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  solder-bond Datasheet PDF File

For solder-bond Found Datasheets File :: 2135    Search Time::3.516ms    
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    PHB24N03T

PHILIPS[Philips Semiconductors]
Part No. PHB24N03T
OCR Text ...of die Measured from drain lead solder point to centre of die Measured from source lead solder point to source bond pad REVERSE DIODE LIMITING VALUES AND CHARACTERISTICS Tj = 25C unless otherwise specified SYMBOL IDR IDRM VSD trr Qrr PA...
Description TrenchMOS transistor Standard level FET

File Size 61.78K  /  7 Page

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    1N759A-1 JANTX1N749A 1N749A

MICROSEMI[Microsemi Corporation]
Part No. 1N759A-1 JANTX1N749A 1N749A
OCR Text ...rd voltage @200 mA: 1.1 volts * Solder Temperatures: 260 C for 10 s (max) MECHANICAL AND PACKAGING * * * CASE: Hermetically sealed axial-lead glass DO-35 (DO-204AH) package TERMINALS: Leads, tin-lead plated solderable per MIL-STD-750...
Description Silicon 500 mW Zener Diodes
SILICON 400 mW ZENER DIODES

File Size 217.07K  /  4 Page

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    PACDN1408CR PACDN1404CR PACDN1404C PACDN1404 PACDN1416CR PACDN1416C PACDN1408C

CALMIRCO[California Micro Devices Corp]
Part No. PACDN1408CR PACDN1404CR PACDN1404C PACDN1404 PACDN1416CR PACDN1416C PACDN1408C
OCR Text ...t appliances and PCs. The large solder bumps allow for standard attachment to laminate boards without the use of underfill. SCHEMATIC DIA...Bond Trace Finish 0.300mm Round Non Solder Mask Defined Pads (NSMD) 0.350mm 0.152mm 0.360mm (sq.) 50...
Description ESD PROTECTION ARRAYS CHIP SCALE PACKAGE
ESD PROTECTION ARRAYS, CHIP SCALE PACKAGE
ESD PROTECTION ARRAYS/ CHIP SCALE PACKAGE

File Size 49.48K  /  3 Page

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    PACDN1408C PACDN1408CR PACDN2408CR PACDN2408C

CALMIRCO[California Micro Devices Corp]
Part No. PACDN1408C PACDN1408CR PACDN2408CR PACDN2408C
OCR Text ...t appliances and PCs. The large solder bumps allow for standard attachment to laminate boards without the use of underfill. SCHEMATIC DIA...Bond Trace Finish 0.300mm Round Non Solder Mask Defined Pads (NSMD) 0.350mm 0.152mm 0.360mm (sq.) 50...
Description ESD PROTECTION ARRAYS/ 8 CHANNEL/ CHIP SCALE PACKAGE
ESD PROTECTION ARRAYS, 8 CHANNEL, CHIP SCALE PACKAGE
ESD PROTECTION ARRAYS CHIP SCALE PACKAGE
ESD PROTECTION ARRAYS 8 CHANNEL CHIP SCALE PACKAGE

File Size 744.94K  /  3 Page

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    1N829UR MLL821 1N822AUR 1N822AUR-1 1N829UR-1TR 1N828AUR 1N828AUR-1 1N828AUR-1TR 1N821AUR-1TR 1N827UR MLL829TR-1 1N821AUR

