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  solder-bond Datasheet PDF File

For solder-bond Found Datasheets File :: 2135    Search Time::5.688ms    
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    Solidtron
Part No. SMCTTA65N14A10
OCR Text ...ed to the silicon using 302 o c solder. an epoxy underfill is applied to protect the high voltage termination from debris. all exterior...bond area anode bond area advanced pulse power device n- mos vcs, thinpak tm smct ta65n14a10 p...
Description Power Management

File Size 208.69K  /  5 Page

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    Solidtron
Part No. SMCTTA32N14A10
OCR Text ...ed to the silicon using 302 o c solder. an epoxy underfill is applied to protect the high voltage termination from debris. all exterior...bond area of thinpak. (see figure 7.) typical performance curves (unless otherwise specified) figur...
Description Advanced Pulse Power Device N-MOS VCS

File Size 703.62K  /  5 Page

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    Mini-Systems, Inc.
Part No. RSMT23AP-10R60/10R60B RSMT23AP-10R60/10R60D RSMT23AP-45303/45303D RSMT23AP-95303/95303D RSMT23AP-53003/53003D RSMT23AP-53603/53603D RSMT23AP-49303/49303D RSMT23AP-93103/93103D RSMT23AP-298R0/298R0B RSMT23AP-298R0/298R0D RSMT23AP-8R350/8R350B RSMT23AP-448R0/448R0B RSMT23AP-448R0/448R0D RSMT23AP-18R90/18R90B RSMT23AP-178R0/178R0F RSMT23AP-8R660/8R660B RSMT23AP-8R660/8R660D RSMT23AP-8R980/8R980B RSMT23AP-98R80/98R80D RSMT23AP-38R80/38R80B RSMT23AP-8R980/8R980D RSMT23AP-8R660/8R660F RSMT23AP-178R0/178R0D RSMT23AP-18R90/18R90D
OCR Text ...iet ary ary ary ary ary gold or solder, palladium silver optional gold or solder, palladium silver optional gold or solder, palladium sil...bond pd silver bond pd silver bond pd silver bond pd silver bond pads pads pads pads pads gold bond ...
Description RESISTOR, NETWORK, FILM, DIVIDER, 0.25 W, SURFACE MOUNT CHIP

File Size 26.37K  /  1 Page

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    CLD-AP90

Cree, Inc
Part No. CLD-AP90
OCR Text ...below shows the recommended pcb solder pad layout for xlamp xb-d l eds. case temperature (t s ) measurement point xlamp xb-d l e d case temp...bond line. solder paste type cree strongly recommends using no clean solder pa...
Description Cree? XLamp? XB-D LEDs

File Size 928.07K  /  11 Page

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    Solidtron
Part No. SMCTTA20N20A10
OCR Text ...ed to the silicon using 302 o c solder. an epoxy underfill is applied to protect the high voltage termination from debris. all exterior...bond area of thinpak. typical performance curves (unless otherwise specified) typical performance c...
Description Power Management

File Size 145.02K  /  4 Page

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    Mini-Systems, Inc.
Part No. RSMT2AP-3R480D-T3 RSMT2AP-48R10B-T3 RSMT2AP-48R10D-T3 RSMT2AP-3R480B-T3
OCR Text ...ary ary ary palladium silver or solder, gold optional palladium silver or solder, gold optional palladium silver or solder, gold optional pa...bond pd silver bond pd silver bond pd silver bond pd silver bond pads pads pads pads pads gold bond ...
Description RESISTOR, THIN FILM, 0.25 W, 0.5 %, 150 ppm, 3.48 ohm, SURFACE MOUNT, 1206 CHIP, LEAD FREE
RESISTOR, THIN FILM, 0.25 W, 0.1 %, 150 ppm, 48.1 ohm, SURFACE MOUNT, 1206 CHIP, LEAD FREE
RESISTOR, THIN FILM, 0.25 W, 0.5 %, 150 ppm, 48.1 ohm, SURFACE MOUNT, 1206 CHIP, LEAD FREE
RESISTOR, THIN FILM, 0.25 W, 0.1 %, 150 ppm, 3.48 ohm, SURFACE MOUNT, 1206 CHIP, LEAD FREE

File Size 25.87K  /  1 Page

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    Rhopoint Components Ltd.
Rhopoint Components, Ltd.
Part No. SMH-B-100-5.0 SMH-B-20-1.0 SMH-B-20-5.0 SMH-B-22-5.0 SMH-B-25-0.5 SMH-B-10-0.5 SMH-B-33-1.0 SMH-B-10-5.0 SMH-B-33-5.0 SMH-B-5-2.0 SMH-B-100-1.0 SMH-B-100-2.0 SMH-B-25-1.0 SMH-B-25-5.0 SMH-B-10-2.0 SMH-B-100-0.5 SMH-B-20-0.5 SMH-B-25-2.0 SMH-B-33-2.0 SMH-B-10-1.0 SMH-B-20-2.0 SMH-B-5-0.5 SMH-B-22-1.0 SMH-B-22-2.0 SMH-B-33-0.5 SMH-B-R010-1.0 SMH-B-447-2.0 SMH-B-447-5.0 SMH-B-5-1.0 SMH-B-447-1.0 SMH-B-447-0.5 SMH-B-22-0.5 SMH-B-5-5.0 SMH-B-200-0.5 SMH-B-200-1.0 SMH-B-200-2.0 SMH-B-200-5.0
OCR Text ...30 sek oder 250 C / 5 min max. solder temperature up to 280 C / 30 sec or 250 C / 5 min Temperaturabhangigkeit des elektrischen Widersta...bond pad design SMH-B: Vorschlag fur die Gestaltung der Lot- und Bondpads SMH-B: proposal for sol...
Description Precision Resistors 精密电阻

File Size 125.47K  /  3 Page

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    C460EZ700-SXX000 C450EZ700-SXX000 CXXXEZ700-SXX000 C470EZ700-SXX000

Cree, Inc
Part No. C460EZ700-SXX000 C450EZ700-SXX000 CXXXEZ700-SXX000 C470EZ700-SXX000
OCR Text ...tachable with conductive epoxy, solder paste or solder preforms, in addition to using the flux eutectic method. These vertically structured,...Bond Structure 1000 V ESD Threshold Rating White LEDs Crosswalk Signals Backlighting Automotive ...
Description Cree? EZ700 LED

File Size 315.48K  /  6 Page

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    JAN1N5283-1

Microsemi Corporation
Part No. JAN1N5283-1
OCR Text ...ak voltage v wm 100 v solder pad temperature @ 10 s max. t sp 260 o c notes : 1. derate at 4 mw / c abo...bond ed symbols & definitions symbol definition i l limiting current : a specified ...
Description    CURRENT REGULATOR DIODES

File Size 192.16K  /  6 Page

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    C460EZ1000-SXX000 C470EZ1000-SXX000 C450EZ1000-SXX000 CXXXEZ1000-SXX000 C527EZ1000-SXX000

Cree, Inc
Part No. C460EZ1000-SXX000 C470EZ1000-SXX000 C450EZ1000-SXX000 CXXXEZ1000-SXX000 C527EZ1000-SXX000
OCR Text ...tachable with conductive epoxy, solder paste or solder preforms, as well as the flux eutectic method. These vertically structured, low forwa...Bond Pads (2) Subject to change without notice. www.cree.com Maximum Ratings at TA = 5C N...
Description Cree? EZ1000 LEDs

File Size 244.01K  /  6 Page

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For solder-bond Found Datasheets File :: 2135    Search Time::5.688ms    
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