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micro-packaged Datasheet PDF File

For micro-packaged Found Datasheets File :: 1208 Search Time::1.125ms
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				Vectron International, Inc
Part No.	C499
OCR Text	... 883 --- test method standard micro circuits vectron international qsp - 90100 --- quality systems manual qsp - 90401 --- reliabi...packaged in such a manner that they will be protected from damage during shipping, handling, and st...
Description	Hi-Rel Standard OCXO
File Size	202.87K / 15 Page	View it Online	Download Datasheet

				List of Unclassifed Manufacturers List of Unclassifed Manufac... List of Unclassifed Man...
Part No.	Q-A-500 S2432-M S2432-O S-A-10AS S-A-25 S-A-100 S-A-5AS S3020-P S3020-S S1716-P OS-A-100 OS-A-5 OS-B-10AS SW6BPF-10 S3234-O S3417-O S3444-O EBSC15 EBSC100 S1227-O S3017-O SW5PF-10 SW5PFA-10 SW5PFAS-10 SW5PFR-10 S2745-S S2626-M S2626-O S2626-P S2626-S SW6WFCAS-10 S3444-S EBIPA100 S3219-O S-D-25 S-D-10 S-D-5 S-D-100 EBIPA15 S-E-10AS S-C-10AS S-C-5AS S-C-25 S8517-P EB41E1616 OS-E-10 OS-C-10AS OS-D-25 OS-E-100 OS-B-5AS OS-C-5AS OS-D-100 EB41P2821 Q-A-100 Q-A-5AS EB41P1616 EB41P1616-108
OCR Text	... hexacon thermotrac 1001, 1002; micro mini m65, m70; dial a temp1520, 1524; plato cs-36, weller ds-100, ec-1000, ec-2000 s2235-s 2.2" x 3.5"...packaged in anti-static material available in convenient packages (10, 50 or 100 per package) du...
Description	QUICK BRAID Cleaner, Faster, More Consistent DESOLDERING BRAID QUICK BRAID Cleaner, Faster, More Consistent DESOLDERING BRAID
File Size	384.93K / 9 Page	View it Online	Download Datasheet

				Bourns, Inc. Yangzhou yangjie electronic co., ltd BOURNS[Bourns Electronic Solutions]
Part No.	2FAA-M20R 1N4148
OCR Text	...-based device is packaged using micro leadframe packaging technology. The MLPs have an exposed die attach pad that provides the interconnect medium from die to PCB. The pads are arranged for easy PCB routing. The pitch is 0.5 mm and the dim...
Description	Switching Diode Integrated Passive & Active Device using MLP
File Size	289.96K / 4 Page	View it Online	Download Datasheet

				Bourns, Inc. BOURNS[Bourns Electronic Solutions]
Part No.	2FAI-M16R
OCR Text	...-based device is packaged using micro leadframe packaging technology. The MLPs have an exposed die attach pad that provides the interconnect medium from die to PCB. The pads are arranged for easy PCB routing. The pitch is 0.5 mm and the dim...
Description	Integrated Passive & Active Device using MLP
File Size	277.71K / 4 Page	View it Online	Download Datasheet

				Bourns Inc. BOURNS[Bourns Electronic Solutions] Bourns, Inc.
Part No.	2FAJ-M16R
OCR Text	...-based device is packaged using micro leadframe packaging technology. The MLPs have an exposed die attach pad that provides the interconnect medium from die to PCB. The pads are arranged for easy PCB routing. The pitch is 0.5 mm and the dim...
Description	Integrated Passive & Active Device using MLP
File Size	278.34K / 4 Page	View it Online	Download Datasheet

For micro-packaged Found Datasheets File :: 1208 Search Time::1.125ms
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