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MICROSEMI[Microsemi Corporation]
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| Part No. |
6509A
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| OCR Text |
... of integrated circuits such as highdensity packaging and improved reliability. This is a result of fewer pick and place operations, smaller footprint, smaller weight, and elimination of various discrete packages that may not be as user fri... |
| Description |
Isolated Diode Array with HiRel MQ, MX, MV, and SP Screening Options
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| File Size |
56.11K /
2 Page |
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ANALOGICTECH[Advanced Analogic Technologies]
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| Part No. |
AAT7361ITS-T1 AAT7361
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| OCR Text |
...ets. Using AnalogicTech's ultra-highdensity MOSFET process and space-saving, small-outline, J-lead package, performance superior to that normally found in a larger footprint has been squeezed into the footprint of a TSOPJW8 package.
AAT7... |
| Description |
20V P-Channel Power MOSFET
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| File Size |
138.84K /
6 Page |
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Advanced Analogic Technologies, Inc.
ANALOGICTECH[Advanced Analogic Technologies]
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| Part No. |
AAT7551IJS-T1 AAT7551
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| OCR Text |
...ets. Using AnalogicTech's ultra-highdensity MOSFET process and space-saving, small outline, J-lead package, performance superior to that normally found in a TSOP-6 footprint has been squeezed into the footprint of an SC70JW-8 package.
Fe... |
| Description |
20V P-Channel Power MOSFET 20VP沟道功率MOSFET
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| File Size |
96.26K /
6 Page |
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http://
ETC[ETC]
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| Part No. |
CM130
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| OCR Text |
...130 is ideal for application to highdensity circuit boards. As it incorporates a heat-resisting packaged cylinder-type crystal, it features highly stable characteristics-high enough to permit reflow soldering. Can be mounted automatically b... |
| Description |
CM130
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| File Size |
118.86K /
2 Page |
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ROHM[Rohm]
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| Part No. |
EDZ
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| OCR Text |
...mpact, 2-pin mini-mold type for highdensity mounting (EMD2). 2) Can be mounted automatically,using chip mounter. 3) High reliability.
1.20.05
1.60.1
0.30.05 0.80.05
0.120.05
0.60.1
Type No. and date of manufacture stamped... |
| Description |
Diodes > Zener Diodes (Include TVS) > 2Terminal (single) Zener Diodes
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| File Size |
54.13K /
2 Page |
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Samsung Electronic
SAMSUNG[Samsung semiconductor]
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| Part No. |
KM611001L KM611001
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| OCR Text |
...icularly well suited for use in highdensity high-speed system applications. The KM611001/L is packaged in a 400 mil 28-pin plastic DIP or SOJ.
FUNCTIONAL BLOCK DIAGRAM
Clk Gen. Pre-Charge Circuit
PIN CONFIGURATION(TOP VIEW)
A0 A1 A2... |
| Description |
1M x 1Bit High-Speed CMOS SRAM
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| File Size |
95.60K /
8 Page |
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SHARP[Sharp Electrionic Components]
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| Part No. |
LH28F400SU-LC
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| OCR Text |
...-LC is the most cost-effective, highdensity 3.3 V flash memory.
A Command User Interface (CUI) serves as the system interface between the microprocessor or microcontroller and the internal memory operation. Internal Algorithm Automation ... |
| Description |
4M (512K 】 8, 256K 】 16) Flash Memory
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| File Size |
296.28K /
37 Page |
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PANASONIC[Panasonic Semiconductor]
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| Part No. |
MA4S159
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| OCR Text |
...tained in one package, allowing highdensity mounting * Flat lead type, resulting in improved mounting efficiency and solderability with the high-speed mounting machine * Short reverse recovery time trr * Small terminal capacitance, Ct
2.... |
| Description |
Silicon epitaxial planar type
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| File Size |
46.29K /
2 Page |
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Price and Availability
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