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  solder-bond Datasheet PDF File

For solder-bond Found Datasheets File :: 2031    Search Time::3.219ms    
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    MPXHZ6250A MPXHZ6250A6T1 MPXHZ6250A6U MPXHZ6250AC6T1

Freescale Semiconductor, Inc
Part No. MPXHZ6250A MPXHZ6250A6T1 MPXHZ6250A6U MPXHZ6250AC6T1
OCR Text ...e correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boar...
Description High Temperature Accuracy Integrated Silicon Pressure Sensor

File Size 167.02K  /  11 Page

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    MPXV5010 MPXV5010G MPXV5010G6U MPXV5010GC6T1 MPXV5010GC6U MPXV5010GC7U MPVZ5010 MPX501009 MPX5010GS MPX5010 MPX5010GSX M

Freescale Semiconductor...
Freescale Semiconductor, Inc
Part No. MPXV5010 MPXV5010G MPXV5010G6U MPXV5010GC6T1 MPXV5010GC6U MPXV5010GC7U MPVZ5010 MPX501009 MPX5010GS MPX5010 MPX5010GSX MPX5010DP MPVZ5010G7U MPVZ5010G6T1 MZ5010GW
OCR Text ...e correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards wit...
Description    Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated

File Size 450.31K  /  23 Page

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    FREESCALE[Freescale Semiconductor, Inc]
Part No. MPXHZ6115AC6U MPXAZ6115A MPXAZ6115A6T1 MPXAZ6115A6U MPXAZ6115AC6T1 MPXAZ6115AC6U MPXAZ6115AP MPXAZ6115APT1 MPXHZ6115A MPXHZ6115A6T1 MPXHZ6115A6U MPXHZ6115AC6T1
OCR Text ...e correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boar...
Description Media Resistant and High Temperature Accuracy Integrated Silicon Pressure Sensor

File Size 342.54K  /  15 Page

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    MOTOROLA INC
Part No. MPX4250A
OCR Text ...e correct size to ensure proper solder connection inter- face between the board and the package. with the correct fottprint, the packages will self align when subjected to a solder reflow process. it is always recommended to design boards w...
Description ABSOLUTE, PEIZORESISTIVE PRESSURE SENSOR, 2.9-36.25Psi, 1.5%, 0.20-4.90V, ROUND, THROUGH HOLE MOUNT

File Size 74.64K  /  5 Page

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    Motorola
Part No. MPXHZ6115A
OCR Text ...e correct size to ensure proper solder connection interface between the board and the package. with the correct pad geometry, the packages will self-align when subjected to a solder reflow process. it is always recommended to fabricate ...
Description (MPXHZ6115A / MPXHA6115A) Media Resistant and High Temperature Accuracy Integrated Silicon Pressure Sensor

File Size 273.56K  /  12 Page

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    MPVZ5150 MPVZ515010

Freescale Semiconductor, Inc
Part No. MPVZ5150 MPVZ515010
OCR Text ...e correct size to ensure proper solder connection interface between the board and the package. with the correct footprint, the packages will se lf align when subjected to a solder reflow process. it is always recommended to design board...
Description Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated

File Size 109.97K  /  8 Page

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    Motorola
Part No. MPX4100A
OCR Text ...e correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards wit...
Description MPX4100A Integrated Silicon Pressure Sensor Manifold Absolute Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
From old datasheet system
Integrated Silicon Pressure Sensor for Manifold Absolute Pressure Applications

File Size 154.63K  /  10 Page

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    LTL2P3TBKL14-MS

Lite-On Technology Corporation
Part No. LTL2P3TBKL14-MS
OCR Text ...on /W Copper + Silver Plating / Solder CRITICAL POINT ( SC ) N/A N/A SC for Dice shear SC for Wire pull test & Bond shear N/A Part No. : LTL2P3TBKL14-MS BNS-OD-C131/A4 Page : 2 of 11 LITE-ON TECHNOLOGY CORPORATION ...
Description Property of Lite-On Only

File Size 405.21K  /  11 Page

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    Motorola Semiconductor Products Inc
Part No. MPX4100AS MPX4100AP
OCR Text ...e correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards wit...
Description Signal Conditioner, Other - Datasheet Reference
From old datasheet system

File Size 113.96K  /  10 Page

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    MPXV5050V

Freescale Semiconductor, Inc
Part No. MPXV5050V
OCR Text ...e correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boar...
Description High Temperature Accuracy Integrated Silicon Pressure Sensor

File Size 83.66K  /  8 Page

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For solder-bond Found Datasheets File :: 2031    Search Time::3.219ms    
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