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For bond Found Datasheets File :: 7535 Search Time::0.813ms
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				MOTOROLA INC
Part No.	MPX2100A
OCR Text	... silicone gel die coat wire bond lead frame differential/gauge die stainless steel metal cover epoxy case differential/gauge element die bond silicone gel die coat wire bond lead frame absolute die stainless steel metal cover epoxy ...
Description	ABSOLUTE, PEIZORESISTIVE PRESSURE SENSOR, 0-14.5Psi, 1%, 0-40mV, ROUND, THROUGH HOLE MOUNT
File Size	61.52K / 4 Page	View it Online	Download Datasheet

				Cree, Inc
Part No.	C527RT320-0303 C460RT320-0305 C470RT320-0301 C527RT320-0301 C470RT320-0304 C527RT320-0304 C527RT320-0306 C470RT320-0308 C527RT320-0302 C470RT320-0305 C470RT320-0303 C527RT320-0305 C460RT320-0306 C460RT320-0307 C460RT320-0308 C470RT320-0309 C527RT320-0309 C470RT320-0310 C470RT320-0306 C470RT320-0302 C470RT320-0307 C460RT320-0309 C460RT320-0311 C527RT320-0307 C527RT320-0308 C460RT320-0310 C470RT320-0312 C460RT320-0313 CXXXRT320-SXXXX
OCR Text	... 527 nm - 6 mw min. single wire bond structure class 2 esd rating ? ? C ? C C C ? ? applications lcd backlighting units mobile appliances digital still cameras monitors cellular phone lcd backlighting digital camera flash for mobile applian...
Description	Reduced Forward Voltage 3.1 V Typical at 20 mA
File Size	287.64K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC26509
OCR Text	... thickness is .004. 3. typical bond pad is .004 square. 4. bond pad spacing center to center is .006. 5. backside metallization: gold. 6. bond pad metallization: gold. 7. backside metal is ground. 8. connection not required for unlabe...
Description	GaAs MMIC SUB-HARMONICALLY PUMPED DOWNCONVERTER, 20 - 32 GHz
File Size	261.27K / 6 Page	View it Online	Download Datasheet

				MIMIX BROADBAND INC
Part No.	XU1002-BD-000V
OCR Text	...80) units: millimeters (inches) bond pad dimensions are shown to center of bond pad. thickness: 0.110 +/- 0.013 (0.0043 +/- 0.0004), backside is ground, bond pad/backside metallization: gold all dc/if bond pads are 0.100 x 0.100 (0.004 x 0...
Description	RF/MICROWAVE UP CONVERTER
File Size	233.55K / 8 Page	View it Online	Download Datasheet

				MIMIX BROADBAND INC
Part No.	XS1001-BD-000V
OCR Text	...11) units: millimeters (inches) bond pad dimensions are shown to center of bond pad. thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), backside is ground, bond pad/backside metallization: gold all bond pads are 0.100 x 0.100 (0.004 x 0.004). ...
Description	2500 MHz - 4000 MHz, 0 deg - 360 deg RF/MICROWAVE DIGITALLY CONTROLLED PH SHFTR
File Size	880.54K / 6 Page	View it Online	Download Datasheet

				MIMIX BROADBAND INC
Part No.	XP1006-BD-00V
OCR Text	...66) units: millimeters (inches) bond pad dimensions are shown to center of bond pad. thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), backside is ground, bond pad/backside metallization: gold bond pad centers are approximately 0.109 (0.004) ...
Description	8500 MHz - 11000 MHz RF/MICROWAVE WIDE BAND HIGH POWER AMPLIFIER
File Size	365.15K / 8 Page	View it Online	Download Datasheet

				MIMIX BROADBAND INC
Part No.	XP1006-BD-000V
OCR Text	...66) units: millimeters (inches) bond pad dimensions are shown to center of bond pad. thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), backside is ground, bond pad/backside metallization: gold bond pad centers are approximately 0.109 (0.004) ...
Description	8500 MHz - 11000 MHz RF/MICROWAVE WIDE BAND HIGH POWER AMPLIFIER
File Size	952.82K / 8 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation Hittite Microwave Corpo...
Part No.	HMC55409
OCR Text	...the para- sitic effects of wire bond assembly. connections were made with a 1 mil wire bond with minimal length (<12 mil). electrical specifi cations, t a = +25 c, if= 100 mhz, lo= +13 dbm* parameter min. typ. max. min. typ. max. units...
Description	GaAs MMIC FUNDAMENTAL MIXER, 11 - 20 GHz
File Size	225.93K / 6 Page	View it Online	Download Datasheet

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