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Micross Components
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Part No. |
HMC424
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OCR Text |
...nches (millimeters). 2. typical bond pad is .004 square. 3. typical bond pad spacing is .006 center to center except as noted. 4. backside metalization: gold 5. backside metal is ground 6. bond pad metalization: gold pad number function... |
Description |
Space Applications
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File Size |
891.10K /
9 Page |
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it Online |
Download Datasheet
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Micross Components
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Part No. |
HMC341
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OCR Text |
...e thickness is .004 3. typical bond is .004 square 4. backside metallization: gold 5. bond pad metallization: gold 6. backside metal is ground. 7. connection not required for unlabeled bond pads. drain bias voltage (vdd) +5.5 vdc rf ... |
Description |
Millimeterwave Point-to-Point Radios
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File Size |
879.90K /
9 Page |
View
it Online |
Download Datasheet
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Price and Availability
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