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Solidtron
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Part No. |
SMCTTA65N14A10
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OCR Text |
...ed to the silicon using 302 o c solder. an epoxy underfill is applied to protect the high voltage termination from debris. all exterior...bond area anode bond area advanced pulse power device n- mos vcs, thinpak tm smct ta65n14a10
p... |
Description |
Power Management
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File Size |
208.69K /
5 Page |
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Download Datasheet
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Solidtron
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Part No. |
SMCTTA32N14A10
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OCR Text |
...ed to the silicon using 302 o c solder. an epoxy underfill is applied to protect the high voltage termination from debris. all exterior...bond area of thinpak. (see figure 7.) typical performance curves (unless otherwise specified) figur... |
Description |
Advanced Pulse Power Device N-MOS VCS
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File Size |
703.62K /
5 Page |
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it Online |
Download Datasheet
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Solidtron
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Part No. |
SMCTTA20N20A10
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OCR Text |
...ed to the silicon using 302 o c solder. an epoxy underfill is applied to protect the high voltage termination from debris. all exterior...bond area of thinpak. typical performance curves (unless otherwise specified) typical performance c... |
Description |
Power Management
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File Size |
145.02K /
4 Page |
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it Online |
Download Datasheet
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Mini-Systems, Inc.
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Part No. |
RSMT2AP-3R480D-T3 RSMT2AP-48R10B-T3 RSMT2AP-48R10D-T3 RSMT2AP-3R480B-T3
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OCR Text |
...ary ary ary palladium silver or solder, gold optional palladium silver or solder, gold optional palladium silver or solder, gold optional pa...bond pd silver bond pd silver bond pd silver bond pd silver bond pads pads pads pads pads gold bond ... |
Description |
RESISTOR, THIN FILM, 0.25 W, 0.5 %, 150 ppm, 3.48 ohm, SURFACE MOUNT, 1206 CHIP, LEAD FREE RESISTOR, THIN FILM, 0.25 W, 0.1 %, 150 ppm, 48.1 ohm, SURFACE MOUNT, 1206 CHIP, LEAD FREE RESISTOR, THIN FILM, 0.25 W, 0.5 %, 150 ppm, 48.1 ohm, SURFACE MOUNT, 1206 CHIP, LEAD FREE RESISTOR, THIN FILM, 0.25 W, 0.1 %, 150 ppm, 3.48 ohm, SURFACE MOUNT, 1206 CHIP, LEAD FREE
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File Size |
25.87K /
1 Page |
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it Online |
Download Datasheet
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Price and Availability
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