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  8L41-12-011 Datasheet PDF File

For 8L41-12-011 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    Asahi Kasei Microsystem...
Part No. HG-0113
Description    Shipped in packet-tape reel(5,000pcs per reel)

File Size 170.78K  /  3 Page

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HUA FENG CIRCUIT





    90-0119

Maxim Integrated Products
Part No. 90-0119
Description PACKAGE LAND PATTERN, (U14E-3 / U14E 3)

File Size 20.18K  /  1 Page

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    90-0117

Maxim Integrated Products
Part No. 90-0117
Description PACKAGE LAND PATTERN, (U16) 4.4MM TSSOP, 16 LEADS

File Size 15.55K  /  1 Page

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    90-0112

Maxim Integrated Products
Part No. 90-0112
Description PACKAGE LAND PATTERN, 9S14) .150 SOIC 14 LEADS

File Size 23.31K  /  1 Page

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    21-0110

Dallas Semiconducotr
DALLAS[Dallas Semiconductor]
Part No. 21-0110
Description PACKAGE OUTLINE, 32L TQFP, 5x5x1.0mm

File Size 50.78K  /  2 Page

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    Tele-Tech
Part No. 9011-36
Description IQ ASSEMBLY

File Size 31.33K  /  1 Page

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    22-28-0110

Molex Electronics Ltd.
Part No. 22-28-0110
Description 2.54mm (.100) Pitch KK? Header, Breakaway, Vertical, with Friction Lock, 11 Circuits, Tin (Sn) Plating

File Size 167.49K  /  6 Page

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    22-28-0111

Molex Electronics Ltd.
Part No. 22-28-0111
Description 2.54mm (.100) Pitch KK? Header, Breakaway, Vertical, with Friction Lock, 11 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 55.32K  /  5 Page

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    90-0114

Maxim Integrated Products
Part No. 90-0114
Description PACKAGE LAND PATTERN, (U20E-1 / U20E 1) TSSOP 20 LEADS

File Size 20.58K  /  1 Page

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    03-09-2011

Molex Electronics Ltd.
Part No. 03-09-2011
Description THIS HOUSING IS FOR USE WITH THE .093 DIA. TERMININALS

File Size 34.12K  /  1 Page

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