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Molex Electronics Ltd.
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| Part No. |
74029-8050 0740298050
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| Description |
2.00mm (.079) Pitch VHDM? Board-to-Board Backplane Receptacle Power Module, Vertical, 8-Row, 3 Circuits, gold (Au) Selective 1.27μm (50μ)
2.00mm (.079) Pitch VHDM庐 Board-to-Board Backplane Receptacle Power Module, Vertical, 8-Row, 3 Circuits, gold (Au) Selective 1.27渭m (50渭)
2.00mm (.079) Pitch VHDM垄莽 Board-to-Board Backplane Receptacle Power Module, Vertical, 8-Row, 3 Circuits, gold (Au) Selective 1.27楼矛m (50楼矛)
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| File Size |
141.91K /
3 Page |
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it Online |
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Molex, Inc.
MOLEX INC
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| Part No. |
08-52-0123 08-65-0816 08-65-0812 08-65-0801
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| Description |
Crimp Socket Contact; Wire Size (AWG):30-22; Contact Material:Phosphor Bronze RoHS Compliant: Yes PHOSPHOR BRONZE, TIN (100) FINISH, WIRE TERMINAL
Crimp Socket Contact; Wire Size (AWG):30-22; Contact Material:Phosphor Bronze; Contact Plating:gold PHOSPHOR BRONZE, gold (15) OVER NICKEL FINISH, WIRE TERMINAL
KK 100 Crp Term Std 22-30 Awg Sgold PHOSPHOR BRONZE, gold (30) OVER NICKEL FINISH, WIRE TERMINAL
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| File Size |
157.82K /
2 Page |
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it Online |
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Molex Electronics Ltd.
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| Part No. |
70280-0068 A-70280-0068 0010897562 010-89-7562
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| Description |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, High Temperature, 56 Circuits, 0.38μm (15μ) gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Dual Row, Vertical, High Temperature, 56 Circuits, 0.38渭m (15渭") gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid垄莽 Breakaway Header, Dual Row, Vertical, High Temperature, 56 Circuits, 0.38楼矛m (15楼矛") gold (Au) Selective Plating
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| File Size |
421.87K /
4 Page |
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it Online |
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Molex Electronics Ltd.
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| Part No. |
87911-5411 0879115411
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 54 Circuits, 0.38μm (15μ) gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, 54 Circuits, 0.38渭m (15渭) gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Right Angle, Through Hole, 54 Circuits, 0.38楼矛m (15楼矛) gold (Au) Selective Plating, Tube Packaging, Lead-free
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| File Size |
360.88K /
6 Page |
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it Online |
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Molex Electronics Ltd.
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| Part No. |
0016020116 16-02-0116 70021-0025
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| Description |
SL?/a> Crimp Terminal, Series 70021, Male, with 0.76μm (30μ) Selective gold (Au) Plated Contact, 22-24 AWG, Reel
SL Crimp Terminal, Series 70021, Male, with 0.76μm (30μ) Selective gold (Au) Plated Contact, 22-24 AWG, Reel
SL垄芒 Crimp Terminal, Series 70021, Male, with 0.76楼矛m (30楼矛) Selective gold (Au) Plated Contact, 22-24 AWG, Reel
MOLEX Connector
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| File Size |
82.78K /
3 Page |
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it Online |
Download Datasheet |
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Molex Electronics Ltd.
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| Part No. |
90814-3310 0908143310
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| Description |
1.27mm (.050) Pitch Picoflex? PF-50 Header, Vertical, Low Profile, Surface Mount, gold
1.27mm (.050") Pitch Picoflex庐 PF-50 Header, Vertical, Low Profile, Surface Mount, gold
1.27mm (.050") Pitch Picoflex垄莽 PF-50 Header, Vertical, Low Profile, Surface Mount, gold
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| File Size |
236.94K /
4 Page |
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it Online |
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Harwin PLC
HARWIN INC
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| Part No. |
M52-5110945 111245
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| Description |
1.27mm Pitch DIL Vertical PC Tail Socket Assembly, 8.5mm height, gold, 9 9-way 18 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER, SOCKET
1.27mm Pitch DIL Vertical PC Tail Socket Assembly, 8.5mm height, gold, 12 12-way
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| File Size |
68.19K /
1 Page |
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it Online |
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Price and Availability
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