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				Motorola Mobility Holdings, Inc. MOTOROLA[Motorola, Inc]
Part No.	BCP56T1 BCP56T1SERIES
OCR Text	...vice. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress...
Description	MEDIUM POWER NPN SILICON HIGH CURRENT TRANSISTOR SURFACE MOUNT 中功率NPN硅高当前的晶体管表面贴装
File Size	200.38K / 6 Page	View it Online	Download Datasheet

				Motorola Inc MOTOROLA[Motorola, Inc]
Part No.	BCP68T1
OCR Text	...vice. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress...
Description	MEDIUM POWER NPN SILICON HIGH CURRENT TRANSISTOR SURFACE MOUNT
File Size	149.51K / 6 Page	View it Online	Download Datasheet

				Motorola, Inc. Motorola Inc ON Semi MOTOROLA[Motorola, Inc]
Part No.	DTC114TE DTC114TE_D ON0280
OCR Text	...vice. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress...
Description	CASE 463-01/ STYLE 1 SOT-416/SC-90 CASE 463-01, STYLE 1 SOT-416/SC-90 CASE 463-1, STYLE 1 SOT-16/SC-0 From old datasheet system
File Size	91.91K / 4 Page	View it Online	Download Datasheet

				Motorola Inc ON Semi MOTOROLA[Motorola, Inc]
Part No.	DTC114YE DTC114YE_D ON0281
OCR Text	...vice. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress...
Description	CASE 463-01/ STYLE 1 SOT-416/SC-90 CASE 463-01, STYLE 1 SOT-416/SC-90 CASE 463-1, STYLE 1 SOT-16/SC-0 From old datasheet system
File Size	144.99K / 6 Page	View it Online	Download Datasheet

				FILTRONIC[Filtronic Compound Semiconductors]
Part No.	LMA110B LMA110
OCR Text	... temperature shall be 230-240C, heated tool (150-160C) is recommended. Ultrasonic bonding is not recommended. 2.) The recommended die attach is Ablebond silver epoxy, the stabilize bake temperature is set at 150C for 45 minutes. 3.) Bond on...
Description	.5-8GHz MESFET Amplifier
File Size	105.87K / 4 Page	View it Online	Download Datasheet

				FILTRONIC[Filtronic Compound Semiconductors]
Part No.	LMA110 LMA110A
OCR Text	... temperature shall be 230-240C, heated tool (150-160C) is recommended. Ultrasonic bonding is not recommended. 2.) The recommended die attach is Ablebond silver epoxy, the stabilize bake temperature is set at 150C for 45 minutes. 3.) Bond on...
Description	.5-6 GHz MESFET Amplifier
File Size	80.46K / 3 Page	View it Online	Download Datasheet

				MOTOROLA INC MOTOROLA[Motorola, Inc]
Part No.	MBRS1100 MBRS1100T3
OCR Text	...vice. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress...
Description	Schottky Power Rectifier(Surface Mount Power Package)
File Size	74.10K / 4 Page	View it Online	Download Datasheet

				MOTOROLA[Motorola, Inc]
Part No.	MMBD6050LT1 ON2082
OCR Text	...vice. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress...
Description	From old datasheet system Switching Diode
File Size	76.02K / 4 Page	View it Online	Download Datasheet

				MOTOROLA[Motorola, Inc] ONSEMI[ON Semiconductor]
Part No.	MMBD770T1 MMBD110T1 MMBD330T1 MMDD110T1 ON2076 MMBD110T1-D
OCR Text	...vice. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress...
Description	From old datasheet system SCHOTTKY BARRLER DLODES Schottky Barrier Diodes
File Size	153.70K / 8 Page	View it Online	Download Datasheet

				MOTOROLA[Motorola, Inc]
Part No.	MMBF0201 MMBF0201N
OCR Text	...vice. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress...
Description	N-CHANNEL ENHANCEMENT-MODE TMOS MOSFET
File Size	178.83K / 6 Page	View it Online	Download Datasheet

For heated Found Datasheets File :: 1852 Search Time::1.735ms
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