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  68602-XXXH Datasheet PDF File

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    TAP226K050CCS TAP684035 TAP684050 TAP685006 TAP685010 TAP685016 TAP685020 TAP685025 TAP685035 TAP685050 TAP224050 TAP224

AVX Corporation
Part No. TAP226K050CCS TAP684035 TAP684050 TAP685006 TAP685010 TAP685016 TAP685020 TAP685025 TAP685035 TAP685050 TAP224050 TAP224035 TAP335010 TAP335016 TAP106M016SCS TAP106006 TAP106010 TAP106016 TAP106020 TAP106025 TAP106035 TAP106050 TAP106M016CCS TAP227006 TAP227010 TAP227016 TAP475020 TAP475025 TAP155020 TAP105035 TAP105025 TAP105050 TAP105M035SRW TAP105020 TAP475035 TAP475016 TAP475006 TAP474035 TAP475010 TAP474050 TAP337010 TAP154035 TAP154050 TAP335050 TAP104035 TAP157006 TAP157010 TAP226016 TAP226010 TAP226006 TAP335006 TAP225020 TAP225016 TAP225010 TAP476010 TAP476006 TAP686016 TAP686006 TAP476016 TAP336010 TAP336016 TAP336006 TAP107006 TAP107010 TAP107016 TAP686010 TAP337006 TAP334035 TAP334050 TAP156010 TAP156006 TAP156016 TAP155025 TAP155016 TAP107020 TAP226025 TAP226035 TAP226020 TAP155050 TAP155035 TAP475050 TAP335035 TAP335025 TAP476025 TAP476035 TAP476020 TAP686020 TAP225035 TAP225025 TAP225050
Description Sectiom 3: Introduction Foreword
Section 3: Introduction Foreword
   Sectiom 3: Introduction Foreword
   Section 3: Introduction Foreword

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Amphenol Communications Solutions

Part No. 68602-110HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 10 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    M38822F6-XXXHP M38822G1-XXXHP M38822M9-XXXHP M38829M4-XXXHP M38828G2-XXXHP M38829F5-XXXHP M38826MA-XXXHP M38826MD-XXXHP

Renesas Electronics Corporation
Part No. M38822F6-XXXHP M38822G1-XXXHP M38822M9-XXXHP M38829M4-XXXHP M38828G2-XXXHP M38829F5-XXXHP M38826MA-XXXHP M38826MD-XXXHP M38827F9-XXXHP M38829M7-XXXHP M38826M7-XXXHP M38827F8-XXXHP M38827F4-XXXHP M38823G5-XXXHP M38827FF-XXXHP M38824M8-XXXHP M38827GB-XXXHP M38823GD-XXXHP M38828GF-XXXHP M38827M9-XXXHP M38829M9-XXXHP M38827F6-XXXHP M38826M8-XXXHP M38827F7-XXXHP M38829F2-XXXHP M38823ME-XXXHP M38829G8-XXXHP M38826F9-XXXHP M38829F1-XXXHP M38829F4-XXXHP M38829G4-XXXHP M38826G4-XXXHP M38828G1-XXXHP M38826F5-XXXHP M38824F6-XXXHP M38821F2-XXXHP M38828G5-XXXHP M38822F2-XXXHP M38829MB-XXXHP M38823F9-XXXHP M38827G7-XXXHP M38828F3-XXXHP M38829M1-XXXHP M38823M9-XXXHP M38828M7-XXXHP M38826F7-XXXHP M38825G8-XXXHP M38827GA-XXXHP M38825F8-XXXHP M38822M4-XXXHP M38821GD-XXXHP M38822F8-XXXHP M38829M3-XXXHP M38822G4-XXXHP M38827M4-XXXHP M38825G9-XXXHP M38825G6-XXXHP M38824G9-XXXHP M38822G6-XXXHP M38823G4-XXXHP M38822M6-XXXHP M38829F8-XXXHP M38827M2-XXXHP M38825GA-XXXHP M38829F3-XXXHP M38829F6-XXXHP M38829F7-XXXHP M38829F9-XXXHP M38829FA-XXXHP M38829FB-XXXHP M38829FC-XXXHP M38829FD-XXXHP M38829FE-XXXHP M38829FF-XXXHP M38829G1-XXXHP M38829G2-XXXHP M38829G3-XXXHP M38829G5-XXXHP M38829G6-XXXHP M38829G7-XXXHP
Description SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER

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Amphenol Communications Solutions

