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Amphenol Communications Solutions |
Part No. |
68690-130HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in)Pitch.
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Tech specs |
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Official Product Page
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![90130-1268 0901301268](Maker_logo/molex_electronics_ltd.GIF)
Molex Electronics Ltd.
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Part No. |
90130-1268 0901301268
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Description |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 68 Circuits, Black 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 68 Circuits, Black 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
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File Size |
578.23K /
7 Page |
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it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
92090-130LF
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Description |
Minitek® 2.00mm, Board to Board, PCB mounted Receptacle, Vertical, Surface Mount, Double Row, Top Entry, 30 Positions, 2.00mm (0.079in) Pitch..
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Tech specs |
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Official Product Page
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![90130-1254 0901301254](Maker_logo/molex_electronics_ltd.GIF)
Molex Electronics Ltd.
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Part No. |
90130-1254 0901301254
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Description |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 54 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 54 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
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File Size |
585.60K /
7 Page |
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it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
10065490-130TRLF
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Description |
Minitek® 2.00mm, Board To Board, Receptacle, Vertical, Surface Mount, Double Row, 30 Positions, 2.00mm (0.079in) Pitch.
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Tech specs |
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Official Product Page
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![90130-1244 0901301244](Maker_logo/molex_electronics_ltd.GIF)
Molex Electronics Ltd.
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Part No. |
90130-1244 0901301244
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Description |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 44 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 44 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
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File Size |
586.22K /
7 Page |
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it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
78290-130HLF
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Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
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Tech specs |
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Official Product Page
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![90130-1240 0901301240](Maker_logo/molex_electronics_ltd.GIF)
Molex Electronics Ltd.
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Part No. |
90130-1240 0901301240
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Description |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 40 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 40 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
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File Size |
586.12K /
7 Page |
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it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
L17H2990130
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Description |
Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (0.750in), 26/26 (Socket/Socket), Flash Gold, Bright Tin Shell, 4-40 Threaded Rear Insert, 4*Arrowhead Boardlock
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Tech specs |
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Official Product Page
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![90130-1238 0901301238](Maker_logo/molex_electronics_ltd.GIF)
Molex Electronics Ltd.
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Part No. |
90130-1238 0901301238
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Description |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 38 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 38 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
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File Size |
586.12K /
7 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
69190-130HLF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 30 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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![90130-1234 0901301234](Maker_logo/molex_electronics_ltd.GIF)
Molex Electronics Ltd.
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Part No. |
90130-1234 0901301234
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Description |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 34 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 34 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
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File Size |
586.12K /
7 Page |
View
it Online |
Download Datasheet
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Renesas Electronics Corporation |
Part No. |
2SK3326B-S17-AY
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Description |
Switching N-Channel Power Mosfet
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Tech specs |
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Official Product Page
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![90130-1230 0901301230](Maker_logo/molex_electronics_ltd.GIF)
Molex Electronics Ltd.
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Part No. |
90130-1230 0901301230
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Description |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 30 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 30 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
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File Size |
1,141.29K /
12 Page |
View
it Online |
Download Datasheet
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Renesas Electronics Corporation |
Part No. |
2SK3326-S17-AY
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Description |
Switching N Channel MOSFET
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Tech specs |
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Official Product Page
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![90130-1226 0901301226](Maker_logo/molex_electronics_ltd.GIF)
Molex Electronics Ltd.
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Part No. |
90130-1226 0901301226
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Description |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 26 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 26 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
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File Size |
586.12K /
7 Page |
View
it Online |
Download Datasheet
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Renesas Electronics Corporation |
Part No. |
D151TS3326ARP#H0
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Description |
ICs for SSCG Clock Generator 151TS Series
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Tech specs |
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Official Product Page
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![90130-1222 0901301222](Maker_logo/molex_electronics_ltd.GIF)
Molex Electronics Ltd.
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Part No. |
90130-1222 0901301222
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Description |
2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 22 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 22 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
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File Size |
586.12K /
7 Page |
View
it Online |
Download Datasheet
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Renesas Electronics Corporation |
Part No. |
2SK3326-AZ
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Description |
Switching N Channel MOSFET
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Tech specs |
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Official Product Page
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Bom2Buy.com
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Price and Availability
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