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solder-bond Datasheet PDF File

For solder-bond Found Datasheets File :: 2135 Search Time::8.5ms
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				INTERSIL[Intersil Corporation]
Part No.	HFA3127 HFA3127MJ_883 HFA3127_883 FN3967 HFA3127/883
OCR Text	...he finished lead surfaces, when solder dip or tin plate lead finish is applied. 3. Dimensions b1 and c1 apply to lead base metal only. Dimension M applies to lead plating and finish thickness. 4. Corner leads (1, N, N/2, and N/2+1) may be c...
Description	Ultra High Frequency Transistor Array From old datasheet system
File Size	53.41K / 7 Page	View it Online	Download Datasheet

				NXP Semiconductors PHILIPS[Philips Semiconductors]
Part No.	PHB130N03LT
OCR Text	...of die Measured from drain lead solder point to centre of die Measured from source lead solder point to source bond pad December 1997 2 Rev 1.200 Philips Semiconductors Product specification TrenchMOSTM transistor Logic le...
Description	TrenchMOS transistor Logic level FET
File Size	62.75K / 8 Page	View it Online	Download Datasheet

				NXP Semiconductors PHILIPS[Philips Semiconductors]
Part No.	PHB130N03T
OCR Text	...of die Measured from drain lead solder point to centre of die Measured from source lead solder point to source bond pad December 1997 2 Rev 1.200 Philips Semiconductors Product specification TrenchMOSTM transistor Standard...
Description	TrenchMOS transistor Standard level FET
File Size	64.83K / 8 Page	View it Online	Download Datasheet

				Agilent(Hewlett-Packard... http:// HP[Agilent(Hewlett-Packard)] Agilent (Hewlett-Packard)
Part No.	HSMG-H670 HSMG-H690 HSMX-H670 HSMX-H690 HSMD-H670 HSMD-H690 HSMY-H670 HSMY-H690 HSMS-H690 HSMS-H670
OCR Text	...sed Optics * Compatible with IR Solder Process * Four Colors Available * Available in 8 mm Tape on 7" (178 mm) Diameter Reels Description...bond between the chip and printed circuit board. Consequently as a result of the robust construction...
Description	Surface Mount Flip Chip LEDs 倒装芯片表面贴装发光二极
File Size	230.42K / 8 Page	View it Online	Download Datasheet

				NXP Semiconductors PHILIPS[Philips Semiconductors]
Part No.	PHB45N03LT
OCR Text	...of die Measured from drain lead solder point to centre of die Measured from source lead solder point to source bond pad REVERSE DIODE LIMITING VALUES AND CHARACTERISTICS Tj = 25C unless otherwise specified SYMBOL IDR IDRM VSD trr Qrr PA...
Description	TrenchMOS transistor Logic level FET
File Size	60.84K / 8 Page	View it Online	Download Datasheet

				NXP Semiconductors N.V. PHILIPS[Philips Semiconductors]
Part No.	PHB45N03T PHB42N03T
OCR Text	...of die Measured from drain lead solder point to centre of die Measured from source lead solder point to source bond pad REVERSE DIODE LIMITING VALUES AND CHARACTERISTICS Tj = 25C unless otherwise specified SYMBOL IDR IDRM VSD trr Qrr PA...
Description	TrenchMOS transistor Standard level FET 45 A, 30 V, 0.024 ohm, N-CHANNEL, Si, POWER, MOSFET
File Size	65.57K / 8 Page	View it Online	Download Datasheet

				PHILIPS[Philips Semiconductors] NXP Semiconductors
Part No.	PHB50N03T PHB50N03
OCR Text	...of die Measured from drain lead solder point to centre of die Measured from source lead solder point to source bond pad REVERSE DIODE LIMITING VALUES AND CHARACTERISTICS Tj = 25C unless otherwise specified SYMBOL IDR IDRM VSD trr Qrr PA...
Description	N-channel TrenchMOS transistor Logic level FET TrenchMOS transistor Standard level FET
File Size	63.61K / 7 Page	View it Online	Download Datasheet

				NXP Semiconductors PHILIPS[Philips Semiconductors]
Part No.	PHD3N20E
OCR Text	...f die Measured from source lead solder point to source bond pad VGS = 0 V; VDS = 25 V; f = 1 MHz SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS Tj = 25 C unless otherwise specified SYMBOL IS ISM VSD trr Qrr PARAMETER Continuous source c...
Description	PowerMOS transistor
File Size	52.25K / 7 Page	View it Online	Download Datasheet

				NICHIA CORPORATION List of Unclassifed Manufacturers ETC[ETC] Electronic Theatre Controls, Inc.
Part No.	NSPB320 NSPB320BS
OCR Text	...uld be paid during soldering. * Solder the LED no closer than 3mm from the base of the epoxy bulb. Soldering beyond the base of the tie bar ...bond failure or resin deterioration, will occur. Nichia's LEDs should not be soldered directly to do...
Description	SPECIFICATIONS FOR NICHIA BLUE LED 蓝规格的日亚化学发光二极
File Size	362.42K / 15 Page	View it Online	Download Datasheet

				Motorola
Part No.	MPXA6115A MPXH6115A
OCR Text	...e correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boar...
Description	MPXA6115A High Temperature Accuracy Integrated Silicon Pressure Sensor for Manifold Absolute Pressure, Altimeter or Barometer Applications On-Chip Signal Conditioned, Temperature Compensated and Calibrated High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure
File Size	145.11K / 9 Page	View it Online	Download Datasheet

For solder-bond Found Datasheets File :: 2135 Search Time::8.5ms
Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |