| |
|
 |
Toshiba, Corp.
TOSHIBA[Toshiba Semiconductor]
|
| Part No. |
2SD2406 E001182
|
| Description |
NPN TRIPLE DIFFUSED TYPE (POWER AMPLIFIER APPLICATIONS) npn型三重扩散型（功率放大器应用
POWER AMPLIFIER APPLICATIONS
From old datasheet system
|
| File Size |
137.11K /
3 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
71600-118LF
|
| Description |
Quickie IDC Receptacle, Wire to Board connector -Double row - 18 Positions - 2.54 mm (0.1 in.)
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
68000-118HLF
|
| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 18 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
87900-118HLF
|
| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 18 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
68000-118
|
| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 18 Positions, 2.54 mm (0.100in) Pitch
|
| Tech specs |
|
|
|
Official Product Page
|
|
Bom2Buy.com
Price and Availability
|
|
|
JITONG
TECHNOLOGY
(CHINA HK & SZ)
Datasheet.hk's Sponsor |
| Part: 000-6181-37R |
| Maker: N/A |
| Pack: N/A |
| Stock: 300057 |
| Unit price
for : |
|
50: $2.07 |
|
100: $1.96 |
| 1000:
$1.86 |
|
Email: oulindz@gmail.com |
|
Contact us |
|
|