Part No. 68602-210HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 10 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    Renesas Electronics Corporation.
Renesas Electronics, Corp.
Part No. M38230G4-XXXFP M38230G4-XXXHP M38231G4-XXXHP M38232G4-XXXFP M38232G4-XXXHP M38233G4-XXXFP M38233G4-XXXHP M38234G4-XXXFP M38234G4-XXXHP M38235G4-XXXFP M38230G6-XXXFP M38230G6-XXXHP M38231G6-XXXFP M38231G6-XXXHP M38232G6-XXXFP M38232G6-XXXHP M38233G6-XXXFP M38233G6-XXXHP M38234G6-XXXFP M38234G6-XXXHP M38235G6-XXXFP M38235G6-XXXHP M38236G6-XXXHP M38237G6-XXXFP M38237G6-XXXHP M38238G6-XXXFP M38230G7-XXXFP M38230G7-XXXHP M38231G7-XXXFP M38231G7-XXXHP M38232G7-XXXFP M38232G7-XXXHP M38233G7-XXXFP M38233G7-XXXHP M38234G7-XXXFP M38234G7-XXXHP M38235G7-XXXFP M38235G7-XXXHP M38236G7-XXXFP M38236G7-XXXHP M38237G7-XXXFP M38237G7-XXXHP M38238G7-XXXFP M38238G7-XXXHP M38239G7-XXXFP M38239G7-XXXHP M38230G8-XXXFP M38230G8-XXXHP M38231G8-XXXFP M38231G8-XXXHP M38232G8-XXXFP M38232G8-XXXHP M38233G8-XXXFP M38233G8-XXXHP M38234G8-XXXFP M38234G8-XXXHP M38235G8-XXXFP M38235G8-XXXHP M38236G8-XXXFP M38236G8-XXXHP M38237G8-XXXFP M38237G8-XXXHP M38238G8-XXXFP M38238G8-XXXHP M38230GA-XXXFP M38230GA-XXXHP M38231GA-XXXFP M38231GA-XXXHP M38232GA-XXXFP M38232GA-XXXHP M38233GA-XXXFP M38233GA-XXXHP M38234GA-XXXFP M38234GA-XXXHP M38235GA-XXXFP M38235GA-XXXHP M38236GA-XXXFP M38236GA-XXXHP M38237GA-XXXFP M38237GA-XXXHP
Description 18-Mbit (512K x 36/1M x 18) Flow-Through SRAM; Architecture: Standard Sync, Flow-through; Density: 18 Mb; Organization: 512Kb x 36; Vcc (V): 3.1 to 3.6 V
36-Mbit QDR(TM)-II SRAM 4-Word Burst Architecture; Architecture: QDR-II, 4 Word Burst; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 1.7 to 1.9 V
36-Mbit DDR-II SRAM 2-Word Burst Architecture; Architecture: DDR-II CIO, 2 Word Burst; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 1.7 to 1.9 V
36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 2.4 to 2.6 V
72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 3.1 to 3.6 V
18-Mbit (512K x 36/1M x 18) Pipelined SRAM; Architecture: Standard Sync, Pipeline SCD; Density: 18 Mb; Organization: 1Mb x 18; Vcc (V): 3.1 to 3.6 V
36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 3.1 to 3.6 V
72-Mbit QDR(TM)-II SRAM 2-Word Burst Architecture; Architecture: QDR-II, 2 Word Burst; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 1.7 to 1.9 V
18-Mbit (512K x 36/1M x 18) Flow-Through SRAM; Architecture: Standard Sync, Flow-through; Density: 18 Mb; Organization: 1Mb x 18; Vcc (V): 3.1 to 3.6 V
36-Mbit QDR(TM)-II SRAM 2-Word Burst Architecture; Architecture: QDR-II, 2 Word Burst; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 1.7 to 1.9 V
36-Mbit (1M x 36/2 M x 18/512K x 72) Flow-Through SRAM with NoBL(TM) Architecture; Architecture: NoBL, Flow-through; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 3.1 to 3.6 V
72-Mbit(2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 72 Mb; Organization: 1Mb x 72; Vcc (V): 2.4 to 2.6 V
72-Mbit QDR(TM)-II SRAM 2-Word Burst Architecture; Architecture: QDR-II, 2 Word Burst; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 1.7 to 1.9 V
36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined Sync SRAM; Architecture: Standard Sync, Pipeline SCD; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 3.1 to 3.6 V
36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 3.1 to 3.6 V
