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KA220 KBU1001 4CBTLV3 2M100Z FDMS86 MBR30100 TP8P08 025BSE
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For distributes Found Datasheets File :: 936    Search Time::1.219ms    
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    ASM5CVF857 ASM5CVF857-40QR ASM5CVF857-28TR ASM5CVF857-28TT ASM5CVF857-28VR ASM5CVF857-28VT ASM5CVF857-40QT ASM5CVF857-56

Alliance Semiconductor Corporation
Part No. ASM5CVF857 ASM5CVF857-40QR ASM5CVF857-28TR ASM5CVF857-28TT ASM5CVF857-28VR ASM5CVF857-28VT ASM5CVF857-40QT ASM5CVF857-56BR ASM5CVF857-56BT
OCR Text ...SSTVF16859 & ASM4SSTVF32852. distributes a differential clock input pair (CLK_INT, CLK_INC) to ten differential pairs of clock outputs (CLKT[0:9], CLKC[0:9]) and one differential pair feedback clock output (FB_OUT, FB_OUTC). The clock ou...
Description 60 MHz to 200 MHz, 2.5 V wide-range frequency clock driver
2.5V Wide-Range Frequency Clock Driver (60MHz - 200MHz)

File Size 219.39K  /  15 Page

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    MSD1819A-T1_D ON2377 MSD1819A-RT1 MSD1819A-RT3

ON Semiconductor
Part No. MSD1819A-T1_D ON2377 MSD1819A-RT1 MSD1819A-RT3
OCR Text ...l energy more efficiently, then distributes this energy to the components. Because of this effect, the main body of a component may be up to 30 degrees cooler than the adjacent solder joints. STEP 1 PREHEAT ZONE 1 "RAMP" 200C STEP 2 S...
Description General Purpose Amplifier Transistor NPN
From old datasheet system
NPN GENERAL PURPOSE AMPLIFIER TRANSISTORS SURFACE MOUNT

File Size 99.32K  /  6 Page

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    DAN222_D ON0274 DAN222

MOTOROLA INC
ON Semi
Motorola, Inc
Part No. DAN222_D ON0274 DAN222
OCR Text ...l energy more efficiently, then distributes this energy to the components. Because of this effect, the main body of a component may be up to 30 degrees cooler than the adjacent solder joints. STEP 1 PREHEAT ZONE 1 "RAMP" 200C STEP 2 S...
Description SOT-16/SC-0 PACKAGE COMMON CATHODE
From old datasheet system
SOT-416/SC-90 PACKAGE COMMON CATHODE DUAL SWITCHING DIODE SURFACE MOUNT

File Size 88.13K  /  6 Page

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    DAN222 ON0275 DAN222/D

ON Semiconductor
Part No. DAN222 ON0275 DAN222/D
OCR Text ...l energy more efficiently, then distributes this energy to the components. Because of this effect, the main body of a component may be up to 30 degrees cooler than the adjacent solder joints. STEP 1 PREHEAT ZONE 1 "RAMP" 200C STEP 2 S...
Description COMMON CATHODE DUAL SWITCHING DIODE
From old datasheet system
COMMON CATHODE SILICON DUAL SWITCHING DIODE

File Size 92.85K  /  8 Page

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    IDT[Integrated Device Technology]
Integrated Device Technology, Inc.
Part No. IDTCSP2510D IDTCSP2510DPG IDTCSP2510DPGI CSP2510D CSP2510DPG CSP2510DPG8 CSP2510DPGI8
OCR Text ...Synchronous DRAM Applications * distributes one clock input to one bank of ten outputs * Output enable bank control * External feedback (FBIN) pin is used to synchronize the outputs to the clock input signal * No external RC network require...
Description 3.3V PHASE-LOCK LOOP CLOCK DRIVER ZERO DELAY BUFFER 2510 SERIES, PLL BASED CLOCK DRIVER, 10 TRUE OUTPUT(S), 0 INVERTED OUTPUT(S), PDSO24

File Size 60.94K  /  9 Page

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    LATTICE[Lattice Semiconductor]
Part No. MACH445-12 MACH445-15 MACH445-15YC MACH445-12YC MACH445-20YC
OCR Text ...trix. The central switch matrix distributes these signals back to the PAL blocks in a very efficient manner that provides for high performance. The design software automatically configures the input and central switch matrices when fitting ...
Description High-Density EE CMOS Programmable Logic

File Size 206.54K  /  28 Page

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    MOTOROLA[Motorola, Inc]
MOTOROLA[Motorola Inc]
ONSEMI[ON Semiconductor]
Part No. MSC3130T1_D MSC3130T1 MSC3130 ON2375
OCR Text ...l energy more efficiently, then distributes this energy to the components. Because of this effect, the main body of a component may be up to 30 degrees cooler than the adjacent solder joints. STEP 1 PREHEAT ZONE 1 "RAMP" 200C STEP 2 S...
Description From old datasheet system
NPN RF Amplifier Transistors Surface Mount
NPN RF Amplifier Transistor Surface Mount
CASE 318D3, STYLE 1 SC9

File Size 105.36K  /  4 Page

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For distributes Found Datasheets File :: 936    Search Time::1.219ms    
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