| |
|
 |
FILTRONIC[Filtronic Compound Semiconductors]
|
| Part No. |
LMA417
|
| OCR Text |
...es: * * * *
Recommended lead bond technique is thermocompression wedge bonding with 0.001" (25m) diameter wire. The bond tool force shall be 35-38 gram. bonding stage temperature shall be 230-240C, heated tool (150-160C) is recommended. ... |
| Description |
MEDIUM POWER PHEMT MMIC
|
| File Size |
173.68K /
4 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
FILTRONIC[Filtronic Compound Semiconductors]
|
| Part No. |
LMA419
|
| OCR Text |
...es: * * * *
Recommended lead bond technique is thermocompression wedge bonding with 0.001" (25m) diameter wire. The bond tool force shall be 35-38 gram. bonding stage temperature shall be 230-240C, heated tool (150-160C) is recommended. ... |
| Description |
LOW NOISE PHEMT MMIC
|
| File Size |
137.59K /
4 Page |
View
it Online |
Download Datasheet |
| |
|
|
MAXIM[Maxim Integrated Products]
|
| Part No. |
DS1249W
|
| OCR Text |
... Frame: Lead Finsh: Die Attach: bond Wire / Size: Flammability: Moisture Sensitivity (JEDEC J-STD20A) Date Code Range:
PACKAGE TESTS
DESCRIPTION SOLDERABILITY DATE CD CONDITION 0104 MIL-STD-883-2003 MIL-STD-883-2016 JESD22-B102 JESD22-B10... |
| Description |
module device DS1249W RELIABILITY REPORT
|
| File Size |
15.82K /
6 Page |
View
it Online |
Download Datasheet |
| |
|
|
Infineon
|
| Part No. |
SIDC81D60E6
|
| OCR Text |
...d soft solder die bonding die bond electrically conductive glue or solder wire bond al, 500m reject ink dot size ? 0.65mm ; max 1.2mm recommended storage environment store in original container, in dry nitrogen, < 6 mo... |
| Description |
Diodes - HV Chips - SIDC81D60E6, 600V, 200A
|
| File Size |
62.31K /
4 Page |
View
it Online |
Download Datasheet |
| |
|
|
FILTRONIC[Filtronic Compound Semiconductors]
|
| Part No. |
LMA420
|
| OCR Text |
...es: * * * *
Recommended lead bond technique is thermocompression wedge bonding with 0.001" (25m) diameter wire. The bond tool force shall be 35-38 gram. bonding stage temperature shall be 230-240C, heated tool (150-160C) is recommended. ... |
| Description |
LOW NOISE PHEMT MMIC
|
| File Size |
134.22K /
4 Page |
View
it Online |
Download Datasheet |
| |
|
|
Infineon
|
| Part No. |
SIDC81D120F6
|
| OCR Text |
...d soft solder die bonding die bond electrically conductive glue or solder wire bond al, 500m reject ink dot size ? 0.65mm ; max 1.2mm recommended storage environment store in original container, in dry nitrogen, < 6 mo... |
| Description |
Diodes - HV Chips - SIDC81D120F6, 1200V, 100A
|
| File Size |
62.18K /
4 Page |
View
it Online |
Download Datasheet |
| |
|
|
Infineon
|
| Part No. |
SIDC81D120E6
|
| OCR Text |
...d soft solder die bonding die bond electrically conductive glue or solder wire bond al, 500m reject ink dot size ? 0.65mm ; max 1.2mm recommended storage environment store in original container, in dry nitrogen, < 6 mo... |
| Description |
Diodes - HV Chips - SIDC81D120E6, 1200V,100A
|
| File Size |
62.29K /
4 Page |
View
it Online |
Download Datasheet |
| |
|
|
FILTRONIC[Filtronic Compound Semiconductors]
|
| Part No. |
LMA421
|
| OCR Text |
...es: * * * *
Recommended lead bond technique is thermocompression wedge bonding with 0.001" (25m) diameter wire. The bond tool force shall be 35-38 gram. bonding stage temperature shall be 230-240C, heated tool (150-160C) is recommended. ... |
| Description |
LOW NOISE PHEMT MMIC
|
| File Size |
128.45K /
4 Page |
View
it Online |
Download Datasheet |
| |
|
|
FILTRONIC[Filtronic Compound Semiconductors]
|
| Part No. |
LMA422
|
| OCR Text |
...Notes: * * * * Recommended lead bond technique is thermocompression wedge bonding with 0.001" (25m) diameter wire. The bond tool force shall be 35-38 gram. bonding stage temperature shall be 230-240C, heated tool (150-160C) is recommended. ... |
| Description |
LOW NOISE PHEMT MMIC
|
| File Size |
155.87K /
4 Page |
View
it Online |
Download Datasheet |
| |
|
|
FILTRONIC[Filtronic Compound Semiconductors]
|
| Part No. |
LMA441
|
| OCR Text |
...41
Notes: * Recommended lead bond technique is thermocompression wedge bonding with 0.001" (25m) diameter wire. The bond tool force shall be 35-38 gram. bonding stage temperature shall be 230-240C, heated tool (150-160C) is recommended. ... |
| Description |
MEDIUM POWER PHEMT MMIC
|
| File Size |
221.66K /
4 Page |
View
it Online |
Download Datasheet |
|
Price and Availability
|
