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Electronic Theatre Controls, Inc.
MITSUBISHI[Mitsubishi Electric Semiconductor]
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| Part No. |
RA06H8285M RA06H8285M-E01 RA06H8285M-01
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| OCR Text |
... sink. The module must first be screwed to the heat sink, then the leads can be soldered to the printed circuit board. M3 screws are recommended with a tightening torque of 0.4 to 0.6 Nm. Soldering and Defluxing: This module is designed for... |
| Description |
MITSUBISHI RF MOSFET MODULE
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| File Size |
56.33K /
8 Page |
 View
it Online |
Download Datasheet
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IRF
MITSUBISHI[Mitsubishi Electric Semiconductor]
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| Part No. |
RA03M8894M RA03M8894M-101 RDHA710SE10A2FK
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| OCR Text |
... sink. The module must first be screwed to the heat sink, then the leads can be soldered to the printed circuit board. M3 screws are recommended with a tightening torque of 0.4 to 0.6 Nm. Soldering and Defluxing: This module is designed for... |
| Description |
889-941MHz 3.6W 7.2V, 2 Stage Amp. For PORTABLE RADIO
Radiation Hardended, Solid-State Relay with Buffered Inputs
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| File Size |
90.50K /
8 Page |
View
it Online |
Download Datasheet |
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Philips
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| Part No. |
ECO8005
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| OCR Text |
... heat sinks (cat.no. 56293) are screwed on an aluminium plate (thickness 12 mm) which on its turn is screwed on the heat sink. Special attention has been paid to the surface finishing to keep the thermal resistance as low as possible. Dimen... |
| Description |
WideBand Class-A Linear Power Amplifiers
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| File Size |
139.96K /
17 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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