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solder wire Datasheet PDF File

For solder wire Found Datasheets File :: 22660 Search Time::1.39ms
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				EPCOS
Part No.	B57964S0502J000 B57964S0502H000 B57964S0202H000 B57964S B57964S0103F000 B57964S0103H000 B57964S0103J000 B57964S0202F000 B57964S0202J000 B57964S0282F000 B57964S0282H000 B57964S0282J000 B57964S0502F000
OCR Text	...aused by the application of hot solder may produce fine cracks in the ceramic, resulting in changes in resistance. To prevent leaching of th...wire's diameter +2 mm from the solder joint on the thermistor body. During bending the wire must be ...
Description	NTC thermistors for temperature sensing and compensation
File Size	319.08K / 17 Page	View it Online	Download Datasheet

				EPCOS
Part No.	B57864S0502J040 B57864S0502H040 B57864S0202H040 B57864S0282H040 B57864S0202J040 B57864S0282J040 B57864S0103J040 B57864S0282F040 B57864S0103F040 B57864S0202F040 B57864S0103H040
OCR Text	...aused by the application of hot solder may produce fine cracks in the ceramic, resulting in changes in resistance. To prevent leaching of th...wire's diameter +2 mm from the solder joint on the thermistor body. During bending the wire must be ...
Description	NTC thermistors for temperature measurement
File Size	243.57K / 13 Page	View it Online	Download Datasheet

				KEC[KEC(Korea Electronics)]
Part No.	KPF801G03 KPF101G03 KPF102G03 KPF201G03 KPF401G03 KPF500G03 KPF601G03
OCR Text	...it on the heat sink first: then solder this unit to a printed circuit board after confirming that it is fully secured. (d) Do not directly solder the heat-radiating portion of a sensor to a printed circuit board. (e) In flow solder jobs, se...
Description	Semiconductor Pressure Sensor
File Size	517.41K / 4 Page	View it Online	Download Datasheet

				ABC Taiwan Electronics Corp
Part No.	SU30184R7YL SU3018150YL SU30182R0YL SU30183R0YL
OCR Text	...temp.-40----+105 eResistance to solder heat260.10 secs. AR-001A 200 150 70s ec max. 100 50 0 50 100 150 Time ( seconds )...wire-Component September 8, 2000 E174837 JUNG SHING wire CO LTD 231 CHUNG CHENG RD, SEC 3 JEN-...
Description	SHIELDED SMD SHIELDED SMD
File Size	119.85K / 7 Page	View it Online	Download Datasheet

				KEC[KEC(Korea Electronics)]
Part No.	KPF801G03A KPF101G03A KPF102G03A KPF201G03A KPF401G03A KPF500G03A KPF601G03A
OCR Text	...it on the heat sink first: then solder this unit to a printed circuit board after confirming that it is fully secured. (d) Do not directly solder the heat-radiating portion of a sensor to a printed circuit board. (e) In flow solder jobs, se...
Description	Semiconductor Pressure Sensor
File Size	517.62K / 4 Page	View it Online	Download Datasheet

				KEC[KEC(Korea Electronics)]
Part No.	KPF801G02 KPF101G02 KPF102G02 KPF201G02 KPF401G02 KPF500G02 KPF601G02
OCR Text	...it on the heat sink first: then solder this unit to a printed circuit board after confirming that it is fully secured. (d) Do not directly solder the heat-radiating portion of a sensor to a printed circuit board. (e) In flow solder jobs, se...
Description	Semiconductor Pressure Sensor
File Size	523.80K / 4 Page	View it Online	Download Datasheet

				SIPEX[Sipex Corporation]
Part No.	SP2526-1 SP2526-1NEB SP2526-2 SP2526-2NEB SP2526EB
OCR Text	...a pair of wires soldered to the solder pads marked provided "VIN" and "GND". It is good practice to not switch power on until power connecti...wire to VIN solder pad on component side of board and connect to external Power Supply positive. VIN...
Description	Evaluation Board Manual
File Size	118.03K / 8 Page	View it Online	Download Datasheet

				Yamaichi Electronics Co., Ltd.
Part No.	NHA068-MC03 NHA050-MC02 NHA050-MC03 NHA036-MC02 NHA036-MC03 NCP050-020-BF NCP050-030-BF NCP036-020-BF NCP036-030-BF NHA068-MC01 NHA050-MC01 NHA026-MC01
OCR Text	...ers Cross-Reference 90 / 180 solder Dip Types for SCSI-2 (NH Series) and Mini Delta Ribbon (NC Series) Dim. 7.40 = 90 solder Dip (NH S...wire Connection Type: 0 = IDC Contact Plating: B = Mating Face Contacts - Au (0.3m min.) over Ni F =...
Description	Metal Cover
File Size	150.54K / 5 Page	View it Online	Download Datasheet

				KEC Holdings KEC[KEC(Korea Electronics)]
Part No.	KPF801G02A KPF101G02A KPF102G02A KPF201G02A KPF401G02A KPF500G02A KPF601G02A
OCR Text	...it on the heat sink first: then solder this unit to a printed circuit board after confirming that it is fully secured. (d) Do not directly solder the heat-radiating portion of a sensor to a printed circuit board. (e) In flow solder jobs, se...
Description	Semiconductor Pressure Sensor
File Size	523.90K / 4 Page	View it Online	Download Datasheet

				KEC Holdings KEC[KEC(Korea Electronics)]
Part No.	KPF801G01 KPF101G01 KPF102G01 KPF201G01 KPF401G01 KPF500G01 KPF601G01
OCR Text	...it on the heat sink first: then solder this unit to a printed circuit board after confirming that it is fully secured. (d) Do not directly solder the heat-radiating portion of a sensor to a printed circuit board. (e) In flow solder jobs, se...
Description	Semiconductor Pressure Sensor
File Size	526.08K / 4 Page	View it Online	Download Datasheet

For solder wire Found Datasheets File :: 22660 Search Time::1.39ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |