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ONSEMI[ON Semiconductor]
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| Part No. |
NST3906DXV6T5 NST3906DXV6T1
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| OCR Text |
...S
Characteristic (One Junction heated) Total Device Dissipation Derate above 25C Thermal Resistance Junction-to-Ambient Characteristic (Both Junctions heated) Total Device Dissipation Derate above 25C Thermal Resistance Junction-to-Ambient... |
| Description |
General Purpose PNP Transistor
Dual General Purpose Transistor
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| File Size |
98.25K /
8 Page |
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it Online |
Download Datasheet
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ONSEMI[ON Semiconductor]
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| Part No. |
NSTB60BDW1T1 NSTB60BDW1T1/D NSTB60BDW1T1-D NSTB60ADW1T1
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| OCR Text |
...S
Characteristic (One Junction heated) Total Device Dissipation TA = 25C Derate above 25C Thermal Resistance - Junction-to-Ambient Characteristic (Both Junctions heated) Total Device Dissipation TA = 25C Derate above 25C Thermal Resistance... |
| Description |
PNP General Purpose and NPN Bias Resistor Transistor Combination
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| File Size |
81.74K /
8 Page |
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it Online |
Download Datasheet |
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MIMIX[Mimix Broadband]
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| Part No. |
XA1000
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| OCR Text |
...d. A die bonder that utilizes a heated collet and provides scrubbing action to ensure total wetting to prevent void formation in a nitrogen atmosphere is recommended. The gold-tin eutectic (80% Au 20% Sn) has a melting point of approximatel... |
| Description |
DC-18.0 GHz GaAs MMIC 5-Bit Digital Attenuator
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| File Size |
414.26K /
6 Page |
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it Online |
Download Datasheet |
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MIMIX[Mimix Broadband]
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| Part No. |
XP1014
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| OCR Text |
...d. A die bonder that utilizes a heated collet and provides scrubbing action to ensure total wetting to prevent void formation in a nitrogen atmosphere is recommended. The gold-tin eutectic (80% Au 20% Sn) has a melting point of approximatel... |
| Description |
8.5-11.0 GHz GaAs MMIC Power Amplifier
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| File Size |
161.91K /
5 Page |
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it Online |
Download Datasheet |
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MIMIX[Mimix Broadband]
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| Part No. |
XP1015
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| OCR Text |
...d. A die bonder that utilizes a heated collet and provides scrubbing action to ensure total wetting to prevent void formation in a nitrogen atmosphere is recommended. The gold-tin eutectic (80% Au 20% Sn) has a melting point of approximatel... |
| Description |
43.5-46.5 GHz GaAs MMIC Power Amplifier
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| File Size |
267.04K /
5 Page |
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it Online |
Download Datasheet |
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MIMIX[Mimix Broadband]
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| Part No. |
XR1000
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| OCR Text |
...d. A die bonder that utilizes a heated collet and provides scrubbing action to ensure total wetting to prevent void formation in a nitrogen atmosphere is recommended. The gold-tin eutectic (80% Au 20% Sn) has a melting point of approximatel... |
| Description |
17.0-27.0 GHz GaAs MMIC Receiver
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| File Size |
487.68K /
6 Page |
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it Online |
Download Datasheet |
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MIMIX[Mimix Broadband]
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| Part No. |
XS1000
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| OCR Text |
...d. A die bonder that utilizes a heated collet and provides scrubbing action to ensure total wetting to prevent void formation in a nitrogen atmosphere is recommended. The gold-tin eutectic (80% Au 20% Sn) has a melting point of approximatel... |
| Description |
7.0-13.0 GHz GaAs MMIC 6-Bit Phase Shifter
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| File Size |
498.75K /
6 Page |
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it Online |
Download Datasheet |
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MIMIX[Mimix Broadband]
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| Part No. |
XX1002
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| OCR Text |
...d. A die bonder that utilizes a heated collet and provides scrubbing action to ensure total wetting to prevent void formation in a nitrogen atmosphere is recommended. The gold-tin eutectic (80% Au 20% Sn) has a melting point of approximatel... |
| Description |
2.5-6.0/5.0-12.0 GHz GaAs MMIC Active Doubler
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| File Size |
370.74K /
5 Page |
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it Online |
Download Datasheet |
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Price and Availability
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