solder-bond pdf Datasheet P12 Full Text Search --- IC-ON-LINE


	Part Number	Hot Search : NTE4970 H431CM RN2209 F102B SM6S10CA BUL213 66101F EMK13G2
	Product Description
	Full Text Search

solder-bond Datasheet PDF File

For solder-bond Found Datasheets File :: 2135 Search Time::13.829ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |

				INFINEON[Infineon Technologies AG]
Part No.	SIDC06D120H6 Q67050-A4150-A001
OCR Text	...tem suitable for epoxy and soft solder die bonding electrically conductive glue or solder Al, 500m 0.65mm ; max 1.2mm store in original con...bond configuration) Symbol VRRM IF I FSM I FRM Tj , Ts t g Condition Value 1200 7.5 Unit...
Description	Fast switching diode chip in EMCON-Technology
File Size	65.53K / 4 Page	View it Online	Download Datasheet

				INFINEON[Infineon Technologies AG]
Part No.	SIDC110D170H Q67050-A4179-A001
OCR Text	...tem suitable for epoxy and soft solder die bonding electrically conductive glue or solder Al, 500m 0.65mm; max 1.2mm store in original cont...bond configuration) Symbol VRRM IF I FSM I FRM Tj , Ts t g Condition Value 1700 200 Unit...
Description	200 A, 1700 V, SILICON, RECTIFIER DIODE Fast switching diode chip in EMCON 3 -Technology
File Size	62.58K / 4 Page	View it Online	Download Datasheet

				Hi-Sincerity Microelectronics HSMC[Hi-Sincerity Mocroelectronics]
Part No.	H06N60 TO-220AB TO-263 TO-220FP
OCR Text	...Drain 3.Source Material: * Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 DIM A B C D E F G H I J K L M N O P Min. 5.58 8.38...
Description	N-Channel Power Field Effect Transistor
File Size	70.68K / 6 Page	View it Online	Download Datasheet

				FREESCALE[Freescale Semiconductor, Inc]
Part No.	MPXV5004DP MPXV5004GVP MPXV5004G MPXV5004G6T1 MPXV5004G6U MPXV5004G7U MPXV5004GC6T1 MPXV5004GC6U MPXV5004GC7U MPXV5004GP
OCR Text	...e correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards wit...
Description	Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
File Size	249.95K / 12 Page	View it Online	Download Datasheet

				NICHIA CORPORATION ETC[ETC] List of Unclassifed Manufacturers
Part No.	NSPG320BS
OCR Text	...uld be paid during soldering. * Solder the LED no closer than 3mm from the base of the epoxy bulb. Soldering beyond the base of the tie bar ...bond failure or resin deterioration, will occur. Nichia's LEDs should not be soldered directly to do...
Description	From old datasheet system NICHIA GREEN LED
File Size	272.73K / 15 Page	View it Online	Download Datasheet

				INFINEON[Infineon Technologies AG]
Part No.	SIDC16D60SIC3
OCR Text	...tem suitable for epoxy and soft solder die bonding electrically conductive glue or solder Al, 125m 0.2 mm store in original container, in...bond configuration) Symbol VRRM V RSM IF I FSM I FRM I FMAX Tj , Ts t g Condition Value 600...
Description	Silicon Carbide Ultrafast Schottky Diode Chips Silicon Carbide Schottky Diode
File Size	53.71K / 4 Page	View it Online	Download Datasheet

				Anadigics Inc ANADIGICS, Inc
Part No.	ATA7603 ATA7603_REV_1.0 ATA7603D1
OCR Text	...to the substrate using epoxy or solder. A good thermally conductive, silver-filled epoxy is recommended for epoxy mounting. If solder is use...bond force, time, and ultrasonic power are all critical parameters and should be optimized to achiev...
Description	The ANADIGICS ATA7603 is a -5.2V high-speed transimpedance amplifier (TIA) designed for 10 Gb/s optical receiver applications available ... Transimpedance Amplifiers (TIAs) From old datasheet system 10 Gb/s High Overload TIA PRELIMINARY DATA SHEET - Rev 1.0
File Size	182.00K / 12 Page	View it Online	Download Datasheet

				NXP Semiconductors N.V. PHILIPS[Philips Semiconductors]
Part No.	PHB42N03LT
OCR Text	...of die Measured from drain lead solder point to centre of die Measured from source lead solder point to source bond pad REVERSE DIODE LIMITING VALUES AND CHARACTERISTICS Tj = 25C unless otherwise specified SYMBOL IDR IDRM VSD trr Qrr PA...
Description	TrenchMOS transistor Logic level FET 42 A, 30 V, 0.026 ohm, N-CHANNEL, Si, POWER, MOSFET
File Size	60.92K / 8 Page	View it Online	Download Datasheet

				PHILIPS[Philips Semiconductors] NXP Semiconductors
Part No.	PHT6NQ10T PHT6NQ10T_1
OCR Text	... Thermal resistance junction to solder point Thermal resistance junction to ambient CONDITIONS surface mounted, FR4 board surface mounted, F...bond pad VGS = 0 V; VDS = 25 V; f = 1 MHz REVERSE DIODE LIMITING VALUES AND CHARACTERISTICS Tj =...
Description	N-channel TrenchMOS(tm) transistor From old datasheet system N-channel TrenchMOS? transistor N-channel TrenchMOS transistor
File Size	74.21K / 7 Page	View it Online	Download Datasheet

				Infineon Technologies A... INFINEON[Infineon Technologies AG]
Part No.	SIDC05D60SIC3
OCR Text	...tem suitable for epoxy and soft solder die bonding electrically conductive glue or solder Al, 125m 0.2 mm store in original container, in...bond configuration) Symbol VRRM V RSM IF I FSM I FRM I FMAX Tj , Ts t g Condition Value 600...
Description	Silicon Carbide Schottky Diode
File Size	53.88K / 4 Page	View it Online	Download Datasheet

For solder-bond Found Datasheets File :: 2135 Search Time::13.829ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |