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For grams Found Datasheets File :: 20930 Search Time::1.062ms
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				Pulse A Technitrol Company
Part No.	H2019 H2005A H2009 H1180 H2017 H2006A H2008 H1187 H2014 HX2019 H1197
OCR Text	... Weight . . . . . . . . . .0.6 grams Tape & Reel . . . . . . .500/reel Tube . . . . . . . . . . . . . .65/tube Dimensions: Inches mm Unless otherwise specified, all tolerances are .010 0,25 Weight . . . . . . . . . . 0.6 grams Ta...
Description	10/100BASE-TX VoIP Magnetics Modules
File Size	266.56K / 5 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC-ALH14007
OCR Text	...ly bonded with a force of 40-60 grams. DC bonds of 0.001" (0.025 mm) diameter, thermosonically bonded, are recommended. Ball bonds should be made with a force of 40-50 grams and wedge bonds at 18-22 grams. All bonds should be made with a no...
Description	GaAs HEMT MMIC LOW NOISE AMPLIFIER, 24 - 40 GHz
File Size	175.10K / 6 Page	View it Online	Download Datasheet

				MACOM[Tyco Electronics]
Part No.	JH-139PIN JHS-139PIN JHS-139 JH-139
OCR Text	...IGHT (APPROX.): 0.09 OUNCES 2.5 grams SF-1 All specifications apply with 50 ohm source and load impedance. Average of coupled outputs less 3 dB. This product contains elements protected by United States Patent Number 3,484,724. 0...
Description	Quadrature Hybrid 250 500 MHz Quadrature Hybrid 250 - 500 MHz
File Size	95.37K / 2 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC13507
OCR Text	...ly bonded with a force of 40-60 grams. DC bonds of 0.001" (0.025 mm) diameter, thermosonically bonded, are recommended. Ball bonds should be made with a force of 40-50 grams and wedge bonds at 18-22 grams. All bonds should be made with a no...
Description	GaAs MMIC BI-PHASE MODULATOR, 1.8 - 5.2 GHz
File Size	448.45K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC13607
OCR Text	...ly bonded with a force of 40-60 grams. DC bonds of 0.001" (0.025 mm) diameter, thermosonically bonded, are recommended. Ball bonds should be made with a force of 40-50 grams and wedge bonds at 18-22 grams. All bonds should be made with a no...
Description	GaAs MMIC BI-PHASE MODULATOR, 4 - 8 GHz
File Size	446.73K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC13707
OCR Text	...ly bonded with a force of 40-60 grams. DC bonds of 0.001" (0.025 mm) diameter, thermosonically bonded, are recommended. Ball bonds should be made with a force of 40-50 grams and wedge bonds at 18-22 grams. All bonds should be made with a no...
Description	GaAs MMIC BI-PHASE MODULATOR, 6 - 11 GHz
File Size	454.61K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC20307 HMC203
OCR Text	...ly bonded with a force of 40-60 grams. DC bonds of 0.001" (0.025 mm) diameter, thermosonically bonded, are recommended. Ball bonds should be made with a force of 40-50 grams and wedge bonds at 18-22 grams. All bonds should be made with a no...
Description	GaAs MMIC DOUBLE-BALANCED MIXER, 14 - 23 GHz
File Size	113.18K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC-XDH158
OCR Text	...ly bonded with a force of 40-60 grams. DC bonds of 0.001" (0.025 mm) diameter, thermosonically bonded, are recommended. Ball bonds should be made with a force of 40-50 grams and wedge bonds at 18-22 grams. All bonds should be made with a no...
Description	GaAs MMIC X4 ACTIVE FREQUENCY MULTIPLIER, 54 - 64 GHz OUTPUT
File Size	190.21K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC-MDB207
OCR Text	...ly bonded with a force of 40-60 grams. DC bonds of 0.001" (0.025 mm) diameter, thermosonically bonded, are recommended. Ball bonds should be made with a force of 40-50 grams and wedge bonds at 18-22 grams. All bonds should be made with a no...
Description	GaAs MMIC I/Q MIXER 55 - 64 GHz
File Size	237.64K / 8 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC-XDB112
OCR Text	...ly bonded with a force of 40-60 grams. DC bonds of 0.001" (0.025 mm) diameter, thermosonically bonded, are recommended. Ball bonds should be made with a force of 40-50 grams and wedge bonds at 18-22 grams. All bonds should be made with a no...
Description	GaAs MMIC PASSIVE FREQUENCY DOUBLER, 10 - 15 GHz INPUT
File Size	154.20K / 6 Page	View it Online	Download Datasheet

For grams Found Datasheets File :: 20930 Search Time::1.062ms
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