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				LATTICE[Lattice Semiconductor]
Part No.	MACH120-12 MACH120-12JC MACH120-15JC
OCR Text	...back signals. The switch matrix distributes these signals back to the PAL blocks in an efficient manner that also provides for high performance. The design software automatically configures the switch matrix when fitting a design into the d...
Description	High-Performance EE CMOS Programmable Logic
File Size	157.38K / 20 Page	View it Online	Download Datasheet

				LATTICE[Lattice Semiconductor]
Part No.	MACH130-15 MACH130-15JC MACH130-20JC
OCR Text	...back signals. The switch matrix distributes these signals back to the PAL blocks in an efficient manner that also provides for high performance. The design software automatically configures the switch matrix when fitting a design into the d...
Description	High-Density EE CMOS Programmable Logic
File Size	186.62K / 24 Page	View it Online	Download Datasheet

				MOTOROLA[Motorola, Inc]
Part No.	MMBD2005T1 MMBD3005T1 MMBD1005LT1
OCR Text	...l energy more efficiently, then distributes this energy to the components. Because of this effect, the main body of a component may be up to 30 degrees cooler than the adjacent solder joints. 4 Motorola Small-Signal Transistors, FETs ...
Description	Switching Diode
File Size	159.99K / 8 Page	View it Online	Download Datasheet

				Motorola Mobility Holdings, Inc. ON Semi MOTOROLA[Motorola, Inc]
Part No.	MMFT2406T1 MMFT2406T MMFT2406T1_D ON2217
OCR Text	...l energy more efficiently, then distributes this energy to the components. Because of this effect, the main body of a component may be up to 30 degrees cooler than the adjacent solder joints. STEP 6 STEP 7 STEP 5 STEP 4 VENT COOLING HEATIN...
Description	MEDIUM POWER TMOS FET 700 mA 240 VOLTS 0.7 A, 240 V, 6 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-261AA N-hannel Enhancement-ode Logic Level SOT23 From old datasheet system
File Size	87.87K / 6 Page	View it Online	Download Datasheet

				MOTOROLA[Motorola, Inc]
Part No.	MSD42WT1 ON2379
OCR Text	...l energy more efficiently, then distributes this energy to the components. Because of this effect, the main body of a component may be up to 30 degrees cooler than the adjacent solder joints. STEP 1 PREHEAT ZONE 1 "RAMP" 200C STEP 2 S...
Description	From old datasheet system NPN GENERAL PURPOSE HIGH VOLTAGE TRANSISTORS SURFACE MOUNT
File Size	74.51K / 4 Page	View it Online	Download Datasheet

				NXP Semiconductors PHILIPS[Philips Semiconductors]
Part No.	PCK2002P PCK2002PD PCK2002PDP
OCR Text	...pose and PCI-X clock buffer. It distributes one input clock (BUF_IN) signal to four output clocks (BUF_OUTn). 3, 5, 7, 8 6 2 4 QUICK REFERENCE DATA SYMBOL tPLH tPHL tr tf ICC PARAMETER Propagation delay BUF_IN to BUF_OUTn Rise time F...
Description	140 MHz PCI-X clock buffer
File Size	69.03K / 8 Page	View it Online	Download Datasheet

				ONSEMI[ON Semiconductor]
Part No.	BAS16TT1
OCR Text	...l energy more efficiently, then distributes this energy to the components. Because of this effect, the main body of a component may be up to 30 degrees cooler than the adjacent solder joints. STEP 1 PREHEAT ZONE 1 "RAMP" 200C STEP 2 S...
Description	Silicon Switching Diode
File Size	123.64K / 8 Page	View it Online	Download Datasheet

				Motorola, Inc. MOTOROLA[Motorola, Inc]
Part No.	BAS16WT1 ON0115
OCR Text	...l energy more efficiently, then distributes this energy to the components. Because of this effect, the main body of a component may be up to 30 degrees cooler than the adjacent solder joints. STEP 1 PREHEAT ZONE 1 "RAMP" 200C STEP 2 S...
Description	CASE 419-02, STYLE 2 SC-70/SOT-323 From old datasheet system
File Size	96.40K / 6 Page	View it Online	Download Datasheet

For distributes Found Datasheets File :: 936 Search Time::1.453ms
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