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For bond Found Datasheets File :: 8863 Search Time::5.328ms
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				Hittite Microwave Corpo...
Part No.	HMC292-09
OCR Text	... thickness is .004. 3. typical bond pad is .004 square. 4. backside metallization: gold. 5. bond pad metallization: gold. 6. backside metal is ground. 7. connection not required for unlabeled bond pads. die packaging information [1] ...
Description	GaAs MMIC DOUBLE-BALANCED MIXER, 18 - 32 GHz
File Size	209.85K / 6 Page	View it Online	Download Datasheet

				Analog Devices
Part No.	HMC1110
OCR Text	... thickness is .004 3. typical bond pad is 0.0051 [3.303] square 4. backside metallization: gold 5. bond pad metallization: gold 6. backside metal is ground. 7. connection not required for unlabeled bond pads. 8. overall die size...
Description	Test Instrumentation
File Size	423.12K / 8 Page	View it Online	Download Datasheet

				Analog Devices
Part No.	HMC1105
OCR Text	...2. di e thickness is 0.004 3. bond pads 1, 2 & 3 are 0.0059 [0.150] x 0.0039 [0.099]. 4. ba ckside metallization: gold. 5. bo nd pad metallization: gold. 6. ba ckside metal is ground. 7. co nnection not required for unlabeled bo...
Description	Microwave Test Equipment
File Size	292.85K / 6 Page	View it Online	Download Datasheet

				Microsemi
Part No.	1N821-1E3 1N821A-1E3 1N829-1E3 1N827-1E3
OCR Text	...d. ? internal metallurgical bond . ? double plug construction. ? *j an, jantx, jantxv and jans qualification per mil - prf - 19500/159 available on 1n821 -1 , 823 - 1 , 825 -1 , 827 -1 and 829 -1. ? rohs compliant versio...
Description	Temperature Compensated Zeners (TCZ)
File Size	159.46K / 5 Page	View it Online	Download Datasheet

				Microsemi
Part No.	1N825UR-1E3 1N823UR-1E3 1N821UR-1E3 1N829UR-1E3 1N824UR-1 1N824UR-1E3 1N826UR-1 1N826UR-1E3 1N828UR-1 1N828UR-1E3 1N822UR-1E3
OCR Text	.... ? internal metallurgical bond . ? double plug construction. ? * jan, jantx, jantxv and jans qualification per mil - prf - 19500/159 available on 1n821 -1 , 823 - 1 , 825 -1 , 827 -1 and 829 -1. ? rohs compliant versi...
Description	Temperature Compensated Zeners (TCZ)
File Size	166.55K / 5 Page	View it Online	Download Datasheet

				Mini-Circuits
Part No.	KAT-9-D
OCR Text	...d die bottom ground (numbers on bond pads are for identifcation only, not marked on die) 0 l2 l3 l4 l1 h1 0 h3 h2 0 1 2 3 6 5 4 note: 1. bond pad material - gold 2. bottom of die - gold plated ...
Description	Fixed Attenuator Die
File Size	227.39K / 4 Page	View it Online	Download Datasheet

				Mini-Circuits
Part No.	KAT-7-D
OCR Text	...d die bottom ground (numbers on bond pads are for identifcation only, not marked on die) 0 l2 l3 l4 l1 h1 0 h3 h2 0 1 2 3 6 5 4 note: 1. bond pad material - gold 2. bottom of die - gold plated ...
Description	Fixed Attenuator Die
File Size	226.69K / 4 Page	View it Online	Download Datasheet

				Mini-Circuits
Part No.	KAT-6-D
OCR Text	...d die bottom ground (numbers on bond pads are for identifcation only, not marked on die) die dimensions in m l1 l2 l3 l4 h1 h2 h3 thickness bond pad size 125 375 625 750 85 615 700 100 125 x 100 note: 1. bond pad material - gold 2. bot...
Description	Fixed Attenuator Die
File Size	251.81K / 4 Page	View it Online	Download Datasheet

				Mini-Circuits
Part No.	KAT-4-D
OCR Text	...d die bottom ground (numbers on bond pads are for identifcation only, not marked on die) 0 l2 l3 l4 l1 h1 0 h3 h2 0 1 6 5 4 2 3 die dimensions in m l1 l2 l3 l4 h1 h2 h3 thickness rf-in/rf-out bond...
Description	Fixed Attenuator Die
File Size	236.51K / 4 Page	View it Online	Download Datasheet

				Mini-Circuits
Part No.	KAT-30-D
OCR Text	...d die bottom ground (numbers on bond pads are for identifcation only, not marked on die) 0 l2 l3 l4 l1 h1 0 h3 h2 0 1 2 3 6 5 4 note: 1. bond pad material - gold 2. bottom of die - gold plated ...
Description	Fixed Attenuator Die
File Size	232.91K / 4 Page	View it Online	Download Datasheet

For bond Found Datasheets File :: 8863 Search Time::5.328ms
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