MICROSEMI[Microsemi Corporation]
Microsemi, Corp.
Part No. 1N829UR MLL821 1N822AUR 1N822AUR-1 1N829UR-1TR 1N828AUR 1N828AUR-1 1N828AUR-1TR 1N821AUR-1TR 1N827UR MLL829TR-1 1N821AUR 1N821AUR-1 1N821AURTR 1N821AURTR-1 1N821UR 1N821UR-1 1N821UR-1TR 1N821URTR 1N821URTR-1 1N822AUR-1TR 1N822AURTR 1N822AURTR-1 1N822UR 1N822UR-1 1N822UR-1TR 1N822URTR 1N822URTR-1 1N823AUR 1N823AUR-1 1N823AUR-1TR 1N823AURTR 1N823AURTR-1 1N823UR 1N823UR-1 1N823UR-1TR 1N823URTR 1N823URTR-1 1N824AUR 1N824AUR-1 1N824AUR-1TR 1N824AURTR 1N824AURTR-1 1N824UR 1N824UR-1 1N824UR-1TR 1N824URTR 1N824URTR-1 1N825AUR 1N825AUR-1 1N825AUR-1TR 1N825AURTR 1N825AURTR-1 1N825UR 1N825UR-1 1N825UR-1TR 1N825URTR 1N825URTR-1 1N826AUR 1N826AUR-1 1N826AUR-1TR 1N826AURTR 1N826AURTR-1 1N826UR 1N826UR-1 1N826UR-1TR 1N826URTR 1N826URTR-1 1N827AUR 1N827AUR-1 1N827AUR-1TR 1N827AURTR-1 1N827UR-1 1N827UR-1TR 1N827URTR 1N827URTR-1 1N828AURTR 1N828AURTR-1 1N828UR 1N828UR-1TR 1N828URTR 1N828URTR-1 1N829AUR 1N829AUR-1 1N829AUR-1TR 1N829AURTR 1N829AURTR-1 1N829UR-1 1N829URTR 1N829URTR-1 JAN1N821AUR JAN1N821AUR-1 JAN1N821AUR-1TR JAN1N821AURTR JAN1N821AURTR-1 JAN1N821UR JAN1N821UR-1 JAN1N821UR-1TR JAN1N821URTR JAN1N821URTR-1 JAN1N822AUR JAN1N822AUR-1 JAN1N822AUR-1TR JAN1N822AURTR JAN1N822AURTR-1 JAN1N822UR
OCR Text ...than 50 mW in dissipated power) Solder Temperatures: 260oC for 10 s (max) o o MECHANICAL AND PACKAGING * * * * CASE: Hermetically seale...bond. When ordering devices with tighter tolerances than specified for the VZ voltage nominal of 6.1...
Description From old datasheet system
6.2 & 6.55 Volt Temperature Compensated Surface Mount Zener Reference Diodes
6000 GATE LOGIC CELL ARRAY - NOT RECOMMENDED for NEW DESIGN
3000 GATE LOGIC CELL ARRAY - NOT RECOMMENDED for NEW DESIGN
Triac; Thyristor Type:Snubberless; Peak Repetitive Off-State Voltage, Vdrm:1000V; On State RMS Current, IT(rms):6A; Gate Trigger Current (QI), Igt:35mA; Current, It av:6A; Gate Trigger Current Max, Igt:35mA RoHS Compliant: Yes
3.3 V quad buffer; 3-state - Description: 3.3V Buffer/Line Driver with Active LOW Output Enable (3-State) ; Logic switching levels: TTL ; Number of pins: 14 ; Output drive capability: -32/ 64 mA ; Propagation delay: 2.9@3.3V ns; Voltage: 2.7-3.6 V
Single Supply Voltage Supervisor for 5V Systems with Programmable Time Delay 8-PDIP -40 to 85
Single Supply Voltage Supervisor ror 5V Systems with Programmable Time Delay 8-SOIC 0 to 70
Triac; Thyristor Type:Standard; Peak Repetitive Off-State Voltage, Vdrm:1000V; On-State RMS Current, IT(rms):6A; Gate Trigger Current (QI), Igt:25mA; Current, It av:6A; Gate Trigger Current Max, Igt:25mA RoHS Compliant: Yes
Triac; Thyristor Type:Snubberless; Peak Repetitive Off-State Voltage, Vdrm:1000V; On State RMS Current, IT(rms):6A; Gate Trigger Current (QI), Igt:50mA; Current, It av:6A; Gate Trigger Current Max, Igt:50mA RoHS Compliant: Yes
6.2 & 6.55 Volt Temperature Compensated Surface Mount Zener Reference Diodes 6.55 V, SILICON, VOLTAGE REFERENCE DIODE, DO-213AA
3.3 V Quad 2-input NAND gate - Description: 3.3V Quad 2-Input NAND Gate ; Logic switching levels: TTL ; Number of pins: 14 ; Output drive capability: -32/ 64 mA ; Propagation delay: 2.7@3.3V ns; Voltage: 2.7-3.6 V 6.2
6.2 & 6.55 Volt Temperature Compensated Surface Mount Zener Reference Diodes 6.2 V, SILICON, VOLTAGE REFERENCE DIODE, DO-213AA
Single Supply Voltage Supervisor ror 5V Systems with Programmable Time Delay 8-SOIC -40 to 85 6.2
Single Supply Voltage Supervisor for 5V Systems with Programmable Time Delay 8-SOIC 0 to 70 6.2
SOCKET, D, PCB, STRAIGHT, 9WAY; Connector type:D Sub; Gender:Socket; Ways, No. of:9; Mating cycles, No. of:500; Termination method:Straight PCB; Material, contact:Copper alloy; Material:Steel; Contacts, No. of:9; Material, RoHS Compliant: Yes 6.2
0TC Reference Voltage Zener

