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MITSUBISHI[Mitsubishi Electric Semiconductor]
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| Part No. |
RA20H8994M-E01 RA20H8994M-01 RA20H8994M
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| OCR Text |
... sink. The module must first be screwed to the heat sink, then the leads can be soldered to the printed circuit board. M3 screws are recommended with a tightening torque of 0.4 to 0.6 Nm. Soldering and Defluxing: This module is designed for... |
| Description |
896-902/ 935-941MHz 20W 12.5V, 3 Stage Amp. For MOBILE RADIO
896-902/ 935-941MHz 20W 12.5V 3 Stage Amp. For MOBILE RADIO
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| File Size |
64.64K /
8 Page |
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it Online |
Download Datasheet
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Philips
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| Part No. |
ECO7904
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| OCR Text |
... heatsinks (cat. no. 56293) are screwed together. The transistors are screwed on an aluminium plate (thickness 12 mm) which on its turn is screwed on the heatsink. Special attention has been paid to the surface finishing to keep the thermal... |
| Description |
WideBand Class-A Linear Power Amplifiers
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| File Size |
120.49K /
15 Page |
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it Online |
Download Datasheet |
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Hitachi
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| Part No. |
PF0031
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| OCR Text |
... possible. The module should be screwed up before lead soldering. It should not be given mechanical and thermal stress to lead and flange of the module. When the external parts (Isolator, Duplexer, etc.) of the module are changed, the elect... |
| Description |
MOS FET Power Amplifier Module
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| File Size |
81.81K /
13 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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