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Mitsubishi Electric Corporation MITSUBISHI[Mitsubishi Electric Semiconductor]
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Part No. |
M5M5Y416CWG-85HI
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OCR Text |
...giv es the best solution f or a compaction of mounting area as well as f lexibility of wiring pattern of printed circuit boards. Version, Operating temperature Part name -
FEATURES
Single 1.65~2.3V power supply Small stand-by current: 0... |
Description |
4194304-BIT (262144-WORD BY 16-BIT) CMOS STATIC RAM
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File Size |
81.16K /
9 Page |
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it Online |
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TRIQUINT[TriQuint Semiconductor]
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Part No. |
TGA2511
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OCR Text |
... size of 2.46mm2 allows ease of compaction into MultiChip-Modules (MCMs). The TGA2511 is 100% DC and RF tested onwafer to ensure performance compliance. Lead-Free & RoHS compliant.
Primary Applications
* * * X-Band Radar EW, ECM Point-t... |
Description |
X-Band Low Noise Amplifier
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File Size |
158.04K /
14 Page |
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it Online |
Download Datasheet
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compaction Found Datasheets File :: 76 Search Time::5.407ms Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | |
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Price and Availability
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