File Size 184.26K  /  3 Page

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    ATA7609 ATA7609D1

ANADIGICS, Inc
Part No. ATA7609 ATA7609D1
OCR Text ...to the substrate using epoxy or solder. A good thermally conductive, silver-filled epoxy is recommended for epoxy mounting. If solder is use...bond force, time, and ultrasonic power are all critical parameters and should be optimized to achiev...
Description 10 Gb/s High Overload TIA
Transimpedance Amplifiers (TIAs)

File Size 175.17K  /  12 Page

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    Motorola Semiconductor Products Inc
Part No. MPX4100AS MPX4100AP
OCR Text ...e correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards wit...
Description Signal Conditioner, Other - Datasheet Reference
From old datasheet system

File Size 113.96K  /  10 Page

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    Motorola
Part No. MPX4100A
OCR Text ...e correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards wit...
Description MPX4100A Integrated Silicon Pressure Sensor Manifold Absolute Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
From old datasheet system
Integrated Silicon Pressure Sensor for Manifold Absolute Pressure Applications

File Size 154.63K  /  10 Page

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    SMCTTA32N14A10

List of Unclassifed Manufacturers
ETC[ETC]
Electronic Theatre Controls, Inc.
Part No. SMCTTA32N14A10
OCR Text ...ched to the silicon using 302oC solder. An epoxy underfill is applied to protect the high voltage termination from debris. All exterior meta...Bond Area Package Gate Return Bond Area Gate Bond Area Cathode Bond Area ThinPakTM Schemat...
Description Advanced Pulse Power Device N-MOS VCS, ThinPakTM

File Size 670.51K  /  5 Page

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    BZX84C5V1 BZX84C6V2 BZX84C9V1 BZX84C10 BZX84C47 BZX84C43 BZX84C36 BZX84C33 BZX84C11 BZX84C4V7 BZX84C39 BZX84C22 BZX84C20

RECTRON LTD
RECTRON[Rectron Semiconductor]
Part No. BZX84C5V1 BZX84C6V2 BZX84C9V1 BZX84C10 BZX84C47 BZX84C43 BZX84C36 BZX84C33 BZX84C11 BZX84C4V7 BZX84C39 BZX84C22 BZX84C20 BZX84C BZX84C12 BZX84C13 BZX84C15 BZX84C16 BZX84C18 BZX84C24 BZX84C27 BZX84C3V3 BZX84C3V6 BZX84C3V9 BZX84C4V3 BZX84C5V6 BZX84C6V8 BZX84C7V5 BZX84C8V2 BZX84C10-T1
OCR Text ... Materi als SOT-23 42 Alloy Solder Plati ng Au Epoxy Si li con A. NC B. ANODE C. CATHODE Electrical Characteristics (Ta=25oC) ZENER VOLTAGE Vz(V)* at Iz = 5mA min. BZX84C3V3 C 3V 6 C 3V 9 C 4V 3 C 4V 7 C 5V 1 C 5V 6 C 6V 2 C 6V 8...
Description 10 V, 0.3 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE
SURFACE MOUNT ZENER DIODE

File Size 20.47K  /  2 Page

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For solder-bond Found Datasheets File :: 2135    Search Time::3.516ms    
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