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Infineon
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| Part No. |
SIDC02D60SIC2SAWN SIDC02D60SIC2UNSAWN
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| OCR Text |
... suitable for epoxy and soft solder die bonding die bond electrically conductive glue or solder wire bond al, 250m reject ink dot size ? = 0.3 mm recommended storage environment store in original container, in dry nitrog... |
| Description |
Diodes - HV Chips - 600V, 6A die sawn
Diodes - HV Chips - 600V, 6A die unsawn
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| File Size |
66.32K /
4 Page |
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it Online |
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Infineon
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| Part No. |
SIDC01D60SIC2SAWN SIDC01D60SIC2UNSAWN
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| OCR Text |
... suitable for epoxy and soft solder die bonding die bond electrically conductive glue or solder wire bond al, 250m reject ink dot size ? = 0.3 mm recommended storage environment store in original container, in dry nitrog... |
| Description |
Diodes - HV Chips - 600V, 4A die sawn
Diodes - HV Chips - 600V, 4A die unsawn
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| File Size |
65.64K /
4 Page |
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it Online |
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Infineon
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| Part No. |
SIDC00D60SIC2SAWN SIDC00D60SIC2UNSAWN
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| OCR Text |
...m suitable for epoxy and soft solder die bonding die bond electrically conductive glue or solder wire bond al, 125m reject ink dot siz e ? 3 0.2 mm recommended storage environment store in original container, in dry ... |
| Description |
Diodes - HV Chips - 600V, 2A die sawn
Diodes - HV Chips - 600V, 2A die unsawn
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| File Size |
57.62K /
4 Page |
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it Online |
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Infineon
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| Part No. |
SIDC26D60C6
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| OCR Text |
...tem suitable for epoxy and soft solder die bonding electrically conductive glue or solder Al, 500m 0.65mm; max 1.2mm store in original cont...bond configuration)
Symbol VRRM IF I FSM IFRM Tj , Ts t g
Condition
Value 600
1)
Unit V... |
| Description |
Used for IGBT3
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| File Size |
59.78K /
4 Page |
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it Online |
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Infineon
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| Part No. |
SIDC30D60E6
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| OCR Text |
...m suitable for epoxy and soft solder die bonding die bond electrically conductive glue or solder wire bond al, 500m reject ink dot size ? 0.65mm ; max 1.2mm recommended storage environment store in original container, i... |
| Description |
Diodes - HV Chips - SIDC30D60E6,600V, 75A
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| File Size |
206.34K /
4 Page |
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it Online |
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Anadigics
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| Part No. |
ATA7601
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| OCR Text |
...tal and can be epoxy mounted or solder attached. A good thermally conductive, silver filled epoxy is recommended for epoxy mounting. If a so...bond force, time and ultrasonic power are all critical parameters and may require optimization to ac... |
| Description |
Transimpedance Amplifiers (TIAs)
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| File Size |
211.95K /
12 Page |
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it Online |
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Infineon
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| Part No. |
SIDC30D120H6
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| OCR Text |
...m suitable for epoxy and soft solder die bonding die bond electrically conductive glue or solder wire bond al, 500m reject ink dot size ? 0.65mm ; max 1.2mm recommended storage environment store in original container, i... |
| Description |
Diodes - HV Chips - SIDC30D120H6, 1200V, 50A
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| File Size |
206.32K /
4 Page |
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it Online |
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Price and Availability
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