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  51163-0900 Datasheet PDF File

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    K4H511638G

Samsung semiconductor
Part No. K4H511638G
Description 512Mb G-die DDR SDRAM Specification
File Size 394.04K  /  24 Page

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Renesas Electronics Corporation
Part No. PV88090-05FQ2
Description High-Efficiency 3-Channel Buck Converter with dual LDO
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    51163-1400 0511631400

Molex Electronics Ltd.
Part No. 51163-1400 0511631400
Description 2.50mm (.098) Pitch Wire-to-Board Receptacle Housing, Positive Lock, With Retainer14 Circuits
File Size 280.08K  /  5 Page

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Renesas Electronics Corporation
Part No. iW9809-00
Description 65W Digital Quasi-Resonant RapidCharge™ AC/DC Controller
Tech specs 　 　

Official Product Page

    K4X51163PE-L

Samsung semiconductor
Part No. K4X51163PE-L
Description 32Mx16 Mobile DDR SDRAM
File Size 307.93K  /  20 Page

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Renesas Electronics Corporation
Part No. PV88090-06FQ2
Description High-Efficiency 3-Channel Buck Converter with dual LDO
Tech specs 　 　

Official Product Page

    0511631200

Molex Electronics Ltd.
Part No. 0511631200
Description 2.50mm (.098) Pitch Wire-to-Board Receptacle Housing, Positive Lock, With Retainer12 Circuits
2.50mm (.098") Pitch Wire-to-Board Receptacle Housing, Positive Lock, With Retainer12 Circuits
File Size 280.28K  /  5 Page

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Renesas Electronics Corporation
Part No. iW1709-00
Description PrimAccurate™ Digital Off-Line Controller with <50mW No-Load Power Consumption for Power Supplies up to 12W
Tech specs 　 　

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    Samsung Electronics Inc
Part No. K4H511638D
Description IC,SDRAM,DDR,4X8MX16,CMOS,TSSOP,66PIN,PLASTIC
File Size 53.66K  /  12 Page

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Renesas Electronics Corporation
Part No. 2SK2090(0)-T1-A
Description Power MOSFETs for Automotive, SSP, /
Tech specs 　 　

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    0511630800 51163-0800

Molex Electronics Ltd.
Part No. 0511630800 51163-0800
Description 2.50mm (.098) Pitch Wire-to-Board Receptacle Housing, Positive Lock, With Retainer8 Circuits
2.50mm (.098") Pitch Wire-to-Board Receptacle Housing, Positive Lock, With Retainer8 Circuits
File Size 280.27K  /  5 Page

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Amphenol Communications Solutions
Part No. 54112-804280900LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 28 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    51163-0600 0511630600

Molex Electronics Ltd.
Part No. 51163-0600 0511630600
Description 2.50mm (.098) Pitch Wire-to-Board Receptacle Housing, Positive Lock, With Retainer6 Circuits
2.50mm (.098") Pitch Wire-to-Board Receptacle Housing, Positive Lock, With Retainer6 Circuits
File Size 280.27K  /  5 Page

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Amphenol Communications Solutions
Part No. 54112-808260900LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 26 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    0511631500

Molex Electronics Ltd.
Part No. 0511631500
Description 2.50mm (.098) Pitch Wire-to-Board Receptacle Housing, Positive Lock, With Retainer15 Circuits
File Size 280.08K  /  5 Page

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Amphenol Communications Solutions
Part No. 90309-008LF
Description Minitek® 2.00mm, Wire To Board, Shrouded Header, Vertical, Through Hole, Double Row, 8 Positions
Tech specs 　 　

Official Product Page

    K4X51163PC-FE K4X51163PC-LE

Samsung semiconductor
Part No. K4X51163PC-FE K4X51163PC-LE
Description 32M x16 Mobile-DDR SDRAM
File Size 257.81K  /  23 Page

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Amphenol Communications Solutions
Part No. 51700-10900809CCLF
Description PwrBlade®, Power Connectors, 9P 8S 9P Vertical Header, Press Fit
Tech specs 　 　

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    K4H511638F

Samsung semiconductor
Part No. K4H511638F
Description 512Mb F-die DDR SDRAM Specification
File Size 397.07K  /  24 Page

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Amphenol Communications Solutions
Part No. 51723-10900000AALF
Description PwrBlade®, Power Supply Connectors, 9P STB Right Angle Header.
Tech specs 　 　

Official Product Page

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