36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 36 Mb; Organization: 512Kb x 72; Vcc (V): 3.1 to 3.6 V
72-Mbit DDR-II SRAM 2-Word Burst Architecture; Architecture: DDR-II CIO, 2 Word Burst; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 1.7 to 1.9 V
Sync SRAM; Architecture: QDR-II, 2 Word Burst; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 1.7 to 1.9 V
36-Mbit DDR-II SRAM 2-Word Burst Architecture; Architecture: DDR-II CIO, 2 Word Burst; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 1.7 to 1.9 V
72-Mbit(2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 2.4 to 2.6 V
72-Mbit(2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 2.4 to 2.6 V
72-Mbit QDR(TM)-II SRAM 4-Word Burst Architecture; Architecture: QDR-II, 4 Word Burst; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 1.7 to 1.9 V
72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 72 Mb; Organization: 1Mb x 72; Vcc (V): 3.1 to 3.6 V
72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined Sync SRAM; Architecture: Standard Sync, Pipeline SCD; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 2.4 to 2.6 V
72-Mbit QDR(TM)-II SRAM 4-Word Burst Architecture (2.5 Cycle Read Latency); Architecture: QDR-II , 4 Word Burst; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 1.7 to 1.9 V
72-Mbit DDR-II SRAM 2-Word Burst Architecture (2.0 Cycle Read Latency); Architecture: DDR-II CIO, 2 Word Burst; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 1.7 to 1.9 V
36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined Sync SRAM; Architecture: Standard Sync, Pipeline SCD; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 3.1 to 3.6 V 单芯位CMOS微机
72-Mbit DDR-II SRAM 2-Word Burst Architecture; Architecture: DDR-II CIO, 2 Word Burst; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 1.7 to 1.9 V 单芯位CMOS微机
18-Mbit (512K x 36/1M x 18) Flow-Through SRAM; Architecture: Standard Sync, Flow-through; Density: 18 Mb; Organization: 1Mb x 18; Vcc (V): 3.1 to 3.6 V 单芯位CMOS微机
SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER 单芯位CMOS微机
72-Mbit(2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 2.4 to 2.6 V 单芯位CMOS微机
72-Mbit(2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 2.4 to 2.6 V 单芯位CMOS微机
72-Mbit QDR(TM)-II SRAM 4-Word Burst Architecture; Architecture: QDR-II, 4 Word Burst; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 1.7 to 1.9 V 单芯位CMOS微机
72-Mbit QDR(TM)-II SRAM 2-Word Burst Architecture; Architecture: QDR-II, 2 Word Burst; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 1.7 to 1.9 V 单芯位CMOS微机
36-Mbit QDR(TM)-II SRAM 4-Word Burst Architecture; Architecture: QDR-II, 4 Word Burst; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 1.7 to 1.9 V 单芯位CMOS微机
SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER 单芯8位CMOS微机
Sync SRAM; Architecture: QDR-II, 2 Word Burst; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 1.7 to 1.9 V 单芯位CMOS微机
36-Mbit DDR-II SRAM 2-Word Burst Architecture; Architecture: DDR-II CIO, 2 Word Burst; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 1.7 to 1.9 V 单芯位CMOS微机
72-Mbit DDR-II SRAM 2-Word Burst Architecture; Architecture: DDR-II CIO, 2 Word Burst; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 1.7 to 1.9 V
36-Mbit QDR(TM)-II SRAM 2-Word Burst Architecture; Architecture: QDR-II, 2 Word Burst; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 1.7 to 1.9 V

