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Micross Components
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| Part No. |
HMC204
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| OCR Text |
...[0.004], backside is ground 2. bond pads are 0.100 [0.004] square 3. bond pad spacing, ctr-ctr: 0.150 [0.006] 4. all dimension in inches [millimeters] 5. all tolerances are 0.025 [0.001] 6. bond pad metallization: gold 7. backside me... |
| Description |
Test Equipment
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| File Size |
826.00K /
9 Page |
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it Online |
Download Datasheet
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Micross Components
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| Part No. |
HMC203
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| OCR Text |
... 2. die thickness is .004. 3. bond pads are .004 square. 4. bond pad spacing center to center is .006. 5. backside metallization: gold. 6. bond pad metallization: gold. 7. backside metal is ground. 8. connection not required for unla... |
| Description |
Microwave Radio
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| File Size |
755.09K /
7 Page |
View
it Online |
Download Datasheet |
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MAXIM - Dallas Semiconductor
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| Part No. |
MAX24011E/DGR1
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| OCR Text |
...selected by using the rssi_dir bond. leaving this bond pad unconnected selects a current source, connecting this bond pad to ground selects a current sink. application diagrams the max24011 can be bonded in 5-pin (no rssi) or 6-pin (wit... |
| Description |
2.5Gbps Transimpedance Amplifier
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| File Size |
259.27K /
10 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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