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Amphenol Communications Solutions |
| Part No. |
75844-107-72LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 72 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
75844-342-10LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
75844-122-72LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 72 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
75844-340-10LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
75844-302-06LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 6 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
75844-112-56LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 56 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Maxim Integrated Products, Inc.
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| Part No. |
DS1820
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| Description |
1Wire Digital Thermometer(数字温度 DIGITAL TEMP SENSOR-SERIAL, 9BIT(s), 2Cel, ROUND, THROUGH HOLE MOUNT
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| File Size |
160.73K /
27 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
75844-194-20LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
75844-127-18LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 18 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Analog Devices, Inc.
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| Part No. |
AD1821
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| Description |
MODIO(Modem over Audio) SoundComm Host Signal Processing Codec(音频调制SoundComm型主信号处理编解码器)
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| File Size |
281.23K /
44 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
75844-118-10LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
75844-156-14LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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