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Twilight Technology, Inc.
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| Part No. |
DPZ256X32IV3-12I
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| OCR Text |
...nary new memory subsystem using dense-pac microsystems? ceramic stackable leadless chip carriers (slcc) mounted on a co-fired ceramic substrate. it offers 8 megabits of flash eeprom in a single package envelope of 1.090" x 1.090" x .252". ... |
| Description |
256K X 32 FLASH 12V PROM MODULE, 120 ns, PGA66 CERAMIC, MODULE, SLCC, PGA-66
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| File Size |
948.04K /
14 Page |
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it Online |
Download Datasheet
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Twilight Technology, Inc.
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| Part No. |
DPZ128X32IV3-12I
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| OCR Text |
...nary new memory subsystem using dense-pac microsystems? ceramic stackable leadless chip carriers (slcc) mounted on a co-fired ceramic substrate. it offers 4 megabits of flash eeprom in a single package envelope of 1.090" x 1.090" x .163". ... |
| Description |
128K X 32 FLASH 12V PROM MODULE, 120 ns, PGA66 CERAMIC, MODULE, SLCC, PGA-66
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| File Size |
875.79K /
14 Page |
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it Online |
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Twilight Technology, Inc.
Elektron Technology PLC
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| Part No. |
DP5Z2MW16PY3-12M DP5Z2MW16PH3-12M DP5Z2MW16PI3-12C
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| OCR Text |
...nary new memory subsystem using dense-pac microsystems? ceramic stackable leadless chip carriers (slcc). available unleaded, straight leaded, ??j?? leaded, gullwing leaded packages, or mounted on a 50-pin pga co-fired ceramic substrate. th... |
| Description |
2M X 16 FLASH 5V PROM MODULE, 120 ns, CQCC48 HERMETIC SEALED, CERAMIC, LEADLESS, MODULE, SLCC-48
2M X 16 FLASH 5V PROM MODULE, 120 ns, QFP48 HERMETIC SEALED, CERAMIC, GULLWING, MODULE, SLCC-48
2M X 16 FLASH 5V PROM MODULE, 120 ns, QIP48 HERMETIC SEALED, CERAMIC, STRAIGHT, MODULE, SLCC-48
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| File Size |
4,552.39K /
21 Page |
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it Online |
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Twilight Technology, Inc.
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| Part No. |
DPZ512X16II3-20C DPZ512X16IY3-20C DPZ512X16IH3-20C DPZ512X16IA3-20C
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| OCR Text |
...nary new memory subsystem using dense-pac microsystems? ceramic stackable leadless chip carriers (slcc). available in straight leaded, ??j?? leaded or gullwing leaded packages, or mounted on a 50-pin pga co-fired ceramic substrate. the modu... |
| Description |
512K X 16 FLASH 12V PROM MODULE, 200 ns, QIP48 HERMETIC SEALED, CERAMIC, STRAIGHT, MODULE, SLCC-48
512K X 16 FLASH 12V PROM MODULE, 200 ns, CQCC48 HERMETIC SEALED, CERAMIC, LEADLESS, MODULE, SLCC-48
512K X 16 FLASH 12V PROM MODULE, 200 ns, QFP48 HERMETIC SEALED, CERAMIC, GULLWING, MODULE, SLCC-48
512K X 16 FLASH 12V PROM MODULE, 200 ns, PGA50 HERMETIC SEALED, CERAMIC, MODULE, SLCC, PGA-50
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| File Size |
1,136.25K /
16 Page |
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it Online |
Download Datasheet |
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Twilight Technology, Inc.
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| Part No. |
DPZ256X16IH3-17C DPZ256X16II3-17C
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| OCR Text |
...nary new memory subsystem using dense-pac microsystems? ceramic stackable leadless chip carriers (slcc). available in straight leaded, ??j?? leaded or gullwing leaded packages, or mounted on a 50-pin pga co-fired ceramic substrate. the modu... |
| Description |
256K X 16 FLASH 12V PROM MODULE, 170 ns, QFP48 HERMETIC SEALED, CERAMIC, GULLWING, MODULE, SLCC-48
256K X 16 FLASH 12V PROM MODULE, 170 ns, QIP48 HERMETIC SEALED, CERAMIC, STRAIGHT, MODULE, SLCC-48
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| File Size |
1,089.46K /
16 Page |
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it Online |
Download Datasheet |
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GSI Technology, Inc.
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| Part No. |
DPS512S8U-70C DPS512S8U-12C
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| OCR Text |
...ently released to production at dense-pac microsystems, inc. dense-pac reserves the right to change products or specifications herein without prior notice. 30a082-00 rev. d 1
dps512s8u dense-pac microsystems, inc. dc output characteristi... |
| Description |
x8 SRAM Module x8的SRAM模块
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| File Size |
555.23K /
6 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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