28100 pdf Datasheet P4 Part Num --- IC-ON-LINE


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28100 Datasheet PDF File

For 28100 Found Datasheets File :: 80+ Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 |

					Molex Electronics Ltd.
Part No.	0444281003 44428-1003
Description	3.00mm (.118) Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
File Size	232.75K / 4 Page	View it Online	Download Datasheet

						Renesas Electronics Corporation
Part No.	HM28100TTI5SL
Description	Low Power SRAM, TSOP(2), /Tray
Tech specs				Official Product Page

HUA FENG CIRCUIT

					Molex Electronics Ltd.
Part No.	0444281004 44428-1004
Description	3.00mm (.118) Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Right Angle
File Size	232.66K / 4 Page	View it Online	Download Datasheet

						Renesas Electronics Corporation
Part No.	HM28100TTI5SEZ
Description	Low Power SRAM, TSOP(2), /Embossed Tape
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0444281005 44428-1005
Description	3.00mm (.118) Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Right Angle, without Snap-in Plastic Peg PCB Lock, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
File Size	232.70K / 4 Page	View it Online	Download Datasheet

						Renesas Electronics Corporation
Part No.	DA7281-00V4C
Description	Low Power, Wide-Bandwidth Haptic Driver with Multiple I²C Addresses
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	0444281006 44428-1006
Description	3.00mm (.118) Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Right Angle, without Snap-in Plastic Peg PCB Lock, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
File Size	232.70K / 4 Page	View it Online	Download Datasheet

						Renesas Electronics Corporation
Part No.	DA7281-00FV2
Description	Low Power, Wide-Bandwidth Haptic Driver with Multiple I²C Addresses
Tech specs				Official Product Page

					Molex Electronics Ltd.
Part No.	1050281001 SD-105028-101
Description	Camera Socket for Mobile Phone, Top Mount, SMT, Side Contact Type, 8.5x8.5
File Size	243.11K / 4 Page	View it Online	Download Datasheet

						Renesas Electronics Corporation
Part No.	DA7281-00FVC
Description	Low Power, Wide-Bandwidth Haptic Driver with Multiple I²C Addresses
Tech specs				Official Product Page

					http:// Molex Electronics Ltd.
Part No.	SD-44428-001 0444281002 44428-1002
Description	3.00mm (.118) Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg
File Size	232.75K / 4 Page	View it Online	Download Datasheet

						Renesas Electronics Corporation
Part No.	HM28100TTI5SE
Description	Low Power SRAM, TSOP(2), /Tray
Tech specs				Official Product Page

					Hynix Semiconductor
Part No.	HY628100BLG-55
Description	SRAM,128KX8,CMOS,SOP,32PIN,PLASTIC From old datasheet system
File Size	89.36K / 10 Page	View it Online	Download Datasheet

						Renesas Electronics Corporation
Part No.	5962-92281-000
Description	54FCT162827T
Tech specs				Official Product Page

					Hynix Semiconductor, Inc.
Part No.	HY628100ALLP-10
Description	128K X 8 STANDARD SRAM, 100 ns, PDIP32 0.600 INCH, PLASTIC, DIP-32
File Size	182.56K / 12 Page	View it Online	Download Datasheet

						Renesas Electronics Corporation
Part No.	DA7281-00V42
Description	Low Power, Wide-Bandwidth Haptic Driver with Multiple I²C Addresses
Tech specs				Official Product Page

					Broadcom, Corp.
Part No.	GMM7328100BS-6 GMM7328100BS-8
Description	x32 Fast Page Mode DRAM Module X32号快速页面模式内存模
File Size	878.20K / 16 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10073228-10000MLF
Description	PCI Express® GEN 3 Card Edge, Storage and Server Connector, for SIOM, Vertical, Surface Mount, x1, 36 Positions, 1.00mm (0.039in) Pitch
Tech specs				Official Product Page

					Hynix Semiconductor, Inc.
Part No.	HY628100BLLG-70
Description	IC-SMD-SRAM 1MB 集成电路贴片静态存储器1MB
File Size	129.21K / 9 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54112-415281000LF
Description	BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Through Hole, Double Row, 28 Positions
Tech specs				Official Product Page

For 28100 Found Datasheets File :: 80+ Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 |

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