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Hamamatsu Photonics K.K.
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Part No. |
S10202-08 S10202-16 S10201-04
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OCR Text |
...w osb6 osb7 osb8 osa6 osa7 osa8 thinning v=128 h=512 8 (number of ports) thinning osa1 osa2 osa3 osb1 osb2 osb3 8 blank 512 pixels 128 tdi stage kmpdc0252ea timing chart kmpdc0253eb b port side readout osb rgb p2hb, sgb p1hb tgb p1v p2... |
Description |
Back-thinned TDI-CCD Operating the back-thinned CCD in TDI mode delivers high sensitivity. 回到清淡TDI发动机,防治荒漠化工作的后台薄TDI的模式在防治荒漠化公约提供高灵敏度
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File Size |
222.37K /
11 Page |
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TriQuint Semiconductor,Inc.
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Part No. |
TQPHT
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OCR Text |
... ? hot lot cycle time ? with thinning and sawing; optional backside vias process qualification status ? mature process based on tqtx, 150-mm process ? process released to production ? full 150mm wafer process qualification comple... |
Description |
0.5 um pHEMT Foundry Service
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File Size |
200.66K /
5 Page |
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TriQuint Semiconductor,Inc.
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Part No. |
TQTRX
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OCR Text |
...ction 150 mm wafer fab ? wafer thinning ? wafer sawing ? substrate vias ? dc die sort testing ? rf on-wafer testing ? plastic packaging ? rf packaged part testing please contact your local triquint semiconductor representative or ... |
Description |
Advanced Passives & MESFET Foundry Service
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File Size |
166.57K /
6 Page |
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it Online |
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Hamamatsu Photonics K.K.
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Part No. |
S7034-1007S S7034-0907S
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OCR Text |
...blank v=122 h=512, 1024 4 bevel thinning thinning 1 23 45 2 3 4 5 v h 6 bevel 6 bevel 13 10 2 n signal out kmpdc0076ea integration period (shutter must be open) vertical binning period (shutter must be closed) p1v p2v, tg p1h p2h, sg read... |
Description |
CCD area image sensor 防治荒漠化面积图像传感器
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File Size |
215.41K /
8 Page |
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Hamamatsu
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Part No. |
S11155-2048 S11156-2048
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OCR Text |
...p view in dimensional outline)
thinning
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thinning
Resistive gate D5 D6 D7 D8 D9 D10 S1 S2 S3 S4 Storage section
24 D1 D2 D3 D4
S2045 S2046 S2047 S2048
D11 D12 D13 D14 D15 D16
w... |
Description |
Back-thinned CCD image sensors
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File Size |
445.42K /
8 Page |
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it Online |
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Price and Availability
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