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  TIM7785-30SL Datasheet PDF File

For TIM7785-30SL Found Datasheets File :: 73+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 |   

    OP830SL

OPTEK Technologies
Part No. OP830SL
Description NPN Silicon Photodarlington

File Size 360.10K  /  2 Page

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Texas Instruments

Part No. LMX2430SLEX/NOPB
Description 3.0 GHz/0.8 GHz PLLatinum Dual High Frequency Synthesizer for RF Personal Communications 20-ULGA -40 to 85
Tech specs    

Get Free Sample

Official Product Page

HUA FENG CIRCUIT





    Mitsubishi Electric, Corp.
MITSUBISHI[Mitsubishi Electric Semiconductor]
Mitsubishi Electric Corporation
Part No. FU-630SLD-8M1 FU-630SLD-10M1 FU-630SLD-12M1
Description 1.48 um PUMP LD MODULE WITH SINGLEMODE FIBER (EDFA) 劳工.48微米泵模块,单模光纤(掺铒光纤放大器

File Size 59.63K  /  3 Page

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Amphenol Communications Solutions

Part No. 76342-330SLF
Description Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Top Entry, Double Row , 60 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    Toshiba, Corp.
Part No. TIM5964-30SL
Description MICROWAVE POWER GaAs FET 微波功率GaAs场效应管

File Size 163.47K  /  4 Page

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Amphenol Communications Solutions

Part No. 71991-330SLF
Description Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Dual Entry, 60 Position, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    FI-XPB30SL-HF10

Japan Aviation Electronics Industry, Ltd.
Part No. FI-XPB30SL-HF10
Description BOTTOM TYPE

File Size 133.95K  /  1 Page

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Amphenol Communications Solutions

Part No. 89361-130SLF
Description Minitek® IDC 2.00mm Pitch, Wire To Board Connector, Receptacle.
Tech specs    

Official Product Page

    TIM5964-30SL

Toshiba Semiconductor
Part No. TIM5964-30SL
Description MICROWAVE POWER GaAs FET

File Size 173.43K  /  4 Page

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Amphenol Communications Solutions

Part No. 89947-130SLF
Description Minitek® 2.00mm, Wire/Cable To Board Connectors, IDC 2mm Receptacle Board/Wire to Board Connectors, Double Row, 30 Position, 2mm Pitch
Tech specs    

Official Product Page

    TOSHIBA[Toshiba Semiconductor]
Part No. TIM6472-30SL
Description MICROWAVE POWER GaAs FET

File Size 132.10K  /  4 Page

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Amphenol Communications Solutions

Part No. 89361-730SLF
Description Minitek® IDC 2.00mm Pitch, Wire To Board Connector, Receptacle.
Tech specs    

Official Product Page

    2211-30SL 2211-20SL 2214-25ML 2214-40ML 2214-4VL 2211-4VL 2214-10SL 2214-30SL

JDS Uniphase Corporation
Part No. 2211-30SL 2211-20SL 2214-25ML 2214-40ML 2214-4VL 2211-4VL 2214-10SL 2214-30SL
Description Air-Cooled Argon-Ion Laser Heads in Cylindrical and Rectangular Packages

File Size 310.03K  /  6 Page

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Amphenol Communications Solutions

Part No. 89947-730SLF
Description Minitek® 2.00mm, Wire/Cable To Board Connectors, IDC 2mm Receptacle Board/Wire to Board Connectors, Double Row, 30 Position, 2mm Pitch
Tech specs    

Official Product Page

    Toshiba Corporation
Part No. TIM3742-30SL-341
Description MICROWAVE POWER GaAs FET

File Size 136.41K  /  4 Page

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    TOSHIBA[Toshiba Semiconductor]
Part No. TIM3742-30SL-341 TIM3742
Description MICROWAVE POWER GaAs FET
From old datasheet system

File Size 134.91K  /  4 Page

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    AP1530S AP1530SL-13 AP1530SL-U AP1530

Diodes Incorporated
Part No. AP1530S AP1530SL-13 AP1530SL-U AP1530
Description PWM CONTROL 3A STEP-DOWN CONVERTER

File Size 222.20K  /  8 Page

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For TIM7785-30SL Found Datasheets File :: 73+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 |   

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Part: TIM7785-35SL
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Unit price for :
    50: $149.54
  100: $142.06
1000: $134.58

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