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MACOM[Tyco Electronics]
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Part No. |
MA4SPS422 MA4SPS42 MA4SPS420
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OCR Text |
...ulk handling should insure that abrasion and mechanical shock are minimized.
Bonding
Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are conveniently located on the bottom surface ... |
Description |
SURMOUNT PIN Diodes
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File Size |
206.90K /
7 Page |
View
it Online |
Download Datasheet |
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MACOM[Tyco Electronics]
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Part No. |
MA4SPS502_1 MA4SPS5021
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OCR Text |
...ulk handling should insure that abrasion and mechanical shock are minimized.
circuit trace near the mounting pad while applying 60 to 100 grams of force perpendicular to the top surface of the die. Since the HMICTM glass is transparent, ... |
Description |
SURMOUNT PIN Diode
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File Size |
140.90K /
4 Page |
View
it Online |
Download Datasheet |
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MACOM[Tyco Electronics]
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Part No. |
MA4SPS502
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OCR Text |
...ulk handling should insure that abrasion and mechanical shock are minimized.
Functional Schematic1
Ls
Rp
Cp
Bonding Techniques
Attachment to a circuit board is made simple through the use of surface mount technology. Mounting ... |
Description |
Surface Mount Monolithic PIN Diode Chip
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File Size |
125.84K /
3 Page |
View
it Online |
Download Datasheet |
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MACOM[Tyco Electronics]
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Part No. |
MA4SPS552-W MA4SPS552 MA4SPS552-T
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OCR Text |
...ulk handling should insure that abrasion and mechanical shock are minimized. When soldering these devices to a hard substrate, hot gas die bonding is preferred. We recommend utilizing a vacuum tip and a force of 60 to 100 grams applied norm... |
Description |
Surface Mount Monolithic PIN Diode Chip
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File Size |
151.58K /
6 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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