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Amphenol Communications Solutions

Part No. 68602-432H
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 32 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    Mitsubishi Electric Corporation
Mitsubishi Electric, Corp.
Part No. M38000E1-XXXHP M38000E4-XXXHP M38000E2-XXXHP M38000E5-XXXHP M38005E1-XXXHP M38005E2-XXXHP M38005E3-XXXHP M38005E4-XXXHP M38005E5-XXXHP M38005E6-XXXHP M38005E7-XXXHP M38005E8-XXXHP M38005M1-XXXHP M38005M2-XXXHP M38005M3-XXXHP M38006E2-XXXSS M38006E4-XXXSP M38006E2-XXXSP M38006E1-XXXSS M38006E5-XXXSS M38006E5-XXXSP M38006E7-XXXSS M38006E6-XXXSP M38006E6-XXXSS M38006E3-XXXSS M38006E4-XXXSS M38006E7-XXXSP M38001S6-XXXSP M38001S6-XXXFS M38001S6-XXXSS M38001S6-XXXHP M38001S6-XXXFP M38001E2-XXXSP M38001E3-XXXSP M38001E4-XXXSP M38001E5-XXXSP M38001E7-XXXSP M38001E8-XXXSP M38001E1-XXXFP M38001E1-XXXFS M38001E1-XXXHP M38001E1-XXXSS M38001E2-XXXFS M38001E2-XXXHP M38002S6-XXXFP M38000S2-XXXFP M38002S8-XXXFP M38002S6-XXXHP M38002S8-XXXHP M38001S2-XXXFP M38002S2-XXXFP M38002S8-XXXSP M38000S2-XXXHP M38001S2-XXXHP M38000S2-XXXSP M38001S2-XXXSP M38002S2-XXXSP M38002S6-XXXSP M38002S2-XXXHP M38002E4-XXXSP M38002E1-XXXHP M38002E4-XXXSS M38002E4-XXXHP M38002E4-XXXFP M38002E3-XXXSS M38002E3-XXXHP M38002E3-XXXFS M38002E2-XXXSP M38002E3-XXXFP M38002E1-XXXSS M38002E1-XXXSP M38002E1-XXXFP M38002E1-XXXFS M38002E3-XXXSP M38002E2-XXXFS M38002E2-XXXHP M38002E5-XXXSP M38002E6-XXXSP M38002E7-XXXSP M38002E8-XXXSP
Description 8-BIT SINGLE-CHIP MICROCOMPUTER
PT06SE SERIES (MS3126) STRAIGHT PLUGS WITH ENVIRONMENTAL CRIMP, STRAIGHT BODY STYLE, CRIMP TERMINATION, 16 SHELL SIZE, 16-26 INSERT ARRANGEMENT, PLUG GENDER, 26 CONTACTS
JFET-Input High-Output-Drive Low-Power Decompensated Operational Amplifier 8-SOIC
Quad Low-Noise High-Speed Precision Operational Amplifier 14-PDIP
8-Bit 44.7 kSPS ADC Serial Out, Muxed Twin Ch. w/SE or Differential Option, 2 Ch. 8-SOIC
8-Bit 44.7 kSPS ADC Serial Out, Muxed Twin Ch. w/SE or Differential Option, 2 Ch. 8-PDIP
CONNECTOR ACCESSORY
4 channel 18 bit Transceiver 1 - 2.5 Gbps/Ch 289-BGA -40 to 85
Excalibur JFET-Input High-Output-Drive uPower Operational Amplifier 20-LCCC -55 to 125
4.25 Gbps Cable And PC Board Equalizer 16-QFN -40 to 85
Single Output LDO, 800mA, Fixed and Adj., Internal Current limit, Thermal Overload Protection 3-DDPAK/TO-263 0 to 125
8-Bit 37.9 kSPS ADC Serial Out, Ratiometric Op or Vcc Ref, TTL/MOS Input & Output Compatible, 8 Ch. 20-TSSOP 0 to 70
Single Output LDO, 800mA, Fixed and Adj., Internal Current limit, Thermal Overload Protection 8-SON -40 to 125
11.3Gb/s Cable and PC Board Equalizer 20-QFN -40 to 100
Single Output LDO, 800mA, Fixed(1.5V), Internal Current limit, Thermal Overload Protection 4-SOT-223 -40 to 125
Octal Gigabit Ethernet Transceiver 289-BGA 0 to 70
SMD Series PhotoTransistor, Surface Mount Plastic Package, Bulk Packaged
Replaced by TLK1201A : Gigabit Ethernet Transceiver With Half Rate Option 64-HVQFP 0 to 70
Replaced by TLK1201A : Gigabit Ethernet Transceiver With Half Rate Option 64-HVQFP -40 to 85
SMD Series PhotoDiodes, Surface-mount Package, Glass Lens
Single Output LDO, 800mA, Fixed and Adj., Internal Current limit, Thermal Overload Protection 8-SON 0 to 125
Single Output LDO, 800mA, Fixed(1.8V), Internal Current limit, Thermal Overload Protection 8-SON 0 to 125
Gigabit Ethernet Serdes for PON 64-HVQFP -40 to 85
RES-ARRAY 47K-OHM 4-ELEMENT 5% 0.125W CONCAVE THK-FILM
RES-ARRAY 43-OHM 4-ELEMENT 5% 0.063W CONVEX THK-FILM SMD-1206 TR-7-PA
Single Output LDO, 800mA, Fixed(1.8V), Internal Current limit, Thermal Overload Protection 4-SOT-223 -40 to 125
High Speed High Drive Precision Dual Operational Amplifier 8-CDIP -55 to 125
MAC7111 EXT BUS,16CH A/D
Replaced by TLK2201A : 1.0 to 1.6 Gbps Gigabit Ethernet Transceiver 64-HVQFP 0 to 70
PTSE 8C 8#20 PIN PLUG 8位单片机
1 watt dc-dc converters 1瓦的DC - DC转换
CONN HOUSING 14POS .100 SINGLE 8位单片机
16 Characters x 2 Lines, 5x7 Dot Matrix Character and Cursor 8位单片机
High Speed High Drive Precision Quad Operational Amplifier 14-CDIP -55 to 125 8位单片机
High Speed High Drive Precision Quad Operational Amplifier 20-LCCC -55 to 125 8位单片机
Excalibur Low-Noise High-Speed Precision Quad Operational Amplifier 14-PDIP 8位单片机
Single Output LDO, 800mA, Fixed and Adj., Internal Current limit, Thermal Overload Protection 4-SOT-223 -40 to 125 8位单片机
Quad Low-Noise High-Speed Precision Operational Amplifier 16-SOIC 8位单片机
Single Output LDO, 800mA, Fixed(1.8V), Internal Current limit, Thermal Overload Protection 4-SOT-223 0 to 125 8位单片机
Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT01; Number of Contacts:36; Connector Shell Size:22; Connecting Termination:Solder; Circular Shell Style:Cable Receptacle 8位单片机
Circular Connector; MIL SPEC:MIL-C-26482, Series I, Crimp; Body Material:Aluminum; Series:PT08; Number of Contacts:10; Connector Shell Size:12; Connecting Termination:Crimp; Circular Shell Style:Right Angle Plug
1.0 to 1.6 Gigabit Ethernet Transceiver 64-HVQFP 0 to 70

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Amphenol Communications Solutions

Part No. 68602-214HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 14 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    M3823AGF-XXXHP 3823 M38230G1-XXXFP M38230G1-XXXHP M38230G2-XXXFP M38230G2-XXXHP M38230G3-XXXFP M38230G3-XXXHP M38230G4-X

RENESAS[Renesas Electronics Corporation]
Part No. M3823AGF-XXXHP 3823 M38230G1-XXXFP M38230G1-XXXHP M38230G2-XXXFP M38230G2-XXXHP M38230G3-XXXFP M38230G3-XXXHP M38230G4-XXXFP M38230G4-XXXHP M38230G5-XXXFP M38230G5-XXXHP M38230G6-XXXFP M38230G6-XXXHP M38230G7-XXXFP M38230G7-XXXHP M38230G8-XXXFP M38230G8-XXXHP M38230G9-XXXFP M38230G9-XXXHP M38230GA-XXXFP M38230GA-XXXHP M38230GB-XXXFP M38230GB-XXXHP M38230GC-XXXFP M38230GC-XXXHP M38230GD-XXXFP M38230GD-XXXHP M38230GE-XXXFP M38230GE-XXXHP M38230GF-XXXFP M38230GF-XXXHP M38231G1-XXXFP M38231G1-XXXHP M38231G2-XXXFP M38231G2-XXXHP M38231G3-XXXFP M38231G3-XXXHP M38231G4-XXXFP M38231G4-XXXHP M38231G5-XXXFP M38231G5-XXXHP M38231G6-XXXFP M38231G6-XXXHP M38231G7-XXXFP M38231G7-XXXHP M38231G8-XXXFP M38231G8-XXXHP M38231G9-XXXFP M38231G9-XXXHP M38231GA-XXXFP M38231GA-XXXHP M38231GB-XXXFP M38231GB-XXXHP M38231GC-XXXFP M38231GC-XXXHP M38231GD-XXXFP M38231GD-XXXHP M38231GE-XXXFP M38231GE-XXXHP M38231GF-XXXFP M38231GF-XXXHP M38232G1-XXXFP M38232G1-XXXHP M38232G2-XXXFP M38232G2-XXXHP M38232G3-XXXFP M38232G3-XXXHP M38232G4-XXXFP M38232G4-XXXHP M38232G5-XXXFP M38232G5-XXXHP M38232G6-XXXFP M38232G6-XXXHP M38232G7-XXXFP M38232G7-XXXHP M38232G8-XXXFP M38232G8-XXXHP M38232G9-XXXFP M38232G9-XXXHP M38232GA-X
Description SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER

File Size 877.42K  /  76 Page

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Amphenol Communications Solutions

