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For boards vertical Found Datasheets File :: 576    Search Time::1.953ms    
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    ETC[ETC]
Part No. AN-24
OCR Text ...a layout for the tester circuit boards FUNCTIONAL DESCRIPTION The test set operates in one of three basic modes These are (1) Bias Current T...vertical deflection of an oscilloscope The device under test (cascaded with the integrator A7) is co...
Description A Simplified Test Set for Op Amp Characterization

File Size 402.73K  /  10 Page

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    Panasonic
Part No. AQ2A2-J-ZP3/28VDC AQ2A2-ZP3/28VDC AQ2AD1-3/28VDC
OCR Text ...h heat sink) SSR for compact PC boards with 10 A capacity that is two times greater than our previous model. It is suitable for longlife, hi...vertical types with SIL terminal arrangement and flat types are available. 1) The vertical type is a...
Description RELAY

File Size 394.70K  /  6 Page

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    Panasonic
Part No. AQ1 AQ10A2-ZT4/32VDC
OCR Text ...h heat sink) SSR for compact PC boards with 10 A capacity that is two times greater than our previous model. It is suitable for longlife, hi...vertical types with SIL terminal arrangement and flat types are available. 1) The vertical type is a...
Description RELAY

File Size 394.70K  /  6 Page

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    MPXV4006 MPXV4006DP MPXV4006GC6T1 MPXV4006GC6U MPXV4006GC7U MPVZ4006GW7U MPVZ4006G6T1

Freescale Semiconductor, Inc
Freescale Semiconductor...
Part No. MPXV4006 MPXV4006DP MPXV4006GC6T1 MPXV4006GC6U MPXV4006GC7U MPVZ4006GW7U MPVZ4006G6T1
OCR Text ...is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. 0.660 16.76 0.100 ...vertical SURFACES 5 TYPICAL DRAFT. INCHES MIN MAX 0.415 0.425 0.415 0.425 0.212 0.230 0.038 0.042 0....
Description Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated

File Size 393.27K  /  22 Page

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    DCMZXXXXXX197

ITT Industries
Part No. DCMZXXXXXX197
OCR Text ...r finishes) for printed circuit boards and backplanes in demanding applications. additional contact lengths, hardware and finish options ava...vertical standoffs, threaded inserts and pushfits/boardlocks ol2 contact length, other lengths ava...
Description D Subminature

File Size 2,185.06K  /  61 Page

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    LSN-T10-D12J

Murata Manufacturing Co., Ltd.
Part No. LSN-T10-D12J
OCR Text ... convection. If your new system boards call for three or more supply voltages, check out the economics of on-board 12V distributed power. If...vertical MOUNTING L SN - T / 10 - D12 N H J - C Output Configuration: L = Unipolar Nominal Outpu...
Description Single Adjustable Output, Non-isolated, 12Vin, 10A, SIP, DC/DC Converters

File Size 343.71K  /  12 Page

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    UPD16510 UPD16510GR-8JG

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NEC[NEC]
NEC Corp.
Part No. UPD16510 UPD16510GR-8JG
OCR Text ...autions need to be taken for PW boards with semiconductor devices on it. 2 HANDLING OF UNUSED INPUT PINS FOR CMOS Note: No connection for CMOS device inputs can be cause of malfunction. If no connection is provided to the input pins, it...
Description vertical DRIVER FOR CCD SENSOR

File Size 69.06K  /  16 Page

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    PESDXS2UQ PESD24VS2UQ

NXP Semiconductors
Part No. PESDXS2UQ PESD24VS2UQ
OCR Text ... For multilayer printed-circuit boards use ground vias. Rev. 03 - 11 September 2008 10 of 13 NXP Semiconductors Product specification Double ESD protection diodes in SOT663 package PACKAGE OUTLINE Plastic surface mounted pa...
Description Double ESD protection diodes in SOT663 package
   Double ESD protection diodes in SOT663 package

File Size 297.12K  /  13 Page

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    PESD5V2S2UT PESDXS2UT PESD15VS2UT PESD24VS2UT PESD3V3S2UT-215

NXP Semiconductors N.V.
Part No. PESD5V2S2UT PESDXS2UT PESD15VS2UT PESD24VS2UT PESD3V3S2UT-215
OCR Text ... For multilayer printed-circuit boards use ground vias. 2004 Apr 15 10 NXP Semiconductors Product data sheet Double ESD protection diodes in SOT23 package PACKAGE OUTLINE Plastic surface-mounted package; 3 leads PESDxS2U...
Description    Double ESD protection diodes in SOT23 package
Double ESD protection diodes in SOT23 package sot23封装的双静电保护二极

File Size 135.86K  /  13 Page

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    MZ5010G MZ5010GW

Freescale Semiconductor, Inc
Part No. MZ5010G MZ5010GW
OCR Text ...is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. 0.660 16.76 0.100 ...vertical SURFACES 5 TYPICAL DRAFT. INCHES MIN MAX 0.415 0.425 0.415 0.425 0.212 0.230 0.038 0.042 0....
Description Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated

File Size 372.35K  /  14 Page

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For boards vertical Found Datasheets File :: 576    Search Time::1.953ms    
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