs Design Classes: * Half-Day Introduction; Upon request * Three-Day Technical Training, typ...
Description Combined 0.7楼矛m E/D pHEMT & 2楼矛m HBT Foundry Service

File Size 128.09K  /  3 Page

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