Part No. 68602-116HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 16 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    M38003E2-XXXHP M38002S7-XXXSS M38002S7-XXXFP M38002S7-XXXFS M38002S7-XXXHP M38002S7-XXXSP M38004S4-XXXSS M38004S4-XXXFP

Mitsubishi Electric Semiconductor
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Part No. M38003E2-XXXHP M38002S7-XXXSS M38002S7-XXXFP M38002S7-XXXFS M38002S7-XXXHP M38002S7-XXXSP M38004S4-XXXSS M38004S4-XXXFP M38004S4-XXXFS M38004S4-XXXHP M38004S4-XXXSP M38006S4-XXXFP M38006S4-XXXFS M38006S4-XXXHP M38001E7-XXXHP M38002S8-XXXSS M38002S8-XXXHP M38000S7-XXXFS M38000S7-XXXSS M38000S7-XXXHP M38002S8-XXXSP M38002S8-XXXFS M38000S7-XXXFP M38000S7-XXXSP M38002S8-XXXFP M38002S5-XXXSS M38002S5-XXXFP M38002S5-XXXFS M38002S5-XXXSP M38007S8-XXXSS M38007S8-XXXFP M38007S8-XXXFS M38007S8-XXXHP M38007S8-XXXSP M38000M4-XXXHP M38002E2-XXXHP M38003S7-XXXFP M38003S7-XXXFS M38003S7-XXXSP M38003S7-XXXHP M38003E1-XXXHP M38003S7-XXXSS M38004M3-XXXHP M38004S1-XXXSP M38004S1-XXXHP M38004S1-XXXFP M38004S1-XXXSS M38004S1-XXXFS M38001M3-XXXHP M38004M8-XXXHP M38002E2FP M38000S8-XXXFP M38000S8-XXXSP M38005M3-XXXHP M38000S8-XXXHP M38000S8-XXXFS M38000S8-XXXSS M38003S8-XXXHP M38003S1-XXXFP M38003S1-XXXSS M38003S8-XXXFP M38003S2-XXXFP M38003S2-XXXFS M38003S2-XXXSS M38003S1-XXXSP M38003S8-XXXFS M38003S8-XXXSP M38004E1-XXXHP M38003S1-XXXFS M38003S1-XXXHP M38003S2-XXXHP M38003S2-XXXSP M38003S8-XXXSS M38006E2-XXXHP M38007E1-XXXHP M38002E5-XXXHP M38002M2-XXXHP M38007M4-XXXHP M38003M6-XXXHP M38007E3-XXXHP M380
Description 8-BIT SINGLE-CHIP MICROCOMPUTER
   8-BIT SINGLE-CHIP MICROCOMPUTER

File Size 4,222.73K  /  173 Page

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Amphenol Communications Solutions

Part No. 68602-110
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 10 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    M38030MCL-XXXHP M38032MCL-XXXHP M38033MCL-XXXHP M38034MCL-XXXHP M38035MCL-XXXHP M38036MCL-XXXHP M38038F7-XXXHP M38038F7-

Renesas Electronics Corporation
Part No. M38030MCL-XXXHP M38032MCL-XXXHP M38033MCL-XXXHP M38034MCL-XXXHP M38035MCL-XXXHP M38036MCL-XXXHP M38038F7-XXXHP M38038F7-XXXSP M38038F7-XXXWG M38038F7L-XXXHP M38038F7L-XXXKP M38038F7L-XXXSP M38038F7L-XXXWG M38032F6-XXXHP M38032F6-XXXKP M38032F6-XXXSP M38032F6-XXXWG M38032M9-XXXHP M38032M9-XXXSP M38038F3-XXXHP M38038F3-XXXKP M38038F3-XXXSP M38038F3-XXXWG M38038F3L-XXXHP M38037MB-XXXHP M38030MF-XXXHP M38030MF-XXXKP M38030MF-XXXSP M38030MF-XXXWG M38032F3-XXXHP M38032F3-XXXKP M38032F3-XXXSP M38032F3-XXXWG M38032F3L-XXXHP M38032F3L-XXXKP M38031MCL-XXXHP M38036F9-XXXHP M38036F9-XXXKP M38036F9-XXXSP M38036F9-XXXWG M38032M9-XXXKP M38037F8-XXXHP M38037F8-XXXKP M38037F8-XXXSP M38037F8-XXXWG M38030MDL-XXXHP M38031MDL-XXXHP M38032MDL-XXXHP M38033MDL-XXXHP M38034MDL-XXXHP M38035MDL-XXXHP M38036MDL-XXXHP M38037MDL-XXXHP M38038MDL-XXXHP M38036F5-XXXHP M38036F5-XXXKP M38036F5-XXXSP M38036F5-XXXWG M38031MAL-XXXHP M38032F2-XXXHP M38032F2-XXXKP M38038F4-XXXHP M38038F4-XXXKP M38038F4-XXXSP M38038F4-XXXWG M38038F4L-XXXHP M38038F4L-XXXKP M38038F4L-XXXSP M38039MB-XXXHP M38039MB-XXXKP M38039MB-XXXSP M38033F9-XXXHP M38033F9-XXXKP M38033F9-XXXSP M38033F9-XXXWG M38030F7-XXXHP M38030F7-XXXKP M38030F7-XXXSP M38
Description SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER

File Size 1,571.85K  /  119 Page

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Amphenol Communications Solutions

Part No. 68602-128HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 28 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    M38K09FC-XXXFP M38K01F8-XXXFP M38K07MC-XXXFP M38K07MC-XXXHP M38K08M4-XXXFP M38K08M4-XXXHP M38K04ME-XXXFP M38K04ME-XXXHP

Renesas Electronics Corporation
http://
Part No. M38K09FC-XXXFP M38K01F8-XXXFP M38K07MC-XXXFP M38K07MC-XXXHP M38K08M4-XXXFP M38K08M4-XXXHP M38K04ME-XXXFP M38K04ME-XXXHP M38K06F1-XXXFP M38K06F1-XXXHP M38K06F2-XXXFP M38K06F2-XXXHP M38K06F3-XXXFP M38K06F3-XXXHP M38K06F4-XXXFP M38K06F4-XXXHP M38K06F6-XXXFP M38K06F6-XXXHP M38K02F9-XXXFP M38K02F9-XXXHP M38K03MD-XXXFP M38K03MD-XXXHP M38K07F7-XXXFP M38K07F7-XXXHP M38K05M1-XXXFP M38K08F5-XXXFP M38K08F5-XXXHP M38K01M3-XXXFP M38K01M3-XXXHP M38K03F1-XXXFP M38K03F1-XXXHP M38K07FE-XXXFP M38K07FE-XXXHP M38K00F6-XXXFP M38K00F6-XXXHP M38K04MF-XXXFP M38K03M5-XXXFP M38K05F5-XXXFP M38K09FB-XXXFP M38K09FB-XXXHP M38K05F4-XXXFP M38K05F4-XXXHP M38K04FC-XXXFP M38K04FC-XXXHP M38K02M1-XXXFP M38K02M1-XXXHP M38K02M2-XXXFP M38K02M2-XXXHP M38K02M3-XXXFP M38K02M3-XXXHP M38K02M4-XXXFP M38K02M5-XXXFP M38K02M5-XXXHP M38K08MF-XXXFP M38K08MF-XXXHP M38K06ME-XXXFP M38K00F4-XXXFP M38K00F4-XXXHP M38K08M3-XXXFP M38K08M3-XXXHP M38K06M3-XXXFP M38K06M3-XXXHP M38K00F2-XXXFP M38K00F2-XXXHP M38K00F3-XXXFP M38K00F3-XXXHP M38K00F5-XXXFP M38K00F5-XXXHP M38K02F5-XXXFP M38K02F5-XXXHP M38K02FA-XXXFP M38K02FA-XXXHP M38K01FF-XXXFP M38K01FF-XXXHP M38K05M6-XXXFP M38K00MD-XXXFP M38K07FC-XXXFP M38K07FC-XXXHP M38K02F4-XXXFP M38K02F4-XXXHP
Description SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER
   SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER

File Size 1,367.98K  /  133 Page

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Amphenol Communications Solutions

Part No. 68602-150HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 50 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    Mitsubishi Electric Corporation
Part No. M38002M4-128 M38004M8FS M38004M8-XXXFP M38004M8-XXXHP M38004M8-XXXSP M38004M8FP M38002M4-347FP M38002M2-308FP M38002M4-431SP M3800202-289SP M38002M2-272SP M38002M2-4DSP M38002M3-414SP M38002M4-D230FP M38000M1-XXXFP M38000M1-XXXHP M38000M1-XXXSP M38000M1-XXXSS M38001M1-XXXFP M38001M1-XXXHP M38001M1-XXXSP M38001M1-XXXSS M38002M1-XXXFP M38002M1-XXXHP M38002M1-XXXSP M38002M1-XXXSS M38003M1-XXXFP M38003M1-XXXHP M38003M1-XXXSP M38003M1-XXXSS M38002M2-284SP M38002M2-289SP M38002M2-400SP M38002M2-115PF M38000M2-XXXFP M38000M2-XXXFS M38000M2-XXXHP M38000M2-XXXSP M38000M3-XXXFP M38000M3-XXXFS M38000M3-XXXHP M38000M3-XXXSP M38001M3-XXXFP M38001M3-XXXFS M38001M3-XXXHP M38001M3-XXXSP M38001M3-XXXSS M38002M3-XXXFP M38002M3-XXXFS M38002M3-XXXHP M38002M3-XXXSP M38002M3-XXXSS M38003M3-XXXFS M38003M3-XXXHP M38003M3-XXXSP M38002M4-100FP M38002M4-356SP M38002M4-259SP M38000M5-XXXFP M38001M5-XXXSP M38001M5-XXXSS M38002M5-XXXSP M38002M5-XXXSS M38003M5-XXXSS M38000M6-XXXFP M38001M7-XXXHP M38003M7-XXXHP M38003M7-XXXSP M38004M7-XXXFP M38000E1-XXXFP M38000E1-XXXSP M38003E1-XXXFS M38001E1-XXXSP M38003E1-XXXFP M38003E1-XXXHP M38000E7-XXXFP M38000E7-XXXHP M38000E7-XXXSP M38000S7-XXXFP M38000S7-XXXFS M38000S7-X
Description 8-BIT SINGLE-CHIP MICROCOMPUTER
Single Chip 8-Bit CMOS Microcomputer

File Size 4,171.97K  /  173 Page

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Amphenol Communications Solutions

Part No. 68602-170HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 70 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    M38K20MCL-XXXFP M38K21MCL-XXXFP M38K22MCL-XXXFP M38K23MCL-XXXFP M38K24MCL-XXXFP M38K26MCL-XXXFP M38K27MCL-XXXFP M38K28MC

Renesas Electronics Corporation
Part No. M38K20MCL-XXXFP M38K21MCL-XXXFP M38K22MCL-XXXFP M38K23MCL-XXXFP M38K24MCL-XXXFP M38K26MCL-XXXFP M38K27MCL-XXXFP M38K28MCL-XXXFP M38K29MCL-XXXFP M38K29M4L-XXXFP M38K29M4L-XXXHP M38K25MCL-XXXFP M38K26MAL-XXXFP M38K26MAL-XXXHP M38K26MDL-XXXHP M38K27F9L-XXXFP M38K27F9L-XXXHP M38K29M7L-XXXFP M38K29M7L-XXXHP M38K26M7L-XXXFP M38K26M7L-XXXHP M38K27F8L-XXXFP M38K27F8L-XXXHP M38K27F4L-XXXFP M38K27F4L-XXXHP M38K27FFL-XXXFP M38K27FFL-XXXHP M38K27M9L-XXXFP M38K27M9L-XXXHP M38K29M9L-XXXFP M38K29M9L-XXXHP M38K27F6L-XXXFP M38K27F6L-XXXHP M38K26M8L-XXXFP M38K26M8L-XXXHP M38K27F7L-XXXFP M38K27F7L-XXXHP M38K26MDL-XXXFP M38K20MDL-XXXFP M38K21MDL-XXXFP M38K22MDL-XXXFP M38K23MDL-XXXFP M38K24MDL-XXXFP M38K25MDL-XXXFP M38K27MDL-XXXFP M38K28MDL-XXXFP M38K29MDL-XXXFP M38K20MAL-XXXFP M38K21MAL-XXXFP M38K22MAL-XXXFP M38K23MAL-XXXFP M38K24MAL-XXXFP M38K25MAL-XXXFP M38K27MAL-XXXFP M38K28MAL-XXXFP M38K29MAL-XXXFP M38K27M1L-XXXFP M38K27M1L-XXXHP M38K27M2L-XXXFP M38K27M2L-XXXHP M38K27M3L-XXXFP M38K27M3L-XXXHP M38K27M4L-XXXFP M38K27M4L-XXXHP M38K27M5L-XXXFP M38K27M5L-XXXHP M38K27M6L-XXXFP M38K27M6L-XXXHP M38K27M7L-XXXFP M38K27M7L-XXXHP M38K20MEL-XXXFP M38K21MEL-XXXFP M38K22MEL-XXXFP M38K23MEL-XXXFP M38K24MEL-XXXFP
Description SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER

File Size 1,385.77K  /  151 Page

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Amphenol Communications Solutions

Part No. 68602-224HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 24 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

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